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A15896-31
Thermal Pad, Tflex SF600 Series, 5 W/m.K, Silicone, 4 mm, 229 mm
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: LAIRD
- Product type: Thermally Conductive Materials
- Thermal Conductivity:5W/m.K; Conductive Material:Silicone; Thickness:4mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product Range:Tflex
- SVHC: No SVHC (07-Nov-2024)
- Thickness: 4mm
- Product Range: Tflex SF600
- External Width: 229mm
- External Length: 229mm
- Thermal Impedance: -
- Conductive Material: Silicone
- Dielectric Strength: -
- Thermal Conductivity: 5W/m.K
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 351.05 € |
| Current stock | 10+ |
| Lead time | 30 days |
Tflex[™] 700 Series Thermal Gap Filler ## HIGHEST THERMAL CONDUCTIVITY COMPLIANT GAP FILLER Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. Tflex™ 700 is stable from -45ºC thru 200ºC and meets UL 94V0 flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal performance. ## FEATURES AND BENEFITS - Thermal conductivity 5.0 W/mK - Highly compliant - Low thermal resistance even at low pressure - Available in thicknesses from 0.020” thru 0.200” (0.5mm thru 5.0mm) - Naturally tacky for adhesion during assembly and transport ## APPLICATIONS - Cooling components to chassis, frame or other mating components - Mass storage devices - Heat pipe thermal solutions for notebook computers - Automotive engine control - Telecommunication hardware - LED solid state lighting - Power electronics - Flat panel displays - Audio and video components - Computer servers and other IT infrastructure - GPS navigation and other portable devices |**Farnell Description :**|**Laird-PN:**| |---|---| |**Tflex 720 9x9in, thickness = 0.5 mm**|**A15196-02**| |**Tflex 740 9x9in, thickness = 1.0 mm**|**A15896-04**| |**Tflex 780 9x9in, thickness = 2.0 mm**|**A15796-26**| |**Tflex 7160 9x9in, thickness = 4.0 mm**|**A15896-31**| |**Tflex 7200 9x9in, thickness = 5.0 mm**|**A15796-28**| Americas: +1.800.843.4556 Europe: +49.8031.24600 Asia: +86.755.2714.116 CLV-customerservice@lairdtech.com ## Tflex[™] 700 Series Thermal Gap Filler |Construction|Tflex™ 700<br>Filled Silicone Sheet|TEST METHOD<br>N/A| |---|---|---| |Color|Dark Grey|Visual| |Thermal Conductivity(W/mK)|5.0|Hot Disk™| |Hardness (Shore 00)|66; 3|ASTM D2240| |Specific Gravity|1.73|Helium Pyncometer| |Thickness Range|0.020” - .200” (0.5 - 5.0mm)|| |Thickness Tolerance|±10%|| |UL FlammabilityRating|94 V0|File E180840| |Temperature Range|-45°C to 200°C|See reliabilityreport| |Volume Resistivity(ohm-cm)|1 x 1013|ASTM D257| |Outgassing TML|1.0%|ASTM E595| |Outgassing CVCM|0.13%|ASTM E595| ## STANDARD THICKNESSES Standard thickness 0.020” (0.5mm) through 0.200” (5.0mm) available in 0.010” (0.25mm) increments. ## MATERIAL NAME AND THICKNESS ## Tflex™ - indicates elastomeric gap filler product line. 7XXX - indicates Tflex™ 700 product line and thickness in mils (0.001-inches). -DC1 - one side tacky; default is both sides tacky. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. ## THR-DS-TFLEX-700_07_2_14 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. A15955-00 Rev E, 7/2014.
Updated at April 15, 2026
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