# Thermal Pad, Tflex HR600 Series, 3 W/m.K, Boron Nitride Filled, 1 mm, 229 mm
**URL**: https://novapart.co/products/A16367-44/thermal-pad-tflex-hr600-series-3-w-mk-boron
**SKU**: A16367-44
**Manufacturer**: LAIRD
**Category**: Cooling & Thermal Management || Thermal Interface Materials || Thermally Conductive Materials
**Price**: €77.1000
**Stock**: 10+
**Lead Time**: 92 days (indicative)
## Description
Thermal Conductivity:3W/m.K; Conductive Material:Boron Nitride Filled; Thickness:1mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; Product Range:Tflex HR600 Ser
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (07-Nov-2024) |
| Thickness | 1mm |
| Product Range | Tflex SF600 |
| External Width | 229mm |
| External Length | 229mm |
| Thermal Impedance | - |
| Conductive Material | Boron Nitride Filled |
| Dielectric Strength | - |
| Thermal Conductivity | 3W/m.K |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2484749/)
## TflexTM SF600 Series **Thermal Gap Filler**
## Innovative **Technology** for a **Connected** World
## COMPLIANT SILICONE-FREE 3.0 W/mK THERMALLY CONDUCTIVE GAP FILLER
Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3.0 W/mK. Tflex™ SF600 is designed for applications which are silicone sensitive. This material is RoHS compliant.
## FEATURES AND BENEFITS
- Silicone-free gap pad
- Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
- Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
- Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments
## APPLICATIONS
- Automotive applications
- Applications involving optical components
- Flat panel displays
- Hard drives
**Farnell Description : Laird‐PN: Tflex SF620 9x9in, thickness = 0.5 mm A16367-42 Tflex SF640 9x9in, thickness = 1.0 mm A16367-44 Tflex SF6120 9x9in, thickness = 3.0 mm A16367-12**
## **global solutions: local support TM**
Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com **www.lairdtech.com/thermal**
## TflexTM SF600 Series **Thermal Gap Filler**
## Innovative **Technology** for a **Connected** World
## Tflex[TM] SF600 TYPICAL PROPERTIES
**==> picture [444 x 218] intentionally omitted <==**
**----- Start of picture text -----**
Tflex SF600 Deflection (70 mil +)
Tflex [TM] SF600 TEST METHOD 100.00%90.00% Tflex SF670
— | | | 80.00% t | Tflex SF680 e]SFe70 [COSY
Construction Boron Nitride filled gap pad NA 70.00% —mT Tflex SF690 flex —_
Color Rose visual 60.00% Tflex SF6100
50.00% Tflex SF6110
Thermal Conductivity 3.0 W/mK Hot Disk 40.00% Tflex SF6120
Fe il £TF ow |
80 Shore 00; 30.00% Tflex SF6130
Hardness (Shore 00) ASTM D2240
3 seconds 20.00% Tflex SF6140
ne Helium 10.00% Se” U e
Density 1.27 g/cc Pyncometer 0.00% 0 P 10 20 30 40 50 | 60 70 80 90 100 110
0.010 - 0.140 inches Pressure(PSI)
Standard Thickness Range
(0.25 - 3.56 mm)
Volume Resistivity 10 [14] ohm-cm ASTM D257
UL Flammability Rating V0 (pending) UL 94
Continuous use temperature -20° to 125°C TGA
Weight Loss at 125°C <0.1% over 24 hrs TGA
Dielectric Constant @ 1 kHz 3.5 ASTM D150
Deflection
**----- End of picture text -----**
## STANDARD THICKNESSES
Standard thickness is 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) and available in 0.010-inch (0.25 mm) increments. 0.010-inch is only available in custom cut parts (sheet material is not available).
## MATERIAL NAME AND THICKNESS
Tflex™ indicates Laird Technologies’ brand thermally conductive elastomeric gap filler product. SF6xx indicates ‘SF600 series’ 3.0 W/mK material, and xxx indicates thickness in mils (0.001-inches)
## **Examples:**
Tflex™ SF620 = 0.020-inch thick material
## THR-DS-Tflex-SF600 0412
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or noninfringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A16509-00 Rev A, 04/18/12.
## Links
- [View this product on Novapart](https://novapart.co/products/A16367-44/thermal-pad-tflex-hr600-series-3-w-mk-boron)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/laird-technologies/a16367-44/thermal-gap-filler-229-x-229mm/dp/2484749)
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