# THERMAL GAP FILLER, SILICONE, 2.7W/M.K
**URL**: https://novapart.co/products/A17633-08/thermal-gap-filler-silicone-27w-mk
**SKU**: A17633-08
**Manufacturer**: LAIRD
**Category**: Cooling & Thermal Management || Thermal Interface Materials || Thermally Conductive Materials
**Price**: €36.1600
**Stock**: 10+
**Lead Time**: 92 days (indicative)
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (07-Nov-2024) |
| Thickness | 2.03mm |
| Product Range | Tflex HD300 |
| External Width | 229mm |
| External Length | 229mm |
| Thermal Impedance | - |
| Conductive Material | Ceramic Filled Silicone Sheet |
| Dielectric Strength | - |
| Thermal Conductivity | 2.7W/m.K |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:3777497/)
## **Tflex[TM] HD300 Series Thermal Gap Filler**
## **PRODUCT DESCRIPTION**
Laird Tflex[TM] HD300 is a 2.7 W/mK gap filler material in Laird’s high deflection line of products. Tflex HD300 is an excellent choice when wide manufacturing tolerances occur as variable gaps can be filled with Tflex HD300 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, and filler and resin knowledge result in this unique product designed with customer applications in mind.
Tflex HD300 material exhibits excellent surface wetting characteristics and high deflection properties ensuring low contact resistances and providing an overall lower total thermal resistance.
Tflex[TM] HD300 is provided in thickness from 0.5mm (.020”) up to 5mm (.200”) in 0.5mm (.020”) increments as standard. In addition, Laird can provide Tflex[TM] HD300 in multiple converted formats through approved converters and distribution networks.
## **FEATURES AND BENEFITS**
- 2.7 W/m K thermal conductivity
- Low pressure versus deflection characteristics
- Excellent surface wetting for low contact resistance
- Minimizes board and component stress.
- Large tolerance applications
- RoHS and REACH compliant
## **SPECIFICATIONS**
|TYPICAL PROPERTIES
VALUE
TEST METHOD
~~SS~~|TYPICAL PROPERTIES
VALUE
TEST METHOD
~~SS~~|TYPICAL PROPERTIES
VALUE
TEST METHOD
~~SS~~|
|---|---|---|
|**Construction & Composition**|Ceramic filled silicone sheet|N/A|
|**Color**|Pink|Visual|
|**Thickness Range **|0.50mm(0.020”)5.0mm(0.20”)|N/A|
|**Thickness Tolerance**|+/- 10%|N/A|
|**Thermal Conductivity (W/mK)**|2.7|ASTM D5470|
|**Density (g/cc)**|3.1|Helium Pycnometer|
|**Hardness(Shore 00)**|38|ASTM D2240|
|**Outgassing TML(weight %)**|0.39|ASTM E595|
|**Outgassing CVCM(weight %)**|0.10|ASTM E595|
|**Temperature Range**|-40°C to 200°C*|Laird Test Method|
|**Rth@ 40 mils, 10psi**|0.573°C–in2/W|ASTM D5470(Modified)|
|**Dielectric Constant@ 1 MHz**|6.62|ASTM D150|
|**UL Flammability Rating**|V-0|UL-94|
|**Volume Resistivity**|1.2x 1014|ASTM D257|
Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166
**www.lairdtech.com**
## **Tflex[TM] HD300 Series Thermal Gap Filler**
**==> picture [327 x 396] intentionally omitted <==**
**----- Start of picture text -----**
Tflex HD300 Thermal Resistance vs. Pressure
1.200 C-in2/W
1.000 C-in2/W
0.800 C-in2/W
0.600 C-in2/W
0.400 C-in2/W
0.200 C-in2/W
0.000 C-in2/W
10 psi 20 psi 30 psi 40 psi 50 psi 60 psi 70 psi 80 psi 90 psi 100 psi
Tflex HD340 Tflex HD360 Tflex HD380 Tflex HD3100
Tflex HD300 Deflection vs Pressure
80%
70%
60%
50%
40%
30%
20%
10%
0%
10psi 20psi 30psi 40psi 50psi 60psi 70psi 80psi 90psi 100psi
Tflex HD340 TflexHD360 TflexHD380 TflexHD3100
**----- End of picture text -----**
## **AVAILABILITY**
## STANDARD THICKNESSES
- 0.5mm (0.020”) to 5.0mm (0.200”) thick material available in 0.25mm (0.010”) increments
- Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts
## OPTIONS
- DC1 – eliminate tack from one side
## **PART NUMBER SYSTEM**
Tflex™ indicates Laird elastomeric thermal gap filler product line. HD3xxx indicates Tflex HD300 product line with thickness in mils (0.001”)
## EXAMPLES:
- Tflex HD340 = 0.040” thick Tflex™ HD300 material
- Tflex HD3100DC1 = 0.10” thick Tflex™ HD300 material with DC1 option
Tflex HD300 DS 080519
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end
user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
## Links
- [View this product on Novapart](https://novapart.co/products/A17633-08/thermal-gap-filler-silicone-27w-mk)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/laird/a17633-08/thermal-gap-filler-silicone-2/dp/3777497)
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