# Chip Antenna, WLAN, 2.45 GHz, 50 Ohm, Omnidirectional, 8mm x 1mm x 1mm

![Product image](https://novapart.co/image/farnell:1779481/)

**URL**: https://novapart.co/products/ANT8010LL04R2400A/chip-antenna-wlan-245-ghz-50-ohm-omnidirectional
**SKU**: ANT8010LL04R2400A
**Manufacturer**: YAGEO
**Category**: Passive Components || Antennas - Single Band Chip
**Price**: €0.2080
**Stock**: 10+

## Specifications

| Parameter | Value |
|---|---|
| Centre Frequency | 2.45GHz |
| Antenna Case Size | 8mm x 1mm x 1mm |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1779481/)

## _**ANTENNA PRODUCTS**_ 

## DATA Sirlleisi 

## **8010 Ceramic Chip Antenna for Bluetooth/Wimax Application** 

## – Sept., 2008 V8 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page1|sheet 190-1|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **8010 Ceramic Chip Antenna for Bluetooth/Wimax Application** 

## **Quick Reference Data** 

Centre Frequency 2.38 GHz Bandwidth 2.3 ~ 2.49 GHz VSWR 2.5 (Max.) Polarization Linear Azimuth Beamwidth Omni-directional Peak Gain 3.0 dBi Impedance 50 Ω Operating Temperature -25~85[ o] C Termination Ni / Sn (Environmentally-Friendly Leadless) Resistance to soldering heats 260 ℃ , 10sec. Maximum Power 1W 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page2|sheet 190-2|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **1. Mechanical Data (8 x 1x 1 mm ³ )** 

**==> picture [323 x 129] intentionally omitted <==**

**----- Start of picture text -----**<br>
Top-Side View<br>1.0 mm<br>1.0 mm q 8.0 mm F|<br>Bottom-Side View<br>**----- End of picture text -----**<br>


## **CAN4311881XX2453K** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**<br>~~nO~~|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen<br>~~es~~|~~es~~<br>~~nO~~|~~es~~<br>~~nO~~|Page3<br>~~es~~|sheet 190-3<br>~~es~~|~~es~~|~~es~~|A4|
||Yageo Taiwan / High Frequency BU<br>~~nO~~||||||||



## **2 . Dimension of Footprint** 

**==> picture [388 x 296] intentionally omitted <==**

**----- Start of picture text -----**<br>
9.0 mm<br>1.4 mm<br>1.4 mm<br>8.0+- 0.1mm<br>1.05+- 0.1 mm<br>0.90+- 0.15mm<br>Bottom Side<br>**----- End of picture text -----**<br>


**-** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page4|sheet 190-4|||A4|
||Yageo Taiwan / High Frequency BU||||||||



- **3 . Evaluation Board Dimension and Outlook** 

**==> picture [195 x 166] intentionally omitted <==**

**----- Start of picture text -----**<br>
50 ohm Line<br>Gound plane in<br>backside<br>Unit: mm<br>**----- End of picture text -----**<br>


|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page5|sheet 190-5|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **4. Measured S-parameter** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page6|sheet 190-6|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **5.The Definition of X-Y-Z Plane** 

**==> picture [93 x 59] intentionally omitted <==**

**----- Start of picture text -----**<br>
X Z<br>Y<br>**----- End of picture text -----**<br>


|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page7|sheet 190-7|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **6. The Environment of Antenna Radiation Pattern** 

- **Anechoic Chamber Dimension=10(m)** **`×` 6(m)** **`×` 6(m)** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page8|sheet 190-8|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **7. Radiation Pattern** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page9|sheet 190-9|||A4|
||Yageo Taiwan / High Frequency BU||||||||



## **8. Reliability Test** 

|**IEC**<br>**384-10/**<br>**CECC 32**<br>**100**<br>**CLAUSE**|**IEC**<br>**60068-2**<br>**TEST**<br>**METHOD**|**TEST**|**PROCEDURE**|**REQUIREMENTS**|
|---|---|---|---|---|
|4.4||Mounting|The antenna can be<br>mounted on printed-circuit<br>boards or ceramic<br>substrates by applying<br>wave soldering, reflow<br>soldering (including vapour<br>phase soldering) or<br>conductive adhesive|No visible damage|
|4.5||Visual inspection<br>and dimension<br>check|Any applicable method<br>using**× **10 magnification|In accordance with<br>specification (chip off<br>4mm)|
|4.6.1||Antenna|Central Frequency<br>at20 oC|Standard test board in<br>page 4|
|4.8||Adhesion|A force of 3 N applied for<br>10 s to the line joining the<br>terminations and in a<br>plane parallel to the<br>substrate|No visible damage|
|4.9||Bond strength of<br>plating on end face|Mounted in accordance<br>with CECC 32 100,<br>paragraph 4.4|No visible damage|
||||Conditions: bending 0.5<br>mm at a rate of 1mm/s,<br>radius jig. 340 mm, 2mm<br>warp on FR4 board of 90<br>mm length|No visible damage|
|4.10|20(Tb)|Resistance to<br>soldering heat|260±5°C for 10 ± 0.5 s in<br>a static solder bath|Satisfy the original<br>electrical specification<br>aftersoldering.|
|||Resistance to<br>leaching|260±5°C for 30 ±1 s in a<br>static solder bath|Using visual<br>enlargement of**× **10,<br>dissolution of the<br>termination shall not<br>exceed10%|



|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page10|sheet 190-<br>10|||A4|
||Yageo Taiwan / High FrequencyBU||||||||



|**IEC**<br>**384-10/**<br>**CECC 32**<br>**100**<br>**CLAUSE**|**IEC**<br>**60068-2**<br>**TEST**<br>**METHOD**|**TEST**|**PROCEDURE**|**REQUIREMENTS**|
|---|---|---|---|---|
|4.11|20(Ta)|Solderability|Zero hour test, and test<br>after storage (20 to 24<br>months) in original<br>atmosphere; un-mounted<br>chips completely<br>immersed for 2±0.5 s in<br>235 ± 5°C.|The termination must<br>be well tinned, at least<br>75% is well tinned at<br>termination|
|4.12|4(Na)|Rapid change of<br>temperature|-25 °C (30 minutes) to +85<br>°C (30 minutes)**;**100<br>cycles|No visible damage<br>Central Freq. Change<br>±6%|
|4.14|3(Ca)|Damp heat|500±12 hours at 60°C;<br>90 to 95 % RH|No visible damage<br>2 hours recovery<br>Central Freq. Change<br>± 6%|
|4.15||Endurance|500±12 hours at 85°C;|No visible damage<br>2 hours recovery<br>Central Freq. Change<br>± 6%|



## **■ Notice (shipping and storage during transportation)** 

## **In order to ensure some quality, it is suggested to follow the condition during shipping :** 

- **Temperature : -40~70 ℃** 

- **Humidity : 45~75%** 

## **■ Notice (storage condition)** 

## **In order to ensure the solderability of the termination, it is suggested to follow the condition for storage :** 

- **Temperature : 15~30 ℃** 

- **Humidity : 45~75%** 

- **Prevent corrosive gas (SO2, NOX, NH3, Cl2, ..etc)** 

- **It is better to use products within 6 months. Solderability should be confirmed again if exceed 6 months.** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page11|sheet 190-<br>11|||A4|
||Yageo Taiwan / High FrequencyBU||||||||



## **9. Soldering Condition (Suggestion)** 

* Customers should alter the profile according to realistic tin paste in use. 

**==> picture [114 x 21] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical value (solid line)<br>Process limits (dotted line)<br>**----- End of picture text -----**<br>


|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page12|sheet 190-<br>12|||A4|
||Yageo Taiwan / High FrequencyBU||||||||



## **10. Ordering Information** 

The antennas may be ordered by using the Yageo ordering code. These code numbers can be determined by the following rules: 

## **CAN43 11 8 81  04 245 3K** 

Family Code 

**CAN 43** = Yageo Part No. for Antenna 

Packing Type Code **11** = 180 mm/ 7" reel , blister taping 

Materials Code 

**8** = High Frequency Material (White) 

Size Code **81** = 8.0 * 1.0 * 1.0 mm 

Antenna type **01** = type 1 **02** = type 2 **03** = type 3 **04** = type 4 **05** = type 5 **06** = type 6 **07** = type 7 **08** = type 8 

Working Frequency **245 =** 2.45 GHz 

Packing Type Code **3K =** 3000 pcs for taping per reel 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page13|sheet 190-<br>13|||A4|
||Yageo Taiwan / High FrequencyBU||||||||



## **11. Taping Blister Tape** 

|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page14|sheet 190-<br>14|||A4|
||Yageo Taiwan / High FrequencyBU||||||||



## **12.  Taping Reel - 7 ” (180mm) Specifications** 

||f<br>CL)|Wy|Wy|||
|---|---|---|---|---|---|
||LMC<br>\i<br>CF @15,0+£0,5<br>we|||||
|||||Wwe||
|**Product size**|**Units per**<br>**Tape Width**<br>**C**||**D**|**W1 **|**W2**|
|**code**|**Reel **<br>**(mm)**<br> **(mm)**||**(mm)**|**(mm)**|**(mm)**|
|**Antenna**|**1000**<br>**16**<br>**180.0±1.0**||**62±0.5**|**16.0±1.0**|**20.5±1.0**|



|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**<br>~~a~~<br>~~ee~~|||**CAN4311 881 XX 245 3K**<br>~~eeeee~~|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||~~eee~~||
|Justin Liu<br>Oscar Lu|Tommy Chen<br>~~a~~|~~ee~~|~~ee~~|Page15<br>~~ee~~|sheet 190-<br>15<br>~~eee~~|~~eee~~|~~eee~~|A4|
||Yageo Taiwan / High FrequencyBU<br>~~a~~<br>~~ee~~<br>~~ee eee~~||||||||



## **11. Tape Revision Control:** 

|Revision|Date|Content|Remark|
|---|---|---|---|
|V6|June, 2008|Phase out Blue series||
|V7|Aug, 2008|Modify the dimension of soldering pad||
|V8|Sept, 2008|Modify the dimension of soldering pad||
|V9|Sept, 2008|Modify the operation temperature||



|R&D|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|Print date 09/02/24<br>|
|---|---|---|---|---|---|---|---|---|
||**8010 Ceramic Chip Antenna**<br>**for Bluetooth/Wimax Application**|||**CAN4311 881 XX 245 3K**|||June, 2008<br>v6||
||||||||Aug, 2008<br>v7||
||||||||Sept, 2008<br>v8||
||||||||||
|Justin Liu<br>Oscar Lu|Tommy Chen|||Page16|sheet 190-<br>16|||A4|
||Yageo Taiwan / High FrequencyBU||||||||





## Links

- [View this product on Novapart](https://novapart.co/products/ANT8010LL04R2400A/chip-antenna-wlan-245-ghz-50-ohm-omnidirectional)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/en-ES/yageo/can4311881042453k/antenna-8010-wlan-2-45ghz/dp/1779481)
---

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