# RF / Pin Diode, Single, 0.8 ohm, 80 V, TSLP-2-19, 2 Pin, 0.25 pF

![Product image](https://novapart.co/image/farnell:2725720RL/)

**URL**: https://novapart.co/products/BAR9002ELE6327XTMA1/rf-pin-diode-single-08-ohm-80-v-tslp-2-19-025-pf
**SKU**: BAR9002ELE6327XTMA1
**Manufacturer**: INFINEON
**Category**: Semiconductors - Discretes || Diodes & Rectifiers || RF / Pin Diodes
**Price**: €0.0470
**Stock**: 1000+
**Lead Time**: 99 days (indicative)

## Description

Diode Configuration:Single; Resistance @ If:0.8ohm; Breakdown Voltage Vbr:80V; Diode Case Style:TSLP-2-19; No. of Pins:2 Pin; Total Capacitance Ct:0.25pF; Forward Current If(AV):100mA; Operati

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2 Pin |
| Product Range | BAR90 |
| Diode Mounting | Surface Mount |
| Forward Current | 100mA |
| Forward Voltage | 1V |
| Resistance @ If | 0.8ohm |
| Reverse Voltage | 80V |
| Diode Case Style | TSLP-2-19 |
| Diode Capacitance | 0.25pF |
| Power Dissipation | 250mW |
| Diode Configuration | Single |
| Operating Temperature Max | 125°C |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:2725720RL/)

## **BAR90-02EL** 

## **Single silicon RF PIN diode** 

## sero QS, QB ssn QB sre 

## **Product description** 

This Infineon RF PIN diode provides high-voltage handling capabilities and comes with low loss and low distortion levels. Its low forward resistance, low capacitance and low inductance simplify design and support designers in creating smaller and lighter end-solutions. 

## **Feature list** 

- Very low capacitance _C_ = 0.23 pF (typical) at voltage _V_ R = 0 V and frequency _f_ = 1 GHz 

- Low forward resistance _R_ F = 1.6 Ω (typical) at _I_ F = 3 mA and frequency _f_ = 100 MHz 

- Balanced ON / OFF harmonic distortion 

- TSLP-2-19 package (1 mm x 0.6 mm x 0.31 mm) with a 0402 foot print 

- Pb-free, RoHS compliant and halogen-free 

## **Product validation** 

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22. 

## **Potential applications** 

Optimized for low bias current RF and high-speed interface switches in: 

- Set-top boxes, digital media players 

- Laptops and desktop PCs 

## **Device information** 

**Table 1 Part information Product name / Ordering code Package Pin configuration Marking Pieces / Reel** ~~oo~~ BAR90-02EL / BAR9002ELE6327XTMA1 TSLP-2-19 Single, leadless X 15 k 

_**Attention** :_ _**ESD (Electrostatic discharge) sensitive device, observe handling precautions!**_ 

Please read the Important Notice and Warnings at the end of this document 

Datasheet **www.infineon.com** 

v1.0 2018-06-30 

**BAR90-02EL Single silicon RF PIN diode** 

**Table of contents** 

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## **Table of contents** 

||**Product description**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
|---|---|
||**Feature list**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Product validation**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Potential applications**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Device information**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1|
||**Table of contents**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**1**|**Absolute maximum ratings**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2|
|**2**|**Electrical performance in test fixture**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
|2.1|DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
|2.2|AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4|
|**3**|**Thermal characteristics**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8|
|**4**|**Package information TSLP-2-19**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
|**5**|**References**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
||**Revision history**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
||**Disclaimer**. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|



## **1 Absolute maximum ratings** 

**Table 2 Absolute maximum ratings at** _**T**_ **A = 25 °C, unless otherwise specified** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Unit**|**Note or test condition**|
|---|---|---|---|---|---|
|||**Min.**|**Max.**|||
|Diode reverse voltage|_V_R|–|80|V||
|Forward current|_I_F|–|100|mA||
|Total power dissipation|_P_TOT|–|250|mW|_T_S≤ 133 °C**_1)_**|
|Junction temperature|_T_J|–|150|°C||
|Operating temperature|_T_OP|-55|125|||
|Storage temperature|_T_STG|-55|150|||



_**Attention** :_ _**Stresses above the maximum values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Exceeding only one of these values may cause irreversible damage to the component.**_ 

> 1 _T_ S is the soldering point temperature. 

Datasheet 

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## **Electrical performance in test fixture** 

## **2 Electrical performance in test fixture** 

## **2.1 DC characteristics** 

At _T_ A = 25 °C, unless otherwise specified 

## **DC characteristics** 

||||||||
|---|---|---|---|---|---|---|
|**Table 3**<br>**DC characteristics**|||||||
|**Parameter**|**Symbol**|**Values**<br>**Min.**<br>**Typ.**<br>**Max.**|||**Unit**|**Note or test condition**|
||||**Typ.**|**Max.**|||
|Breakdown voltage|_V_BR|80|–|–|V|_I_BR= 5 µA|
|Reverse current|_I_R|–|–|50|nA|_V_R= 60 V|
|Forward voltage|_V_F|0.75<br>0.82|0.79|0.87|V|_I_F= 3 mA|
||||0.91|1||_I_F= 100 mA|
|I-region width|_W_I|–|20|–|μm||
|Charge carrier lifetime|τrr|–|750|–|ns|_I_F= 10 mA,_I_R= 6 mA,<br>measured at_I_R= 3 mA,<br>_R_L= 100 Ω|



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**----- Start of picture text -----**<br>
10 [2]<br>10 [1]<br>10 [0]<br>10 [-1]<br>10 [-2]<br>10 [-3]<br>0.2 0.4 0.6 0.8 1 1.2<br>VF [V]<br> [mA]<br>IF<br>**----- End of picture text -----**<br>


**Figure 1** 

**Forward current** _**I**_ **F vs. forward voltage** _**V**_ **F** 

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## **Electrical performance in test fixture** 

## **2.2 AC characteristics** 

At _T_ A = 25 °C, unless otherwise specified 

|At_T_A= 25 °C, unless otherwise specified|At_T_A= 25 °C, unless otherwise specified||||||
|---|---|---|---|---|---|---|
|**Table 4**<br>**Key parameter**|||||||
|**Parameter**|**Symbol**|**Values**|||**Unit**|**Note or test condition**|
|||**Min.**|**Typ.**|**Max.**|||
|Capacitance|_C_|–|0.35|–|pF|_V_R= 0 V,_f_= 1 MHz|
|||–|0.26|0.35||_V_R= 1 V,_f_= 1 MHz|
|Forward resistance|_R_F|–|2.3|–|Ω|_I_F= 1 mA,_f_= 100 MHz|
|||–|1.6|2.3||_I_F= 3 mA,_f_= 100 MHz|
|||–|1.1|–||_I_F= 10 mA,_f_= 100 MHz|
|Inductance|_L_s|–|0.4|–|nH||



## **Table 5 AC parameter at frequency** _**f**_ **= 1 GHz** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note or Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Capacitance|_C_|–|0.23|–|pF|_V_R= 0 V|
|Reverse parallel resistance|_R_P|–|2.4|–|kΩ|_V_R= 0 V|
|Forward resistance|_R_F|–|2.4|–|Ω|_I_F= 1 mA|
|||–|1.8|–||_I_F= 3 mA|
|||–|1.4|–||_I_F= 10 mA|
|Insertion loss|_I_L|–|0.18|–|dB|_I_F= 1 mA|
|||–|0.13|–||_I_F= 3 mA|
|||–|0.1|–||_I_F= 10 mA|
|Isolation|_I_SO|–|16.9|–||_V_R= 0 V|



## **Table 6 AC parameter at frequency** _**f**_ **= 1.8 GHz** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note or Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Capacitance|_C_|–|0.20|–|pF|_V_R= 0 V|
|Reverse parallel resistance|_R_P|–|1.8|–|kΩ|_V_R= 0 V|
|Forward resistance|_R_F|–|2.5|–|Ω|_I_F= 1 mA|
|||–|1.9|–||_I_F= 3 mA|
|||–|1.5|–||_I_F= 10 mA|
|Insertion loss|_I_L|–|0.19|–|dB|_I_F= 1 mA|
|||–|0.14|–||_I_F= 3 mA|
|||–|0.11|–||_I_F= 10 mA|
|Isolation|_I_SO|–|13|–||_V_R= 0 V|



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## **Electrical performance in test fixture** 

|**Table 7**<br>**AC parameter at frequency****_f_ = 2.5 GHz**|**Table 7**<br>**AC parameter at frequency****_f_ = 2.5 GHz**|**Table 7**<br>**AC parameter at frequency****_f_ = 2.5 GHz**|**Table 7**<br>**AC parameter at frequency****_f_ = 2.5 GHz**|**Table 7**<br>**AC parameter at frequency****_f_ = 2.5 GHz**|**Table 7**<br>**AC parameter at frequency****_f_ = 2.5 GHz**||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Values**|||**Unit**|**Note or Test Condition**|
|||**Min.**|**Typ.**|**Max.**|||
|Capacitance|_C_|–|0.20|–|pF|_V_R= 0 V|
|Reverse parallel resistance|_R_P|–|1.6|–|kΩ|_V_R= 0 V|
|Forward resistance|_R_F|–|2.7|–|Ω|_I_F= 1 mA|
|||–|2.1|–||_I_F= 3 mA|
|||–|1.7|–||_I_F= 10 mA|
|Insertion loss|_I_L|–|0.2|–|dB|_I_F= 1 mA|
|||–|0.16|–||_I_F= 3 mA|
|||–|0.12|–||_I_F= 10 mA|
|Isolation|_I_SO|–|10.8|–||_V_R= 0 V|



**Table 8 AC parameter at frequency** _**f**_ **= 5.5 GHz** 

|**Parameter**|**Symbol**|**Values**|**Values**|**Values**|**Unit**|**Note or Test Condition**|
|---|---|---|---|---|---|---|
|||**Min.**|**Typ.**|**Max.**|||
|Insertion loss|_I_L|–|0.27|–|dB|_I_F= 1 mA|
|||–|0.23|–||_I_F= 3 mA|
|||–|0.2|–||_I_F= 10 mA|
|Isolation|_I_SO|–|5.6|–||_V_R= 0 V|



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**----- Start of picture text -----**<br>
0.4<br>0.35<br>0.3<br>1 MHz<br>1 GHz<br>1.8 GHz<br>0.25<br>2.5 GHz<br>0.2<br>0.15<br>0.1<br>0 5 10 15 20 25 30 35 40<br>V  [V]<br>R<br>C [pF]<br>**----- End of picture text -----**<br>


**Capacitance** _**C**_ **vs. reverse voltage** _**V**_ **R at different frequencies** 

**Figure 2** 

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## **Electrical performance in test fixture** 

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**Figure 3 Reverse parallel resistance** _**R**_ **P vs. reverse voltage** _**V**_ **R at different frequencies** 

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**Figure 4 Forward resistance** _**R**_ **F vs. forward current** _**I**_ **F** 

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## **Electrical performance in test fixture** 

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**----- Start of picture text -----**<br>
0<br>-0.1<br>-0.2<br>100 mA<br>-0.3 10 mA<br>3 mA<br>1 mA<br>0.5 mA<br>-0.4<br>-0.5<br>0 1 2 3 4 5 6<br>f [GHz]<br> [dB]<br>L<br>I<br>**----- End of picture text -----**<br>


**Figure 5 Insertion loss** _**I**_ **L vs. frequency** _**f**_ **at different currents** 

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**----- Start of picture text -----**<br>
0<br>-5<br>-10<br>-15<br>0 V<br>1 V<br>-20 10 V<br>-25<br>0 1 2 3 4 5 6<br>f [GHz]<br> [dB]<br>SO<br>I<br>**----- End of picture text -----**<br>


**Figure 6** 

_Note:_ 

**Isolation** _**I**_ **SO vs. frequency** _**f**_ **at different reverse voltages** 

_The curves shown in this chapter have been generated using typical devices but shall not be understood as a guarantee that all devices have identical characteristic curves._ 

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## **Thermal characteristics** 

## **3 Thermal characteristics** 

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**----- Start of picture text -----**<br>
Table 9 Thermal resistance<br>**----- End of picture text -----**<br>


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**----- Start of picture text -----**<br>
Parameter Sym Values Unit Note or test condition<br>bol<br>Min. Typ. Max.<br>Thermal resistance R thJS – 65 – K/W T S = 133 ° C  [1)]<br>(junction - soldering point)<br>120<br>100<br>80<br>60<br>40<br>20<br>0<br>0 20 40 60 80 100 120 140 160<br>T  [°C]<br>S<br> [mA]<br>F<br>I<br>**----- End of picture text -----**<br>


**Figure 7 Permissible forward current** _**I**_ **F in DC operation** 

1 

For _R_ thJS in other conditions refer to the curves in this chapter. 

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## **Thermal characteristics** 

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**Figure 8** 

**Thermal resistance** _**R**_ **thJS in pulse operation** 

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**Figure 9** 

**Permissible forward current ratio** _**I**_ **Fmax/** _**I**_ **DC in pulse operation** 

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## **Package information TSLP-2-19** 

## **4 Package information TSLP-2-19** 

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## **Figure 10 Package outline** 

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**Figure 11 Foot print Figure 12 Marking layout example** 

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## **Figure 13 Tape dimensions** 

_Note: See our_ _**Recommendations for Printed Circuit Board Assembly of TSLP/TSSLP/TSNP Packages** . The marking layout is an example. For the real marking code refer to the device information on the first page. The number of characters shown in the layout example is not necessarily the real one. The marking layout can consist of less characters._ 

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## **References** 

## **5 References** 

|[1]|Infineon AG -**_Recommendations for Printed Circuit Board Assembly of Infineon TSLP/TSSLP/TSNP_**<br>**_Packages_**|
|---|---|



## **Revision history** 

|**Document**<br>**version**|**Date of**<br>**release**|**Description of changes**|
|---|---|---|
|1.0|2018-09-07|•<br>Change from series datasheet to individual one<br>•<br>Initial release of datasheet<br>•<br>Typical values and curves updated to the values of the production<br>(No product or process change behind)<br>•<br>Minimum/typical values added<br>•<br>Typical curves/values removed|



Datasheet 

v1.0 2018-06-30 

11 

## **Trademarks** 

All referenced product or service names and trademarks are the property of their respective owners. 

**Edition 2018-06-30 IMPORTANT NOTICE Published by** The information given in this document shall in no event be regarded as a guarantee of conditions or **Infineon Technologies AG** characteristics (“Beschaffenheitsgarantie”) . **81726 Munich, Germany** With respect to any examples, hints or any typical values stated herein and/or any information regarding the **© 2018 Infineon Technologies AG** application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of **All Rights Reserved.** any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. 

**Do you have a question about any aspect of this document?** In addition, any information given in this document is **Email: erratum@infineon.com** subject to customer’s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning **Document reference** customer’s products and any use of the product of **IFX-dht1516210002561** Infineon Technologies in customer’s applications. 

## **WARNINGS** 

Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. 

Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies’ products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury 

The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer’s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. 



## Links

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