ADIS16365BMLZ

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## **Data Sheet** 

## **Six Degrees of Freedom Inertial Sensor ADIS16360/ADIS16365** 

## **FEATURES** 

**Triaxis digital gyroscope with digital range scaling ±75°/sec, ±150°/sec, ±300°/sec settings Tight orthogonal alignment: <0.05°** 

**Triaxis digital accelerometer: ±18** _**g**_ 

**Autonomous operation and data collection No external configuration commands required Start-up time: 180 ms Sleep mode recovery time: 4 ms Factory-calibrated sensitivity, bias, and axial alignment Calibration temperature range** 

**ADIS16360: +25°C ADIS16365: −40°C to +85°C SPI-compatible serial interface Wide bandwidth: 330 Hz Embedded temperature sensor Programmable operation and control Automatic and manual bias correction controls Bartlett window, FIR filter length, number of taps Digital I/O: data ready, alarm indicator, general-purpose Alarms for condition monitoring Sleep mode for power management DAC output voltage Enable external sample clock input: up to 1.2 kHz Single-command self-test** 

**Single-supply operation: 4.75 V to 5.25 V 2000** _**g**_ **shock survivability Operating temperature range: −40°C to +105°C** 

## **APPLICATIONS** 

## **Medical instrumentation Robotics** 

## **Platform controls Navigation** 

## **GENERAL DESCRIPTION** 

The ADIS16360/ADIS16365 _i_ Sensor® devices are complete inertial systems that include a triaxis gyroscope and triaxis accelerometer. Each sensor in the ADIS16360/ADIS16365 combines industryleading _i_ MEMS® technology with signal conditioning that optimizes dynamic performance. The factory calibration characterizes each sensor for sensitivity, bias, alignment, and linear acceleration (gyro bias). As a result, each sensor has its own dynamic compensation formulas that provide accurate sensor measurements. 

The ADIS16360/ADIS16365 provide a simple, cost-effective method for integrating accurate, multiaxis inertial sensing into industrial systems, especially when compared with the complexity and investment associated with discrete designs. All necessary motion testing and calibration are part of the production process at the factory, greatly reducing system integration time. Tight orthogonal alignment simplifies inertial frame alignment in navigation systems. An improved SPI interface and register structure provide faster data collection and configuration control. 

The ADIS16360/ADIS16365 use a compatible pinout and the same package as the ADIS1635x family. Therefore, systems that currently use the ADIS1635x family can upgrade their performance with minor firmware adjustments in their processor designs. These compact modules are approximately 23 mm × 23 mm × 23 mm and provide a flexible connector interface that enables multiple mounting orientation options. 

## **FUNCTIONAL BLOCK DIAGRAM** 

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AUX_ADC AUX_DAC<br>TEMPERATURE<br>SENSOR<br>TRI-AXIS MEMS CS<br>ANGULAR RATE<br>SENSOR SIGNAL CALIBRATION OUTPUT SCLK<br>CONDITIONING AND REGISTERS<br>AND DIGITAL AND SPI DIN<br>CONVERSION INTERFACE<br>PROCESSING<br>DOUT<br>TRI-AXIS MEMS<br>ACCELERATION<br>SENSOR<br>ALARMS<br>POWER VCC<br>MANAGEMENT<br>SELF-TEST CONTROLDIGITAL<br>ADIS16360/ GND<br>ADIS16365<br>RST DIO1 DIO2 DIO3 DIO4/CLKIN<br>Figure 1.<br>07570-001<br>**----- End of picture text -----**<br>


**Rev. E** 

**Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.** 

**One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2009–2012 Analog Devices, Inc. All rights reserved.** 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **TABLE OF CONTENTS** 

Features .............................................................................................. 1 Applications ....................................................................................... 1 General Description ......................................................................... 1 Functional Block Diagram .............................................................. 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Timing Specifications .................................................................. 5 Timing Diagrams .......................................................................... 5 Absolute Maximum Ratings ............................................................ 6 ESD Caution .................................................................................. 6 Pin Configuration and Function Descriptions ............................. 7 Typical Performance Characteristics ............................................. 8 Theory of Operation ........................................................................ 9 Basic Operation ............................................................................ 9 Reading Sensor Data .................................................................... 9 Device Configuration .................................................................. 9 

Memory Map .............................................................................. 10 Burst Read Data Collection ...................................................... 11 Output Data Registers................................................................ 11 Calibration................................................................................... 12 Operational Control ................................................................... 12 Input/Output Functions ............................................................ 14 Diagnostics .................................................................................. 15 Product Identification ................................................................ 16 Applications Information .............................................................. 17 Installation/Handling................................................................. 17 Gyroscope Bias Optimization ................................................... 17 Input ADC Channel ................................................................... 17 Interface Printed Circuit Board (PCB) .................................... 17 Outline Dimensions ....................................................................... 18 Ordering Guide .......................................................................... 18 

## **REVISION HISTORY** 

## **9/12—Rev. D to Rev. E** 

Change to Device Configuration Section ...................................... 9 

## **2/11—Rev. C to Rev. D** 

Changes to Gyroscopes Misalignment and Accelerometers Misalignment Test Conditions/Comments, Table 1 .................... 3 Changes to Table 30 and Table 31 ................................................ 16 

## **8/10—Rev. B to Rev. C** 

Changes to Figure 11 ........................................................................ 9 Changes to Table 8 .......................................................................... 10 Changes to Burst Read Data Collection Section ........................ 11 Changes to Internal Sample Rate Section.................................... 12 Changes to Product Identification Section and Table 32 .......... 16 

## **12/09—Rev. A to Rev. B** 

Reorganized Layout ............................................................ Universal Changes to Features Section............................................................ 1 Changes to Table 1 ............................................................................ 3 Changes to Table 2 ............................................................................ 5 Changes to Table 5 ............................................................................ 7 Changes to Table 7 and Device Configuration Section ............... 9 Changes to Table 8 .......................................................................... 10 Changes to Burst Read Data Collection Section, Output 

Data Registers Section, and Table 9 ............................................. 11 Added Table 10, Table 11, Table 12, Table 13, and Table 14; Renumbered Tables Sequentially ................................................. 11 Added Sensor Bandwidth Section and Figure 14; Renumbered Figures Sequentially ................................................ 13 Changes to Digital Filtering Section ............................................ 13 Changes to General-Purpose I/O Section ................................... 14 Changes to Table 26 ....................................................................... 15 Changes to Table 29 and Table 31 ................................................ 16 Added Product Identification Section ......................................... 16 Added Applications Information Section, Figure 16, Figure 17, and Figure 18; Renumbered Figures Sequentially ..................... 17 

## **4/09—Rev. 0 to Rev. A** 

Changes to Features Section ............................................................ 1 Changes to Scale Factor, Table 1 ...................................................... 3 Changes to Figure 5 and Figure 6 .................................................... 7 Changes to Figure 7 and Figure 8 .................................................... 8 Changes to Device Configuration Section ..................................... 9 Changes to Figure 12 ...................................................................... 10 Changes to Operational Control Section .................................... 12 

## **1/09—Revision 0: Initial Version** 

Rev. E | Page 2 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **SPECIFICATIONS** 

TA = 25°C, VCC = 5.0 V, angular rate = 0°/sec, dynamic range = ±300°/sec ± 1 _g_ , unless otherwise noted. 

**Table 1.** 

|**Table 1.**||||
|---|---|---|---|
|**Parameter**|**Test Conditions/Comments**|**Min**<br>**Typ**<br>**Max**|**Unit**|
|GYROSCOPES<br>Dynamic Range<br>Initial Sensitivity<br>Sensitivity Temperature Coefficient<br>Misalignment<br>Nonlinearity<br>Initial Bias Error<br>In-Run Bias Stability<br>Angular Random Walk<br>Bias Temperature Coefficient<br>Linear Acceleration Effect on Bias<br>Bias Voltage Sensitivity<br>Output Noise<br>Rate Noise Density<br>3 dB Bandwidth<br>Sensor Resonant Frequency<br>Self-Test Change in Output Response|Dynamic range = ±300°/sec<br>Dynamic range = ±150°/sec<br>Dynamic range = ±75°/sec<br>ADIS16360, −40°C ≤ TA≤ +85°C<br>ADIS16365, −40°C ≤ TA≤ +85°C<br>Axis-to-axis<br>Axis-to-frame (package)<br>Best fit straight line<br>±1 σ<br>1 σ, SMPL_PRD = 0x0001<br>1 σ, SMPL_PRD = 0x0001<br>ADIS16360, −40°C ≤ TA≤ +85°C<br>ADIS16365, −40°C ≤ TA≤ +85°C<br>Any axis, 1 σ (MSC_CTRL[7] = 1)<br>VCC = 4.75 V to 5.25 V<br>±300°/sec range, no filtering<br>f = 25 Hz, ±300°/sec range, no filtering<br>±300°/sec range setting|±300<br>±350<br>0.0495<br>0.05<br>0.0505<br>0.025<br>0.0125<br>±350<br>±40<br>±0.05<br>±0.5<br>±0.1<br>±3<br>0.007<br>2.0<br>±0.025<br>±0.01<br>0.05<br>±0.3<br>0.8<br>0.044<br>330<br>14.5<br>±696<br>±1400<br>±2449|°/sec<br>°/sec/LSB<br>°/sec/LSB<br>°/sec/LSB<br>ppm/°C<br>ppm/°C<br>Degrees<br>Degrees<br>% of FS<br>°/sec<br>°/sec<br>°/√hr<br>°/sec/°C<br>°/sec/°C<br>°/sec/_g_<br>°/sec/V<br>°/sec rms<br>°/sec/√Hz rms<br>Hz<br>kHz<br>LSB|
|ACCELEROMETERS<br>Dynamic Range<br>Initial Sensitivity<br>Sensitivity Temperature Coefficient<br>Misalignment<br>Nonlinearity<br>Initial Bias Error<br>In-Run Bias Stability<br>Velocity Random Walk<br>Bias Temperature Coefficient<br>Bias Voltage Sensitivity<br>Output Noise<br>Noise Density<br>3 dB Bandwidth<br>Sensor Resonant Frequency<br>Self-Test Change in Output Response|Each axis<br>ADIS16360, −40°C ≤ TA≤ +85°C<br>ADIS16365, −40°C ≤ TA≤ +85°C<br>Axis-to-axis<br>Axis-to-frame (package)<br>Best fit straight line<br>±1 σ<br>1 σ<br>1 σ<br>ADIS16360, −40°C ≤ TA≤ +85°C<br>ADIS16365, −40°C ≤ TA≤ +85°C<br>VCC = 4.75 V to 5.25 V<br>No filtering<br>No filtering<br>X-axis andy-axis|±18<br>3.285<br>3.33<br>3.38<br>±120<br>±50<br>0.2<br>±0.5<br>0.1<br>±50<br>0.2<br>0.2<br>±4<br>±0.3<br>2.5<br>9<br>0.5<br>330<br>5.5<br>59<br>151|_g_<br>m_g_/LSB<br>ppm/°C<br>ppm/°C<br>Degrees<br>Degrees<br>% of FS<br>m_g_<br>m_g_<br>m/sec/√hr<br>m_g_/°C<br>m_g_/°C<br>m_g_/V<br>m_g_rms<br>m_g_/√Hz rms<br>Hz<br>kHz<br>LSB|
|TEMPERATURE SENSOR<br>Scale Factor|Output = 0x0000 at 25°C (±5°C)|0.136|°C/LSB|
|ADC INPUT<br>Resolution<br>Integral Nonlinearity<br>Differential Nonlinearity<br>Offset Error||12<br>±2<br>±1<br>±4|Bits<br>LSB<br>LSB<br>LSB|



Rev. E | Page 3 of 20 

**ADIS16360/ADIS16365 Data Sheet** 

|**Parameter**|**Test Conditions/Comments**|**Min**<br>**Typ**<br>**Max**|**Unit**|
|---|---|---|---|
|Gain Error<br>Input Range<br>Input Capacitance|Duringacquisition|±2<br>0<br>3.3<br>20|LSB<br>V<br>pF|
|DAC OUTPUT<br>Resolution<br>Relative Accuracy<br>Differential Nonlinearity<br>Offset Error<br>Gain Error<br>Output Range<br>Output Impedance<br>Output SettlingTime|5 kΩ/100 pF to GND<br>101 LSB ≤ input code ≤ 4095 LSB|12<br>±4<br>±1<br>±5<br>±0.5<br>0<br>3.3<br>2<br>10|Bits<br>LSB<br>LSB<br>mV<br>%<br>V<br>Ω<br>µs|
|LOGIC INPUTS1<br>Input High Voltage, VIH<br>Input Low Voltage, VIL<br>CS<br>Wake-Up Pulse Width<br>Logic 1 Input Current, IIH<br>Logic 0 Input Current, IIL<br>All Pins Except RST<br>RST<br>Pin<br>Input Capacitance, CIN|CS<br>signal to wake up from sleep mode<br>VIH= 3.3 V<br>VIL= 0 V|2.0<br>0.8<br>0.55<br>20<br>±0.2<br>±10<br>40<br>60<br>1<br>10|V<br>V<br>V<br>µs<br>µA<br>μA<br>mA<br>pF|
|DIGITAL OUTPUTS1<br>Output High Voltage, VOH<br>Output Low Voltage, VOL|ISOURCE= 1.6 mA<br>ISINK= 1.6 mA|2.4<br>0.4|V<br>V|
|FLASH MEMORY<br>Data Retention3|Endurance2<br>TJ= 85°C|10,000<br>20|Cycles<br>Years|
|FUNCTIONAL TIMES4<br>Power-On Start-Up Time<br>Reset Recovery Time<br>Sleep Mode Recovery Time<br>Flash Memory Test Time<br>Automatic Self-Test Time|Time until data is available<br>Normal mode, SMPL_PRD ≤ 0x09<br>Low power mode, SMPL_PRD ≥ 0x0A<br>Normal mode, SMPL_PRD ≤ 0x09<br>Low power mode, SMPL_PRD ≥ 0x0A<br>Normal mode, SMPL_PRD ≤ 0x09<br>Low power mode, SMPL_PRD ≥ 0x0A<br>Normal mode, SMPL_PRD ≤ 0x09<br>Low power mode, SMPL_PRD ≥ 0x0A<br>SMPL_PRD = 0x0001|180<br>250<br>60<br>130<br>4<br>9<br>17<br>90<br>12|ms<br>ms<br>ms<br>ms<br>ms<br>ms<br>ms<br>ms<br>ms|
|CONVERSION RATE<br>Clock Accuracy<br>Sync Input Clock5|SMPL_PRD = 0x0001 to 0x00FF|0.413<br>819.2<br>±3<br>0.8<br>1.2|SPS<br>%<br>kHz|
|POWER SUPPLY<br>Power Supply Current|Operating voltage range, VCC<br>Low power mode<br>Normal mode<br>Sleepmode|4.75<br>5.0<br>5.25<br>24<br>49<br>500|V<br>mA<br>mA<br>µA|



- 1 The digital I/O signals are driven by an internal 3.3 V supply, and the inputs are 5 V tolerant. 

- 2 Endurance is qualified as per JEDEC Standard 22, Method A117, and measured at −40°C, +25°C, +85°C, and +125°C. 

> 3 The data retention lifetime equivalent is at a junction temperature (TJ) of 85°C as per JEDEC Standard 22, Method A117. Data retention lifetime decreases with junction temperature. 

> 4 These times do not include thermal settling and internal filter response times (330 Hz bandwidth), which may affect overall accuracy. 

> 5 The sync input clock functions below the specified minimum value, at reduced performance levels. 

Rev. E | Page 4 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **TIMING SPECIFICATIONS** 

TA = 25°C, VCC = 5 V, unless otherwise noted. 

## **Table 2.** 

|**Table 2.**||||||
|---|---|---|---|---|---|
|**Parameter**|**Description**|**Normal Mode**<br>**(SMPL_PRD ≤ 0x09)**<br>**Min1**<br>**Typ**<br>**Max**|**Low Power Mode**<br>**(SMPL_PRD ≥ 0x0A)**<br>**Min**1<br>**Typ**<br>**Max**|**Burst Read**<br>**Min**1<br>**Typ**<br>**Max**|**Unit**|
|fSCLK<br>tSTALL<br>tREADRATE<br>tCS<br>tDAV<br>tDSU<br>tDHD<br>tSCLKR, tSCLKF<br>tDR, tDF<br>tSFS<br>t1<br>tx<br>t2<br>t3|Serial clock<br>Stall period between data<br>Read rate<br>Chip select to SCLK edge<br>DOUT valid after SCLK edge<br>DIN setup time before SCLK rising edge<br>DIN hold time after SCLK rising edge<br>SCLK rise/fall times<br>DOUT rise/fall times<br>CS<br>high after SCLK edge<br>Input sync positive pulse width<br>Input sync low time<br>Input sync to data ready output<br>Input syncperiod|0.01<br>2.0<br>9<br>40<br>48.8<br>100<br>24.4<br>48.8<br>5<br>12.5<br>5<br>12.5<br>5<br>5<br>100<br>600<br>833|0.01<br>0.3<br>75<br>100<br>48.8<br>100<br>24.4<br>48.8<br>5<br>12.5<br>5<br>12.5<br>5|0.01<br>1.0<br>1/fSCLK<br>48.8<br>100<br>24.4<br>48.8<br>5<br>12.5<br>5<br>12.5<br>5<br>5<br>100<br>600<br>833|MHz<br>µs<br>µs<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>ns<br>µs<br>µs<br>µs<br>µs|



1 Guaranteed by design and characterization, but not tested in production. 

## **TIMING DIAGRAMS** 

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CS<br>tCS tSFS<br>1 2 3 4 5 6 15 16<br>SCLK<br>tDAV<br>DOUT MSB DB14 DB13 DB12 DB11 DB10 DB2 DB1 LSB<br>tDSU tDHD<br>DIN R/W A6 A5 A4 A3 A2 D2 D1 LSB<br>Figure 2. SPI Timing and Sequence<br>tREADRATE<br>tSTALL<br>CS<br>SCLK<br>Figure 3. Stall Time and Data Rate<br>t3<br>t2<br>t1 tX<br>SYNC<br>CLOCK (DIO4)<br>DATA<br>READY<br>Figure 4. Input Clock Timing Diagram<br>07570-002<br>07570-003<br>07570-004<br>**----- End of picture text -----**<br>


Rev. E | Page 5 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **ABSOLUTE MAXIMUM RATINGS** 

## **Table 3.** 

|**Table 3.**||
|---|---|
|**Parameter**|**Rating**|
|Acceleration<br>Any Axis, Unpowered<br>Any Axis, Powered<br>VCC to GND<br>Digital Input Voltage to GND<br>Digital Output Voltage to GND<br>Analog Input to GND<br>Operating Temperature Range<br>Storage Temperature Range|2000_g_<br>2000_g_<br>−0.3 V to +6.0 V<br>−0.3 V to +5.3 V<br>−0.3 V to VCC + 0.3 V<br>−0.3 V to +3.6 V<br>−40°C to +105°C<br>−65°C to +125°C1, 2|



- 1 Extended exposure to temperatures outside the specified temperature range of −40°C to +105°C can adversely affect the accuracy of the factory calibration. For best accuracy, store the parts within the specified operating range of −40°C to +105°C. 

2 Although the device is capable of withstanding short-term exposure to 150°C, long-term exposure threatens internal mechanical integrity. 

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 

**Table 4. Package Characteristics** 

|**Package Type **|**θJA**|**θJC**|**Device Weight**|
|---|---|---|---|
|24-Lead Module<br>(ML-24-2)|39.8°C/W|14.2°C/W|16 grams|



## **ESD CAUTION** 

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Rev. E | Page 6 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **PIN CONFIGURATION AND FUNCTION DESCRIPTIONS** 

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ADIS16360/ADIS16365<br>TOP VIEW<br>(Not to Scale)<br>1 3 5 7 9 11 13 15 17 19 21 23<br>2 4 6 8 10 12 14 16 18 20 22 24<br>NOTES<br>1. THIS REPRESENTATION DISPLAYS THE TOP VIEW PINOUT<br>FOR THE MATING SOCKET CONNECTOR.<br>2. THE ACTUAL CONNECTOR PINS ARE NOT VISIBLE FROM<br>   THE TOP VIEW.<br>DIO3 SCLK DIN DIO1 DIO2 VCC GND GND DNC DNC AUX_ADC DNC<br>DIO4/CLKIN DOUT CS RST VCC VCC GND DNC DNC AUX_DAC DNC DNC<br>**----- End of picture text -----**<br>


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3. MATING CONNECTOR: SAMTEC CLM-112-02<br>   OR EQUIVALENT.<br>4. DNC = DO NOT CONNECT.<br>Figure 5. Pin Configuration<br>Z-AXIS<br>aZ<br>gZ<br>Y-AXIS<br>X-AXIS<br>aY<br>aX<br>gY gX<br>PIN 23<br>PIN 1 ORIGIN ALIGNMENT REFERENCE POINTSEE MSC_CTRL[6].<br>07570-005<br>**----- End of picture text -----**<br>


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NOTES<br>**----- End of picture text -----**<br>


**1. ACCELERATION (aX, aY, aZ) AND ROTATIONAL (gX, gY, gZ) ARROWS INDICATE THE DIRECTION OF MOTION THAT PRODUCES A POSITIVE OUTPUT.** 

_Figure 6. Axial Orientation_ 

**Table 5. Pin Function Descriptions** 

|**Pin No.**|**Mnemonic**|**Type1**|**Description**|
|---|---|---|---|
|1<br>2<br>3<br>4<br>5<br>6<br>7, 9<br>8<br>10, 11, 12<br>13, 14, 15<br>16, 17, 18, 19, 22, 23, 24<br>20<br>21|DIO3<br>DIO4/CLKIN<br>SCLK<br>DOUT<br>DIN<br>CS<br>DIO1, DIO2<br>RST<br>VCC<br>GND<br>DNC<br>AUX_DAC<br>AUX_ADC|I/O<br>I/O<br>I<br>O<br>I<br>I<br>I/O<br>I<br>S<br>S<br>N/A<br>O<br>I|Configurable Digital Input/Output.<br>Configurable Digital Input/Output or Sync Clock Input.<br>SPI Serial Clock.<br>SPI Data Output. Clocks output on SCLK falling edge.<br>SPI Data Input. Clocks input on SCLK rising edge.<br>SPI Chip Select.<br>Configurable Digital Input/Output.<br>Reset.<br>Power Supply.<br>Power Ground.<br>Do Not Connect.<br>Auxiliary, 12-Bit DAC Output.<br>Auxiliary, 12-Bit ADC Input.|



1 I/O is input/output, I is input, O is output, S is supply, N/A is not applicable. 

Rev. E | Page 7 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **TYPICAL PERFORMANCE CHARACTERISTICS** 

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0.1<br>+1σ<br>0.01<br>MEAN<br>–1σ<br>0.001<br>0.1 1 10 100 1k 10k<br>Tau (Seconds)<br>VARIANCE (°/sec)<br>ROOT ALLAN<br>07570-007<br>**----- End of picture text -----**<br>


_Figure 7. Gyroscope Allan Variance_ 

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0.01<br>0.001<br>+1σ<br>MEAN<br>–1σ<br>0.0001<br>0.1 1 10 100 1k 10k<br>Tau (Seconds)<br>) g<br>VARIANCE (<br>ROOT ALLAN<br>07570-008<br>**----- End of picture text -----**<br>


_Figure 8. Accelerometer Allan Variance_ 

Rev. E | Page 8 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **THEORY OF OPERATION BASIC OPERATION** 

The ADIS16360/ADIS16365 are autonomous sensor systems that start up after they have a valid power supply voltage and begin producing inertial measurement data at the factory default sample rate setting of 819.2 SPS. After each sample cycle, the sensor data is loaded into the output registers, and DIO1 pulses high, which provides a new data ready control signal for driving system-level interrupt service routines. In a typical system, a master processor accesses the output data registers through the SPI interface, using the connection diagram shown in Figure 9. Table 6 provides a generic functional description for each pin on the master processor. Table 7 describes the typical master processor settings that are normally found in a configuration register and used for communicating with the ADIS16360/ADIS16365. 

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I/O LINES ARE COMPATIBLE WITH 5V<br>3.3V OR 5V LOGIC LEVELS<br>VDD<br>10 11 12<br>SYSTEM<br>PROCESSOR SS 6 CS ADIS16360/<br>SPI MASTER ADIS16365<br>SCLK 3 SCLK SPI SLAVE<br>MOSI 5 DIN<br>MISO 4 DOUT<br>IRQ 7 DIO1<br>13 14 15<br>07570-009<br>**----- End of picture text -----**<br>


_Figure 9. Electrical Connection Diagram_ 

**Table 6. Generic Master Processor Pin Names and Functions** 

|**Pin Name**|**Function**|
|---|---|
|SS<br>SCLK<br>MOSI<br>MISO<br>IRQ|Slave select<br>Serial clock<br>Master output, slave input<br>Master input, slave output<br>Interrupt request|



**Table 7. Generic Master Processor SPI Settings** 

|**Processor Setting**|**Description**|
|---|---|
|Master<br>SCLK Rate ≤ 2 MHz1<br>SPI Mode 3<br>MSB First Mode<br>16-Bit Mode|The ADIS16360/ADIS16365 operate as slaves<br>Normal mode, SMPL_PRD[7:0] ≤ 0x09<br>CPOL = 1 (polarity), CPHA = 1 (phase)<br>Bit sequence<br>Shift register/data length|



The user registers provide addressing for all input/output operations on the SPI interface. Each 16-bit register has two 7-bit addresses: one for its upper byte and one for its lower byte. Table 8 lists the lower byte address for each register, and Figure 10 shows the generic bit assignments. 

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15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0<br>UPPER BYTE LOWER BYTE 07570-010<br>**----- End of picture text -----**<br>


_Figure 10. Generic Register Bit Assignments_ 

## **READING SENSOR DATA** 

Although the ADIS16360/ADIS16365 produce data independently, they operate as SPI slave devices that communicate with system (master) processors using the 16-bit segments displayed in Figure 11. Individual register reads require two of these 16-bit sequences. The first 16-bit sequence contains the read command bit (R/W = 0) and the target register address (A6 to A0); the last eight bits are “don’t care” bits when requesting a read. The second 16-bit sequence transmits the register contents (D15 to D0) on the DOUT line. For example, if DIN = 0x0A00, the contents of the XACCL_OUT register are shifted out on the DOUT line during the next 16-bit sequence. 

The SPI operates in full-duplex mode, which means that the master processor can read the output data from DOUT while using the same SCLK pulses to transmit the next target address on DIN. 

## **DEVICE CONFIGURATION** 

The user register memory map (see Table 8) identifies configuration registers with either a W or R/W. Configuration commands also use the bit sequence shown in Figure 11. If the MSB = 1, the last eight bits (DC7 to DC0) in the DIN sequence are loaded into the memory address associated with the address bits (A6 to A0). For example, if DIN = 0xA11F, 0x1F is loaded into Address 0x21 (XACCL_OFF, upper byte) at the conclusion of the data frame. 

The master processor initiates the backup function by setting GLOB_CMD[3] = 1 (DIN = 0xBE08). This command copies the user registers into their assigned flash memory locations and requires the power supply to stay within its normal operating range for the entire 50 ms process. The FLASH_CNT register provides a running count of these events for monitoring the long-term reliability of the flash memory. 

- 1 For burst read, SCLK rate ≤ 1 MHz. For low power mode, SCLK rate ≤ 300 kHz. 

**==> picture [418 x 87] intentionally omitted <==**

**----- Start of picture text -----**<br>
CS<br>SCLK<br>DIN R/W A6 A5 A4 A3 A2 A1 A0 DC7 DC6 DC5 DC4 DC3 DC2 DC1 DC0 R/W A6 A5<br>DOUT D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D15 D14 D13<br>NOTES<br>1. THE DOUT BIT PATTERN REFLECTS THE ENTIRE CONTENTS OF THE REGISTER IDENTIFIED BY [A6:A0]<br>    IN THE PREVIOUS 16-BIT DIN SEQUENCE WHEN R/W = 0.<br>2. IF R/W = 1 DURING THE PREVIOUS SEQUENCE, DOUT IS NOT DEFINED. 07570-011<br>**----- End of picture text -----**<br>


_Figure 11. SPI Communication Bit Sequence_ 

Rev. E | Page 9 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **MEMORY MAP** 

**Table 8. User Register Memory Map** 

|**Name**|**User Access**|**Flash Backup**|**Address1**|**Default**|**Register Description**|**Bit Function**|
|---|---|---|---|---|---|---|
|FLASH_CNT<br>SUPPLY_OUT<br>XGYRO_OUT<br>YGYRO_OUT<br>ZGYRO_OUT<br>XACCL_OUT<br>YACCL_OUT<br>ZACCL_OUT<br>XTEMP_OUT<br>YTEMP_OUT<br>ZTEMP_OUT<br>AUX_ADC<br>Reserved<br>XGYRO_OFF<br>YGYRO_OFF<br>ZGYRO_OFF<br>XACCL_OFF<br>YACCL_OFF<br>ZACCL_OFF<br>ALM_MAG1<br>ALM_MAG2<br>ALM_SMPL1<br>ALM_SMPL2<br>ALM_CTRL<br>AUX_DAC<br>GPIO_CTRL<br>MSC_CTRL<br>SMPL_PRD<br>SENS_AVG<br>SLP_CNT<br>DIAG_STAT<br>GLOB_CMD<br>Reserved<br>LOT_ID1<br>LOT_ID2<br>PROD_ID<br>PROD_ID<br>SERIAL_NUM|Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only<br>N/A<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Read/write<br>Write only<br>Read only<br>Write only<br>N/A<br>Read only<br>Read only<br>Read only<br>Read only<br>Read only|Yes<br>No<br>No<br>No<br>No<br>No<br>No<br>No<br>No<br>No<br>No<br>No<br>N/A<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes<br>No<br>No<br>Yes<br>Yes<br>Yes<br>No<br>No<br>No<br>N/A<br>Yes<br>Yes<br>Yes<br>Yes<br>Yes|0x00<br>0x02<br>0x04<br>0x06<br>0x08<br>0x0A<br>0x0C<br>0x0E<br>0x10<br>0x12<br>0x14<br>0x16<br>0x18<br>0x1A<br>0x1C<br>0x1E<br>0x20<br>0x22<br>0x24<br>0x26<br>0x28<br>0x2A<br>0x2C<br>0x2E<br>0x30<br>0x32<br>0x34<br>0x36<br>0x38<br>0x3A<br>0x3C<br>0x3E<br>0x40 to 0x51<br>0x52<br>0x54<br>0x56<br>0x56<br>0x58|N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>N/A<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0000<br>0x0006<br>0x0001<br>0x0402<br>0x0000<br>0x0000<br>0x0000<br>N/A<br>N/A<br>N/A<br>0x3FE8<br>0x3FED<br>N/A|Flash memory write count<br>Power supply measurement<br>X-axis gyroscope output<br>Y-axis gyroscope output<br>Z-axis gyroscope output<br>X-axis accelerometer output<br>Y-axis accelerometer output<br>Z-axis accelerometer output<br>X-axis gyroscope temperature output<br>Y-axis gyroscope temperature output<br>Z-axis gyroscope temperature output<br>Auxiliary ADC output<br>Reserved<br>X-axis gyroscope bias offset factor<br>Y-axis gyroscope bias offset factor<br>Z-axis gyroscope bias offset factor<br>X-axis acceleration bias offset factor<br>Y-axis acceleration bias offset factor<br>Z-axis acceleration bias offset factor<br>Alarm 1 amplitude threshold<br>Alarm 2 amplitude threshold<br>Alarm 1 sample size<br>Alarm 2 sample size<br>Alarm control<br>Auxiliary DAC data<br>Auxiliary digital input/output control<br>Data ready, self-test, miscellaneous<br>Internal sample period (rate) control<br>Dynamic range and digital filter control<br>Sleep mode control<br>System status<br>System commands<br>Reserved<br>Lot Identification Code 1<br>Lot Identification Code 2<br>Product identification, ADIS16360<br>Product identification, ADIS16365<br>Serial number|N/A<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>See Table 9<br>N/A<br>See Table 15<br>See Table 15<br>See Table 15<br>See Table 16<br>See Table 16<br>See Table 16<br>See Table 27<br>See Table 27<br>See Table 28<br>See Table 28<br>See Table 29<br>See Table 23<br>See Table 21<br>See Table 22<br>See Table 18<br>See Table 20<br>See Table 19<br>See Table 26<br>See Table 17<br>N/A<br>See Table 32<br>See Table 32<br>See Table 32<br>See Table 32<br>See Table 32|



1 Each register contains two bytes. The address of the lower byte is displayed. The address of the upper byte is equal to the address of the lower byte plus 1. 

Rev. E | Page 10 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **BURST READ DATA COLLECTION** 

Burst read data collection is a process-efficient method for collecting data from the ADIS16360/ADIS16365. In a burst read, all output data registers are clocked out on DOUT, 16 bits at a time, in sequential data cycles (each separated by one SCLK period). To start a burst read sequence, set DIN = 0x3E00. The contents of each output data register are then shifted out on DOUT, starting with SUPPLY_OUT and ending with AUX_ADC (see Figure 13) in order by address (see Table 8). 

## **OUTPUT DATA REGISTERS** 

Each output data register uses the format in Figure 12 and Table 9. Figure 6 shows the positive direction for each inertial sensor. The ND bit is equal to 1 when the register contains unread data. The EA bit is high when any error/alarm flag in the DIAG_STAT register is equal to 1. 

## **MSB FOR  14-BIT OUTPUT** 

**==> picture [23 x 15] intentionally omitted <==**

**----- Start of picture text -----**<br>
ND EA<br>**----- End of picture text -----**<br>


**==> picture [102 x 25] intentionally omitted <==**

**----- Start of picture text -----**<br>
MSB FOR 12-BIT OUTPUT 07570-012<br>**----- End of picture text -----**<br>


_Figure 12. Output Data Register Bit Assignments_ 

**Table 11. Rotation Rate, Twos Complement Format** 

|<br>**Decimal**|**Hex**|**Binary**|
|---|---|---|
|+6000 LSB<br>+2 LSB<br>+1 LSB<br>0 LSB<br>−1 LSB<br>−2 LSB<br>−6000 LSB|0x1770<br>0x0002<br>0x0001<br>0x0000<br>0x3FFF<br>0x3FFE<br>0x2890|XX01 0111 0111 0000<br>XX00 0000 0000 0010<br>XX00 0000 0000 0001<br>XX00 0000 0000 0000<br>XX11 1111 1111 1111<br>XX11 1111 1111 1110<br>XX10 1000 1001 0000|



**Table 12. Acceleration, Twos Complement Format** 

|**Decimal**|**Hex**|**Binary**|
|---|---|---|
|+5401 LSB<br>+2 LSB<br>+1 LSB<br>0 LSB<br>−1 LSB<br>−2 LSB<br>−5401 LSB|0x1519<br>0x0002<br>0x0001<br>0x0000<br>0x3FFF<br>0x3FFE<br>0x2AE7|XX01 0101 0001 1001<br>XX00 0000 0000 0010<br>XX00 0000 0000 0001<br>XX00 0000 0000 0000<br>XX11 1111 1111 1111<br>XX11 1111 1111 1110<br>XX10 1010 1110 0111|



**Table 9. Output Data Register Formats** 

|**Register**|**Bits**|**Scale**|**Reference**|
|---|---|---|---|
|SUPPLY_OUT|12|2.418 mV|See Table 10|
|XGYRO_OUT1|14|0.05°/sec|See Table 11|
|YGYRO_OUT1|14|0.05°/sec|See Table 11|
|ZGYRO_OUT1|14|0.05°/sec|See Table 11|
|XACCL_OUT|14|3.333 m_g_|See Table 12|
|YACCL_OUT|14|3.333 m_g_|See Table 12|
|ZACCL_OUT|14|3.333 m_g_|See Table 12|
|XTEMP_OUT2|12|0.136°C|See Table 13|
|YTEMP_OUT2|12|0.136°C|See Table 13|
|ZTEMP_OUT2|12|0.136°C|See Table 13|
|AUX_ADC|12|805.8µV|See Table 14|



**Table 13. Temperature, Twos Complement Format** 

|**Decimal**|**Hex**|**Binary**|
|---|---|---|
|+588 LSB<br>+441 LSB<br>+2 LSB<br>+1 LSB<br>0 LSB<br>−1 LSB<br>−2 LSB<br>−478 LSB|0x24C<br>0x1B9<br>0x002<br>0x001<br>0x000<br>0xFFF<br>0xFFE<br>0xE22|XXXX 0010 0100 1100<br>XXXX 0001 1011 1001<br>XXXX 0000 0000 0010<br>XXXX 0000 0000 0001<br>XXXX 0000 0000 0000<br>XXXX 1111 1111 1111<br>XXXX 1111 1111 1110<br>XXXX 1110 0010 0010|



**Table 14. Analog Input, Offset Binary Format** 

||**Input Voltage **|**Decimal**|**Hex**|**Binary**|
|---|---|---|---|---|
||3.3 V|4095 LSB|0xFFF|XXXX 1111 1111 1111|
||1 V|1241 LSB|0x4D9|XXXX 0100 1101 1001|
||1.6116 mV|2 LSB|0x002|XXXX 0000 0000 0010|
||805.8 µV|1 LSB|0x001|XXXX 0000 0000 0001|
||0 V|0 LSB|0x000|XXXX 0000 0000 0000|



1 Assumes that the scaling is set to ±300°/sec. This factor scales with the range. 2 0x0000 = 25°C (±5°C). 

**Table 10. Power Supply, Offset Binary Format** 

|||||||<br>**Decimal**|**Hex**|**Binary**|
|---|---|---|---|---|---|---|---|---|
|||||||4095 LSB<br>1241 LSB|0xFFF<br>0x4D9|XXXX 1111 1111 1111<br>XXXX 0100 1101 1001|
|**Supply Voltage **<br>**De**||**cimal**<br>**Hex**|**Binary**<br>XXXX 1000 0111 1011<br>XXXX 1000 0001 0101<br>XXXX 1000 0001 0100<br>XXXX 1000 0001 0011<br>XXXX 0111 1010 1100||1.6116 mV<br>805.8 µV<br>0 V|2 LSB<br>1 LSB<br>0 LSB|0x002<br>0x001<br>0x000|XXXX 0000 0000 0010<br>XXXX 0000 0000 0001<br>XXXX 0000 0000 0000|
|5.25 V<br>21<br>5.002418 V<br>20<br>5 V<br>20<br>4.997582 V<br>20<br>4.75 V<br>19||71 LSB<br>0x87B<br>69 LSB<br>0x815<br>68 LSB<br>0x814<br>67 LSB<br>0x813<br>64 LSB<br>0x7AC|||||||
||||||||||
|||||||||**OUGH AUX_ADC.**<br>07570-013|
|**0x3E**<br>**PRE**<br>**1**<br>**CS**<br>**SCLK**<br>**DIN**<br>**DOUT**<br>**NOTES**<br>**1. THE DOUT LINE H**|||||||||
||**1**<br>**CS**<br>**LK**|**2**|**3**<br>**4**||**5**|**12**|||
||||||||||
||||||||||
||||||||||
|||**00**<br>**DON’T**|**CARE**||||||
||||||||||
||||||||||
|||**VIOUS**<br>**SUPPLY**|**_OUT**<br>**XGYR**|**O_OUT**<br>**YGYRO**|**_OUT**<br>**ZGYRO_**|**AUX_**<br>**OUT**|||



_Figure 13. Burst Read Sequence_ 

Rev. E | Page 11 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **CALIBRATION** 

## _**Manual Bias Calibration**_ 

The bias offset registers in Table 15 and Table 16 provide a manual adjustment function for the output of each sensor. For example, if XGYRO_OFF = 0x1FF6 (DIN = 0x9B1F, 0x9AF6), the XGYRO_OUT offset shifts by −10 LSBs, or −0.125°/sec. 

## **Table 15. XGYRO_OFF, YGYRO_OFF, ZGYRO_OFF Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:13]<br>[12:0]|Not used.<br>Data bits. Twos complement, 0.0125°/sec per LSB.<br>Typical adjustment range = ±50°/sec.|



## **Table 16. XACCL_OFF, YACCL_OFF, ZACCL_OFF Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:12]<br>[11:0]|Not used.<br>Data bits. Twos complement, 3.333 m_g_/LSB.<br>Typical adjustment range = ±6.7_g._|



## _**Gyroscope Automatic Bias Null Calibration**_ 

Set GLOB_CMD[0] = 1 (DIN = 0xBE01) to execute the automatic bias null calibration function. This function measures all three gyroscope output registers and then loads each gyroscope offset register with the opposite value to provide a quick bias calibration. All sensor data is then reset to 0, and the flash memory is updated automatically within 50 ms (see Table 17). 

## _**Gyroscope Precision Automatic Bias Null Calibration**_ 

Set GLOB_CMD[4] = 1 (DIN = 0xBE10) to execute the precision automatic bias null calibration function. This function takes the sensor offline for 30 sec while it collects a set of data and calculates more accurate bias correction factors for each gyroscope. After this function is executed, the newly calculated correction factor is loaded into the gyroscope offset registers, all sensor data is reset to 0, and the flash memory is updated automatically within 50 ms (see Table 17). 

## _**Restoring Factory Calibration**_ 

Set GLOB_CMD[1] = 1 (DIN = 0xBE02) to execute the factory calibration restore function. This function resets each user calibration register to 0x0000 (see Table 15 and Table 16), resets all sensor data to 0, and automatically updates the flash memory within 50 ms (see Table 17). 

## _**Linear Acceleration Bias Compensation (Gyroscope)**_ 

Set MSC_CTRL[7] = 1 (DIN = 0xB486) to enable correction for low frequency acceleration influences on gyroscope bias. The DIN sequence also preserves the factory default condition for the data ready function (see Table 22). 

## **OPERATIONAL CONTROL** 

## _**Global Commands**_ 

The GLOB_CMD register provides trigger bits for several useful functions. Setting the assigned bit to 1 starts each operation, which returns the bit to 0 after completion. For example, set GLOB_CMD[7] = 1 (DIN = 0xBE80) to execute a software reset, which stops the sensor operation and runs the device through its start-up sequence. This sequence includes loading the control registers with the data in their respective flash memory locations prior to producing new data. Reading the GLOB_CMD register (DIN = 0x3E00) starts the burst read sequence. 

**Table 17. GLOB_CMD Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:8]<br>[7]<br>[6:5]<br>[4]<br>[3]<br>[2]<br>[1]<br>[0]|Not used<br>Software reset command<br>Not used<br>Precision autonull command<br>Flash update command (see the Device Configuration<br>section)<br>Auxiliary DAC data latch (see the Auxiliary DAC section)<br>Factory calibration restore command<br>Autonull command|



## _**Internal Sample Rate**_ 

The SMPL_PRD register provides discrete sample period settings using the bit assignments in Table 18 and the following equation: 

_tS_ = _tB_ × ( _NS_ + 1) 

To calculate the internal sample rate, divide 1 by the sample period (tS). For example, when SMPL_PRD[7:0] = 0x0A, the sample rate is 149 SPS. 

## **Table 18. SMPL_PRD Bit Descriptions** 

|**Bits**|**Description (Default = 0x0001)**|
|---|---|
|[15:8]<br>[7]<br>[6:0]|Not used<br>Time base (tB)<br>0 = 0.61035 ms, 1 = 18.921 ms<br>Increment setting (NS)<br>Internal sampleperiod = tS= tB× (NS+ 1)|



The default sample rate setting of 819.2 SPS preserves the sensor bandwidth and provides optimal performance. For systems that value slower sample rates, keep the internal sample rate at 819.2 SPS. Use the programmable filter (SENS_AVG) to reduce the bandwidth, which helps to prevent aliasing. The data ready function (MSC_CTRL) can drive an interrupt routine that uses a counter to help ensure data coherence at the reduced rates. 

Rev. E | Page 12 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## _**Power Management**_ 

Setting SMPL_PRD ≥ 0x0A also sets the sensor to low power mode. For systems that require lower power dissipation, insystem characterization helps users to quantify the associated performance trade-offs. In addition to sensor performance, this mode affects SPI data rates (see Table 2). Set SLP_CNT[8] = 1 (DIN = 0xBB01) to start the indefinite sleep mode, which requires a CS assertion (high to low), reset, or power cycle to wake up. Use SLP_CNT[7:0] to put the device into sleep mode for a specified period. For example, SLP_CNT[7:0] = 0x64 (DIN = 0xBA64) puts the ADIS16360/ADIS16365 to sleep for 50 sec. 

**Table 19. SLP_CNT Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:9]<br>[8]<br>[7:0]|Not used<br>Indefinite sleep mode; set to 1<br>Programmable sleeptime bits, 0.5 sec/LSB|



## _**Sensor Bandwidth**_ 

The signal chain for each MEMS sensor has several filter stages, which shape their frequency response. Figure 14 provides a block diagram for both gyroscope and accelerometer signal paths. Table 20 provides additional information for digital filter configuration. 

**==> picture [236 x 77] intentionally omitted <==**

**----- Start of picture text -----**<br>
FROM<br>GYROSCOPE N N<br>SENSOR LPF LPF<br>404Hz 757Hz<br>FROM<br>ACCELERATION N N<br>SENSOR LPF<br>330Hz<br>N = 2 [m]<br>m = SENS_AVG[2:0] 07570-114<br>**----- End of picture text -----**<br>


_Figure 14. MEMS Analog and Digital Filters_ 

## _**Digital Filtering**_ 

The N blocks in Figure 14 are part of the programmable low-pass filter, which provides additional noise reduction on the inertial sensor outputs. This filter contains two cascaded averaging filters that provide a Bartlett window, FIR filter response (see Figure 15). For example, set SENS_AVG[2:0] = 100 (DIN = 0xB804) to set each stage to 16 taps. When used with the default sample rate of 819.2 SPS, this value reduces the sensor bandwidth to approximately 16 Hz. 

**==> picture [217 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
0<br>–20<br>–40<br>–60<br>–80<br>–100<br>N = 2<br>–120 N = 4<br>N = 16<br>N = 64<br>–140<br>0.001 0.01 0.1 1<br>FREQUENCY (f/fS)<br>MAGNITUDE (dB)<br>07570-014<br>**----- End of picture text -----**<br>


_Figure 15. Bartlett Window, FIR Filter Frequency Response (Phase Delay = N Samples)_ 

## _**Dynamic Range**_ 

The SENS_AVG[10:8] bits provide three dynamic range settings for this gyroscope. The lower dynamic range settings (±75°/sec and ±150°/sec) limit the minimum filter tap sizes to maintain resolution. For example, set SENS_AVG[10:8] = 010 (DIN = 0xB902) for a measurement range of ±150°/sec. Because this setting can influence the filter settings, program SENS_AVG[10:8] and then SENS_AVG[2:0] if more filtering is required. 

## **Table 20. SENS_AVG Bit Descriptions** 

|**Bits**|**Description (Default = 0x0402)**|
|---|---|
|[15:11]<br>[10:8]<br>[7:3]<br>[2:0]|Not used<br>Measurement range (sensitivity) selection<br>100 = ±300°/sec (default condition)<br>010 = ±150°/sec, filter taps ≥ 4 (Bits[2:0] ≥ 0x02)<br>001 = ±75°/sec, filter taps ≥ 16 (Bits[2:0] ≥ 0x04)<br>Not used<br>Number of taps in each stage; value of m in N = 2m|



Rev. E | Page 13 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **INPUT/OUTPUT FUNCTIONS** 

## _**General-Purpose I/O**_ 

DIO1, DIO2, DIO3, and DIO4 are configurable, general-purpose I/O lines that serve multiple purposes according to the following control register priority: MSC_CTRL, ALM_CTRL, and GPIO_CTRL. For example, set GPIO_CTRL = 0x080C (DIN = 0xB308, and then 0xB20C) to configure DIO1 and DIO2 as inputs and DIO3 and DIO4 as outputs, with DIO3 set low and DIO4 set high. 

In this configuration, read GPIO_CTRL (DIN = 0x3200). The digital state of DIO1 and DIO2 is in GPIO_CTRL[9:8]. 

## **Table 21. GPIO_CTRL Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:12]|Not used|
|[11]|General-Purpose I/O Line 4 (DIO4) data level|
|[10]|General-Purpose I/O Line 3 (DIO3) data level|
|[9]|General-Purpose I/O Line 2 (DIO2) data level|
|[8]|General-Purpose I/O Line 1 (DIO1) data level|
|[7:4]|Not used|
|[3]|General-Purpose I/O Line 4 (DIO4) direction control|
||(1 = output, 0 = input)|



- [2] General-Purpose I/O Line 3 (DIO3) direction control (1 = output, 0 = input) 

- [1] General-Purpose I/O Line 2 (DIO2) direction control (1 = output, 0 = input) 

- [0] General-Purpose I/O Line 1 (DIO1) direction control (1 = output, 0 = input) 

## _**Input Clock Configuration**_ 

The input clock function allows for external control of sampling in the ADIS16360/ADIS16365. Set GPIO_CTRL[3] = 0 (DIN = 0xB200) and SMPL_PRD[7:0] = 0x00 (DIN = 0xB600) to enable this function. See Table 2 and Figure 4 for timing information. 

## _**Data Ready I/O Indicator**_ 

The factory default sets DIO1 as a positive data ready indicator signal. The MSC_CTRL[2:0] bits provide configuration options for changing the default. For example, set MSC_CTRL[2:0] = 100 (DIN = 0xB404) to change the polarity of the data ready signal on DIO1 for interrupt inputs that require negative logic inputs for activation. The pulse width is between 100 µs and 200 µs over all conditions. 

## **Table 22. MSC_CTRL Bit Descriptions** 

|**Bits**|**Description (Default = 0x0006)**|
|---|---|
|[15:12]<br>[11]<br>[10]<br>[9]<br>[8]<br>[7]<br>[6]<br>[5:3]<br>[2]<br>[1]<br>[0]|Not used<br>Memory test (cleared upon completion)<br>(1 = enabled, 0 = disabled)<br>Internal self-test enable (cleared upon completion)<br>(1 = enabled, 0 = disabled)<br>Manual self-test, negative stimulus<br>(1 = enabled, 0 = disabled)<br>Manual self-test, positive stimulus<br>(1 = enabled, 0 = disabled)<br>Linear acceleration bias compensation for gyroscopes<br>(1 = enabled, 0 = disabled)<br>Linear accelerometer origin alignment<br>(1 = enabled, 0 = disabled)<br>Not used<br>Data ready enable<br>(1 = enabled, 0 = disabled)<br>Data ready polarity<br>(1 = active high, 0 = active low)<br>Data ready line select<br>(1 = DIO2, 0 = DIO1)|



## _**Auxiliary DAC**_ 

The 12-bit AUX_DAC line can drive its output to within 5 mV of the ground reference when it is not sinking current. As the output approaches 0 V, the linearity begins to degrade (~100 LSB starting point). As the sink current increases, the nonlinear range increases. The DAC latch command moves the values of the AUX_DAC register into the DAC input register, enabling both bytes to take effect at the same time. 

## **Table 23. AUX_DAC Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:12]<br>[11:0]|Not used<br>Data bits, scale factor = 0.8059 mV/LSB<br>Offset binaryformat, 0 V = 0 LSB|



## **Table 24. Setting AUX_DAC = 1 V** 

|**DIN**|**Description**|
|---|---|
|0xB0D9<br>0xB104<br>0xBE04|AUX_DAC[7:0] = 0xD9 (217 LSB).<br>AUX_DAC[15:8] = 0x04 (1024 LSB).<br>GLOB_CMD[2] = 1.<br>Move values into the DAC input register, resulting in<br>a 1 V output level.|



Rev. E | Page 14 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **DIAGNOSTICS** 

## _**Self-Test**_ 

The self-test function allows the user to verify the mechanical integrity of each MEMS sensor. It applies an electrostatic force to each sensor element, which results in mechanical displacement that simulates a response to actual motion. Table 1 lists the expected response for each sensor and provides pass/fail criteria. 

Set MSC_CTRL[10] = 1 (DIN = 0xB504) to run the internal self-test routine, which exercises all inertial sensors, measures each response, makes pass/fail decisions, and reports them to error flags in the DIAG_STAT register. MSC_CTRL[10] resets itself to 0 after completing the routine. The MSC_CTRL[9:8] bits provide manual control over the self-test function for investigation of potential failures. Table 25 outlines an example test flow for using this option to verify the x-axis gyroscope function. 

**Table 25. Manual Self-Test Example Sequence** 

|**DIN**|**Description**|
|---|---|
|0xB601<br>0xB904<br>0xB802<br>0x0400<br>0xB502<br>0x0400<br>0xB501<br>0x0400<br>0xB500|SMPL_PRD[7:0] = 0x01, sample rate = 819.2 SPS.<br>SENS_AVG[15:8] = 0x04, gyro range = ±300°/sec.<br>SENS_AVG[7:0] = 0x02, four-tap averaging filter.<br>Delay = 50 ms.<br>Read XGYRO_OUT.<br>MSC_CTRL[9:8] = 10, gyroscope negative self-test.<br>Delay = 50 ms.<br>Read XGYRO_OUT.<br>Determine whether the bias in the gyroscope<br>output changed according to the self-test response<br>specified in Table 1.<br>MSC_CTRL[9:8] = 01, gyroscope/accelerometer<br>positive self-test.<br>Delay = 50 ms.<br>Read XGYRO_OUT.<br>Determine whether the bias in the gyroscope<br>output changed according to the self-test response<br>specified in Table 1.<br>MSC_CTRL[15:8] = 0x00.|



Zero motion provides results that are more reliable. The settings in Table 25 are flexible and allow for optimization around speed and noise influence. For example, using fewer filtering taps decreases delay times but increases the possibility of noise influence. 

## _**Status**_ 

The error flags provide indicator functions for common system level issues. All of the flags are cleared (set to 0) after each DIAG_STAT register read cycle. If an error condition remains, the error flag returns to 1 during the next sample cycle. The DIAG_STAT[1:0] bits do not require a read of this register to return to 0. If the power supply voltage goes back into range, these two flags are cleared automatically. 

## **Table 26. DIAG_STAT Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15]<br>[14]<br>[13]<br>[12]<br>[11]<br>[10]<br>[9]<br>[8]<br>[7]<br>[6]<br>[5]<br>[4]<br>[3]<br>[2]<br>[1]<br>[0]|Z-axis accelerometer self-test failure (1 = fail, 0 = pass)<br>Y-axis accelerometer self-test failure (1 = fail, 0 = pass)<br>X-axis accelerometer self-test failure (1 = fail, 0 = pass)<br>Z-axis gyroscope self-test failure (1 = fail, 0 = pass)<br>Y-axis gyroscope self-test failure (1 = fail, 0 = pass)<br>X-axis gyroscope self-test failure (1 = fail, 0 = pass)<br>Alarm 2 status (1 = active, 0 = inactive)<br>Alarm 1 status (1 = active, 0 = inactive)<br>Not used<br>Flash test, checksum flag (1 = fail, 0 = pass)<br>Self-test diagnostic error flag (1 = fail, 0 = pass)<br>Sensor overrange (1 = fail, 0 = pass)<br>SPI communication failure (1 = fail, 0 = pass)<br>Flash update failure (1 = fail, 0 = pass)<br>Power supply > 5.25 V<br>1 = power supply > 5.25 V, 0 = power supply ≤ 5.25 V<br>Power supply < 4.75 V<br>1 =power supply< 4.75 V, 0 =power supply≥ 4.75 V|



## _**Alarm Registers**_ 

The alarm function provides monitoring for two independent conditions. The ALM_CTRL register provides control inputs for data source, data filtering (prior to comparison), static comparison, dynamic rate-of-change comparison, and output indicator configurations. The ALM_MAGx registers establish the trigger threshold and polarity configurations. Table 30 gives an example of how to configure a static alarm. The ALM_SMPLx registers provide the numbers of samples to use in the dynamic rate-of-change configuration. The period equals the number in the ALM_SMPLx register multiplied by the sample period time, which is established by the SMPL_PRD register. See Table 31 for an example of how to configure the sensor for this type of function. 

## _**Memory Test**_ 

Setting MSC_CTRL[11] = 1 (DIN = 0xB508) performs a checksum verification of the flash memory locations. The pass/fail result is loaded into DIAG_STAT[6]. 

Rev. E | Page 15 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **Table 27. ALM_MAG1, ALM_MAG2 Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15]<br>[14]<br>[13:0]|Comparison polarity<br>(1 = greater than, 0 = less than)<br>Not used<br>Data bits that match the format of the trigger source<br>selection|



## **Table 28. ALM_SMPL1, ALM_SMPL2 Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:8]<br>[7:0]|Not used<br>Data bits: number of samples (both 0x00 and 0x01 = 1)|



## **Table 29. ALM_CTRL Bit Descriptions** 

|**Bits**|**Description (Default = 0x0000)**|
|---|---|
|[15:12]<br>[11:8]<br>[7]<br>[6]<br>[5]<br>[4]<br>[3]<br>[2]<br>[1]<br>[0]|Alarm 2 source selection<br>0000 = disable<br>0001 = power supply output<br>0010 = x-axis gyroscope output<br>0011 = y-axis gyroscope output<br>0100 = z-axis gyroscope output<br>0101 = x-axis accelerometer output<br>0110 = y-axis accelerometer output<br>0111 = z-axis accelerometer output<br>1000 = x-axis gyroscope temperature output<br>1001 = y-axis gyroscope temperature output<br>1010 = z-axis gyroscope temperature output<br>1011 = auxiliary ADC input<br>Alarm 1 source selection (same as Alarm 2)<br>Rate-of-change enable for Alarm 2<br>(1 = rate of change, 0 = static level)<br>Rate-of-change enable for Alarm 1<br>(1 = rate of change, 0 = static level)<br>Not used<br>Comparison data filter setting<br>(1 = filtered data, 0 = unfiltered data)<br>Not used<br>Alarm output enable<br>(1 = enabled, 0 = disabled)<br>Alarm output polarity<br>(1 = active high, 0 = active low)<br>Alarm output line select<br>(1 = DIO2, 0 = DIO1)|



## **Table 30. Alarm Configuration Example 1** 

|**DIN**|**Description**|
|---|---|
|0xAF55,<br>0xAE17|ALM_CTRL = 0x5517.<br>Alarm 1 input = XACCL_OUT.<br>Alarm 2 input = XACCL_OUT.<br>Static level comparison, filtered data.<br>DIO2 output indicator,positivepolarity.|
|0xA700,<br>0xA696|ALM_MAG1 = 0x8096.<br>Alarm 1 is true if XACCL_OUT > +0.5_g_.|
|0xA937,<br>0xA86A|ALM_MAG2 = 0x376A.<br>Alarm 2 is true if XACCL_OUT < −0.5_g_.|



## **Table 31. Alarm Configuration Example 2** 

|**DIN**|**Description**|
|---|---|
|0xAF76,<br>0xAEC7|ALM_CTRL = 0x76C7.<br>Alarm 1 input = YACCL_OUT.<br>Alarm 2 input = ZACCL_OUT.<br>Rate-of-change comparison, unfiltered data.<br>DIO2 output indicator,positivepolarity.|
|0xB601|SMPL_PRD = 0x0001.<br>Sample rate = 819.2 SPS.|
|0xAA08|ALM_SMPL1 = 0x0008.<br>Alarm 1 rate-of-changeperiod = 9.77 ms.|
|0xAC50|ALM_SMPL2 = 0x0050.<br>Alarm 2 rate-of-changeperiod = 97.7 ms.|
|0xA700,<br>0xA696|ALM_MAG1 = 0x8096.<br>Alarm 1 is true if YACCL_OUT increases by more than<br>0.5_g_in 9.77 ms.|
|0xA937,<br>0xA86A|ALM_MAG2 = 0x376A.<br>Alarm 2 is true if ZACCL_OUT decreases by more<br>than 0.5_g_in 97.7 ms.|



## **PRODUCT IDENTIFICATION** 

Table 32 provides a summary of the registers that identify the product: PROD_ID, which identifies the product type; LOT_ID1 and LOT_ID2, the 32-bit lot identification code; and SERIAL_NUM, which displays the 12-bit serial number. All four registers are two bytes in length. When using the SERIAL_NUM value to calculate the serial number, mask off the upper four bits and convert the remaining 12 bits to a decimal number. 

**Table 32. Identification Registers** 

|**Register Name**|**Address**|**Description**|
|---|---|---|
|LOT_ID1<br>LOT_ID2<br>PROD_ID<br>SERIAL_NUM|0x52<br>0x54<br>0x56<br>0x58|Lot Identification Code 1<br>Lot Identification Code 2<br>Product identification:<br>0x3FE8 (16,360)<br>0x3FED (16,365)<br>Serial number|



Rev. E | Page 16 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **APPLICATIONS INFORMATION INSTALLATION/HANDLING** 

For ADIS16360/ADIS16365 installation, use the following two-step process: 

1. Secure the baseplate using machine screws. 

2. Press the connector into its mate. 

For removal, 

1. Gently pry the connector from its mate using a small slot screwdriver. 

2. Remove the screws and lift the part up. 

Never attempt to unplug the connector by pulling on the plastic case or baseplate. Although the flexible connector is very reliable in normal operation, it can break when subjected to unreasonable handling. When broken, the flexible connector cannot be repaired. The AN-1041 Application Note, _iSensor® IMU Quick Start Guide and Bias Optimization Tips_ , provides more information about developing an appropriate mechanical interface design. 

## **GYROSCOPE BIAS OPTIMIZATION** 

The factory calibration addresses initial bias errors along with temperature-dependent bias behaviors. Installation and certain environmental conditions can introduce modest bias errors. The precision autonull command (GLOB_CMD[4]) provides a simple predeployment method for correcting these errors to an accuracy of approximately 0.008°/sec, using an average of 30 sec. Averaging the sensor output data for 100 sec can provide incremental performance gains, as well. Controlling device rotation, power supply, and temperature during these averaging times helps to ensure optimal accuracy during this process. Refer to the AN-1041 Application Note for more information about optimizing performance. 

## **INPUT ADC CHANNEL** 

The AUX_ADC register provides access to the auxiliary ADC input channel. The ADC is a 12-bit successive approximation converter that has an input circuit equivalent to the one shown in Figure 16. The maximum input is 3.3 V. The ESD protection diodes can handle 10 mA without causing irreversible damage. The on resistance (R1) of the switch has a typical value of 100 Ω. The sampling capacitor, C2, has a typical value of 16 pF. 

## **INTERFACE PRINTED CIRCUIT BOARD (PCB)** 

The ADIS16360/PCBZ includes one ADIS16360BMLZ and one interface PCB. The ADIS16365/PCBZ includes one ADIS16365BMLZ and one interface PCB. The interface PCB simplifies the process of integrating these products into an existing processor system. 

J1 and J2 are dual-row, 2 mm (pitch) connectors that work with a number of ribbon cable systems, including 3M Part Number 152212-0100-GB (ribbon crimp connector) and 3M Part Number 3625/12 (ribbon cable). Figure 17 provides a hole pattern design for installing the ADIS16360BMLZ/ ADIS16365BMLZ and the interface PCB onto the same surface. Figure 18 provides the pin assignments for each connector. The pin descriptions match those listed in Table 5. The ADIS16360/ADIS16365 do not require external capacitors for normal operation; therefore, the interface PCB does not use the C1/C2 pads (not shown in Figure 17). 

**==> picture [215 x 146] intentionally omitted <==**

**----- Start of picture text -----**<br>
23.75 21.24<br>J2<br>1 2<br>11 12<br>30.10 27.70<br>J1<br>1 2<br>1.20<br>11 12<br>NOTES<br>1. DIMENSIONS IN MILLIMETERS. 07570-016<br>**----- End of picture text -----**<br>


_Figure 17. Physical Diagram for the ADIS16360/PCBZ and ADIS16365/PCBZ_ 

**==> picture [219 x 73] intentionally omitted <==**

**----- Start of picture text -----**<br>
J1 J2<br>RST 1 2 SCLK AUX_ADC 1 2 GND<br>CS 3 4 DOUT AUX_DAC 3 4 DIO3<br>DNC 5 6 DIN GND 5 6 DIO4<br>GND 7 8 GND DNC 7 8 DNC<br>GND 9 10 VCC DNC 9 10 DNC<br>VCC 11 12 VCC DIO2 11 12 DIO1<br>07570-017<br>**----- End of picture text -----**<br>


_Figure 18. J1/J2 Pin Assignments_ 

**==> picture [134 x 90] intentionally omitted <==**

**----- Start of picture text -----**<br>
VCC<br>D<br>R1 C2<br>C1 D<br>Figure 16. Equivalent Analog Input Circuit<br>(Conversion Phase: Switch Open,<br>Track Phase: Switch Closed)<br>07570-015<br>**----- End of picture text -----**<br>


Rev. E | Page 17 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **OUTLINE DIMENSIONS** 

**==> picture [428 x 396] intentionally omitted <==**

**----- Start of picture text -----**<br>
31.900<br>31.700<br>31.500<br>23.454 9.464 4.20<br>23.200 2.382 9.210 4.00<br>22.946 BSC 8.956 3.80<br>(2×) (2×) BOTTOM VIEW<br>I t+ 17.41 E—— 21.410<br>1.588BSC 17.21 21.210<br>TOP VIEW 22.964 17.01(2×) 21.010<br>1.588<br>BSC “f4 | o Ol — 22.71022.456 | —r | s| |[O 1 OG,f _<br>5.20<br>10.60BSC 14.950 5.004.80 7.18 CASTINGFEATURE<br>_—_+ 14.55014.150 _| (2×) BSC1.00 7a BSC<br>10.50 0.05 2.00 BSC<br>BSC BSC 12.10<br>~ EL BSC<br>FRONT VIEW<br>23.504<br>23.250<br>22.996<br>2.660<br>2.500<br>2.340<br>. i SIDE VIEW<br>4.330<br>st eNLA s l DETAIL A 7 BSC E<br>“r DETAIL A t 4.162 BSC<br>0.305<br>BSC (24×) | ol L . 1.00 | LL 1.65 BSC<br>BSC (22×)<br>a 14.00 BSC<br>Figure 19. 24-Lead Module with Connector Interface<br>(ML-24-2)<br>Dimensions shown in millimeters<br>PIN 24<br>PIN 1<br>12-16-2011-C<br>**----- End of picture text -----**<br>


## **ORDERING GUIDE** 

|**ORDERING GUIDE**||||
|---|---|---|---|
|**Model1**|**Temperature Range **|**Package Description**|**Package Option**|
|ADIS16360BMLZ<br>ADIS16360/PCBZ|−40°C to +105°C|24-Lead Module with Connector Interface<br>Interface Board|ML-24-2|
|ADIS16365BMLZ<br>ADIS16365/PCBZ|−40°C to +105°C|24-Lead Module with Connector Interface<br>Interface Board|ML-24-2|



1 Z = RoHS Compliant Part. 

Rev. E | Page 18 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **NOTES** 

Rev. E | Page 19 of 20 

**ADIS16360/ADIS16365** 

**Data Sheet** 

## **NOTES** 

**©2009–2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D07570-0-9/12(E)** 

Rev. E | Page 20 of 20