# Power Inductor (SMD), AEC-Q200, 22 µH, 3.6 A, Shielded, 8.5 A, AMDC Series, 0404 [1010 Metric] ![Product image](https://novapart.co/image/farnell:4861102RL/) **URL**: https://novapart.co/products/AMDC001010J0220MQA/power-inductor-smd-aec-q200-22-h-36-a-shielded-85 **SKU**: AMDC001010J0220MQA **Manufacturer**: PULSE ELECTRONICS **Category**: Passive Components || Inductors || Power Inductors || SMD Power Inductors **Price**: €1.3600 **Stock**: 200+ **Lead Time**: 506 days (indicative) ## Datasheet 📄 [Download PDF](https://novapart.co/datasheet/farnell:4861102RL/) ## **Power Inductor** ## **Automotive Grade** ## **AMDC Series** _ Ecc ~~oo~~ ## **Overview** AMDC series Inductors filter the high-frequency switching noise generated by the PWM (Pulse Width Modulation) signals in Class-D amplifiers, ensuring clean audio output. Inductors help in maintaining a stable load for the Class-D amplifier, ensuring optimal performance across varying speaker impedances. ## **Benefits** 1. Automotive grade available 2. Efficient Filtering of High-Frequency Noise 3. 2 in 1 molded power inductors for compact designs for space optimization 4. High saturation Current ## **Applications** 1. Automotive Audio Systems: Efficient sound systems in cars, including EVs. 2. Professional Audio Equipment: Amplifiers for live performances and studio systems. 3. Home Audio Systems: High-fidelity home theater systems and smart speakers ## **Product Information** |**Series**|**L (mm)**|**W(mm)**|**T (mm)**|**Inductance (**µ**H)**| |---|---|---|---|---| |AMDC|10.2|9.5|10.8|10, 15, 22| ## **AMDC001010J0 Series Specification** AEC-Q200 ~~EC~~ **==> picture [435 x 197] intentionally omitted <==** **----- Start of picture text -----**
__| 1 Scope This specification applies to large current and low loss SMD power inductor.
__| 2 Part numbering
A MDC □□ □□□□□□ □□□ □ □□
Internal code
Tolerance
Inductance
Dimension
Control code
Prouduct series
Grade
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~~__|~~ 3 **Temperature rating** Operating Temperature: -40°C to 125°C. Storage Temperature: (on tape & reel): -20°C to +40°C; 75% RH max. ## ~~__|~~ 4 **Marking** **==> picture [272 x 41] intentionally omitted <==** **----- Start of picture text -----**
XXX Marking : XXX → Inductance
XXX 024 → Year
XXX 001 → Week
**----- End of picture text -----**
|**Standard testing condition**
Humidity
OrdinaryHumidity(25 to 85%RH)
50 to 80 %RH
5
Unless otherwise specified
Incase ofdoubt
Temperature
OrdinaryTemperature(15 to 35°C)
20 to 30°C
~~__|———$———~~| |---| ## **AMDC001010J0 Series Specification** ## AEC-Q200 ## ~~__]~~ 6 **Configuration and dimensions** ## 7 **Electrical characteristics** ~~4~~ **Dimensions in mm Type 1010J0 A 10.2 ± 0.2 B 9.5 ± 0.2 C 10.85 ± 0.25 D 2.3 ± 0.3 E 2.65 ± 0.2 F 4.0 Typ G 2.3 ± 0.2 Size Code Net weight(grms) 1010J0 6.2(typ.)** ~~—~~ |**Part number**|**Inductance**
**(uH)**|**Tolerance**
**(±%)**|**Test Freq.**|**Max.(Typ.)**
**Irms (A)**|**Isat (A)**
**Max.(Typ.)**|**RDC (mΩ)**
**Max.(Typ.)**|**Marking**| |---|---|---|---|---|---|---|---| |AMDC001010J0100MQA|10|20|100kHz,0.5V|5.2(5.8)|10(12)|22(18)|100| |AMDC001010J0150MQA|15|20|100kHz,0.5V|4(4.5)|7.7(9)|40.8(34)|150| |AMDC001010J0220MQA|22|20|100kHz,0.5V|3.2(3.6)|7.3(8.5)|56(46)|220| ## **Note:** 1. Operating temperature range -40°C to 125°C. 2. Isat for Inductance drop 25% from its value without current. 3. Irms for a 40°C temperature rise from 25°C ambient. 4. The part temperature (ambient + temp rise) should not exceed 125°C under worst case operating conditions. Circuit design 125°C under worst case operating conditions. Component placement, PCB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 5. Absolute maximum voltage 30V DC. (Based on test method, it may not the sameunder different application, it is recommended to verify first.) ## **AMDC001010J0 Series Specification** AEC-Q200 ~~EC~~ ~~__|~~ 8 **AMDC001010J0 Series 8.1 Construction** ## **8.2 Material List** |Item|Part|Description| |---|---|---| |1|Magnetic core|Magnetic metal powder| |2|Coil|Enameled copper wire| |3|Terminals|Copper based terminal| ## **AMDC001010J0 Series Specification** ## AEC-Q200 ## ~~__|~~ 9 **Reliability test items** |**1-1.Mechanical Performance**| |---| |**No**
**Item**
**Specification**
1-1-1 Board Flex
The forces applied on the right Refer to AEC-Q200-005
conditions must not damage
Test device shall be soldered on the substrate
the terminal electrode and the
Substrate Dimension: 100x40x1.6mm
ferrite
Deflection: 2.0mm
KeepingTime: 60sec
1-1-2 Resistance to Soldering Heat
Appearance: No damage
Refer to MIL-STD-202 Method 210
Inductance change shall be
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
within ±10%.
Solder Temperature: 260±5°C
Immersion Time: 10±1sec
1-1-3 Solder ability
The electrodes shall be at
Refer to J-STD-002
least 95% covered with new
Pre-heating: 150°C, 1min
solder coating
Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)
Solder Temperature: 245±5°C(Pb-Free)
Immersion Time: 4±1sec
1-1-4 Terminal Strength Test
Appearance: No damage
Refer AEC-Q200-006
Soldered on PCB for testing as fig.
Force : 1.8kg
KeepingTime: 60 seconds.
1-1-5 Resistance to Solvent
There must be no change in
Refer to MIL-STD-202 Method 215
appearance or obliteration of
Inductors must withstand 6 mimutes of alcohol or water.
marking
Sample Size : 15pcs
1-1-6 Vibration
Appearance: No damage
Refer MIL-STD-202 Method 204
Inductance change shall be
Vibration waveform: Sine waveform
within ±10%.
Vibration frequency: 10Hz~2000Hz
Vibration acceleration: 5g
Sweep rate: 0.764386otcave/minute
Duration of test: 12 cycles each of 3 orientations,
20 minutes for each cycle
Vibration axes: X,Y & Z
**Test Method**
~~aGC~~
~~ee~~
~~To~~| |**1-2.Environmental Performance**| |**No**
**Item**
**Specification**
1-2-1 Temperature Cycle
Appearance: No damage
Refer to JESD Method JA-104
Inductance change shall be
Total cycles: 1000 cycles
within±20%
Temperature Cycling Test Conditions : -40 to 125°C
-40°C Soak Mode Condition : 30 minutes
125°C Soak Mode Condition : 30 minutes
Measured after exposure in the room condition for 24hrs
**Test Method**| |1-2-2 Biased Humidity Resistance
Refer to MIL-STD-202 Method 103
Temperature: 85±2°C
Relative Humidity:85% / Time: 1000hrs
Measured after exposure in the room condition for 24hrs| |1-2-3 High
Refer to MIL-STD-202 Method 108
Temperature Exposure
Temperature: 125±3°C / Relative Humidity: 0%
(Storage)
Applied Current: Rated Current /Time: 1000hrs
Measured after exposure in the room condition for 24hrs| |1-2-4 Operational Life
Refer to MIL-PRF-27
Temperature: 85±3°C
Applied Current : Rated Current
Time: 1000hrs
Measured after exposure in the room condition for 24hrs| ## **AMDC001010J0 Series Specification** ## AEC-Q200 **==> picture [189 x 17] intentionally omitted <==** **----- Start of picture text -----**
__| 10 Recommended IR reflow profile
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|oC||Ramp-up|Ramp-up|||Pre-heating|Pre-heating|Pre-heating|Pre-heating|||Reflo|Reflo||||Cooling||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| |300||||||||||||Peak: 260|||||||| ||||||||||||||||||||| ||217°C||||||||||||||||||| ||150°C||||||||||||||||6°C/ sec|C/ sec|| ||||||||||||||||||||| |100|||||||||||||||||||| |0|||3°C/sec max||||||||||||||||| |0||50|100||||150||200|||250|||||300
350||sec| ||||||||Reflow||profile||||||||||| |Lead-Free(LF)|||||||||||||||||Refer to J-STD-020F|Refer to J-STD-020F|| |Item||Ramp-up||||Pre-heating|||Reflow||||||Peak Temp.||||Cooling| |Temp. scope||R.T. ~150|R.T. ~150°C||150°C~200°C||||217°C|||||||260±5°C||Peak Temp.
150°C|| |Time spec||-||||60~120 sec|||60~150 sec||||||20~40 sec||||-| Note: 1. IR reflow times: within 3 times. 2. Nitrogen adopted is recommended while in IR reflow. ## **AMDC001010J0 Series Specification** ## AEC-Q200 **==> picture [341 x 541] intentionally omitted <==** **----- Start of picture text -----**
__| 11 Packaging
11.1 Packaging-cover tape
The force for tearing off cover tape is 10 to 130 grams.
165° to 180°
Top cover tape
NS \
\_
Base tape
11.2 Packaging quantity
Type pcs/reel
1010J0 200
a
11.3 Reel dimensions
A C B
1 @y
D
Dimensions in mm
Type A B C D
1010J0 330 100 13 24
a
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## **AMDC001010J0 Series Specification** ## AEC-Q200 **==> picture [472 x 229] intentionally omitted <==** **----- Start of picture text -----**
__| 11 Packaging
11.4 Tape dimensions in mm
P0 P2
D
E
W
B0
Cee
K0 P
LI
Pulling direction
A0
Type A0 B0 K0 D E W P P0 P2
1010J0 9.8 10.8 11.1 1.5 1.75 24 16 4 2
————
XXX XXX 100
**----- End of picture text -----**
**==> picture [433 x 183] intentionally omitted <==** **----- Start of picture text -----**
__| 12 Recommended pattern
D
|
Dimensions in mm
Type A B C D
C
1010J0 4.05 2.85 2.1 3.85
B
/—| A
__| 13 Note
1. Please make sure that your product has been evaluated and confirmed against your specifications
when our product is mounted to your product.
**----- End of picture text -----**
2. Don’t design/ mount any components in contact with this product. 3. The moisture sensitivity level (MSL) of products is classified as level 1. 4. Shelf life: 1 years from the date of shipment. ## **AMDC001010J0 Series Specification** AEC-Q200 ~~Pe~~ **==> picture [497 x 353] intentionally omitted <==** **----- Start of picture text -----**
__| 14 Graph
AMDC001010J0100MQA AMDC001010J0150MQA
15 100 20 100
Inductance(μH) Inductance(μH)
Temp Rise (°C) Temp Rise (°C)
12 80 16 80
= = oy
9 4 60 12 f f 60
6 eo 40 8 7 40
3 Sa 20 4 a ae 20
0 0 0 0
0 2 4 6 8 10 12 14 0 2 4 6 8 10
pet ed
DC Current(A) DC Current(A)
AMDC001010J0220MQA
30 100
Inductance(μH)
Temp Rise (°C)
24 e y ae 80
18 60
—— fe
1260 —TZ=af 40200
0 2 4 6 8 10
DC Current(A)
Inductance(μH) C)Temp Rise(° Inductance(μH) C)Temp Rise(°
Inductance(μH) C)Temp Rise(°
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