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A15328-01
Thermal Pad, Tflex 300 Series, 1.2 W/m.K, Silicone Elastomer, 2 mm, 229 mm
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: LAIRD
- Product type: Thermally Conductive Materials
- Thermal Conductivity:1.2W/m.K; Conductive Material:Silicone Elastomer; Thickness:2mm; Thermal Impedance:-; Dielectric Strength:-; External Length:229mm; External Width:229mm; Product
- SVHC: No SVHC (07-Nov-2024)
- Thickness: 2mm
- Product Range: Tflex 300
- External Width: 229mm
- External Length: 229mm
- Thermal Impedance: -
- Conductive Material: Silicone Elastomer
- Dielectric Strength: -
- Thermal Conductivity: 1.2W/m.K
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 14.96 € |
| Current stock | 200+ |
| Lead time | 30 days |
## TflexTM 300 Series **Thermal Gap Filler** ## Innovative **Technology** for a **Connected** World ## UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. ## FEATURES AND BENEFITS - Extreme compliancy allows material to “totally blanket” component(s) - Thermal conductivity of 1.2 W/mK - Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm) - Low compression set enables the pad to be reused many times ## APPLICATIONS - Notebook and desktop computers - Telecommunication hardware - Flat panel displays - Memory modules - Power conversion equipment - Set top box - Lighting ballast - Automotive electronics - LED lighting - Handheld electronics - Optical disk drives - Vibration dampening |**Farnell Description :**|**Laird PN:**| |---|---| |**Tflex 320 9x9in, thickness = 0.5 mm**|**A15322-01**| |**Tflex 340 9x9in, thickness = 1.0 mm**|**A15324-01**| |**Tflex 380 9x9in, thickness = 2.0 mm**|**A15328-01**| |**Tflex 3160 9x9in, thickness = 4.0 mm**|**A15336-01**| |**Tflex 3200 9x9in, thickness = 5.0 mm**|**A15340-01**| ## **global solutions: local support TM** Americas: +1.888.246.9050 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com **www.lairdtech.com/thermal** ## TflexTM 300 Series **Thermal Gap Filler** ## Innovative **Technology** for a **Connected** World ## TFLEX[TM] 300 TYPICAL PROPERTIES **==> picture [444 x 279] intentionally omitted <==** **----- Start of picture text -----**<br> Pres s ure vs . thermal res is tanc e (AS T M<br>TFLEXTM 300 TEST METHOD D5470)<br>———Seii 320 ‘iéC 330 340 360 380 3100 3150 3200<br>Filled silicone 4.0<br>Construction elastomer NA 3.5<br>3.0<br>Color Light green Visual 2.52.0<br>Thermal Conductivity 1.2 W/mK ASTM D5470 1.5<br>1.0<br>a Hardness (Shore 00) 40 ASTM D2240 0.5 SS<br>(at 3 second delay) 0 10 20 30 40 50 60 70 80 90 100 110<br>Helium P ressure psi<br>Density 1.78 g/cc<br>Pyncometer<br>0.020" - .200"<br>Thickness Range<br>(0.5 - 5.0mm)*<br>Pres s ure vs Deflec tion (AS TM D575)<br>320 330 340 360 380 3100<br>Thickness Tolerance ±10% 3150 3200<br>90%<br>UL Flammability Rating 94 V0 UL 80%<br>Temperature Range -40ºC to 160ºC NA 70%60%<br>Volume Resistivity 10 ^13 ohm-cm ASTM D257 50%40%<br>Outgassing TML 0.56% ASTM E595 30%20%<br>a Outgassing CVCM 0.10% ASTM E595 10%0% —-<br>Coefficient Thermal 600 ppm/C IPC-TM-650 0 10 20 30 40 P ressure psi 50 60 70 80 90 100 110<br>Expansion (CTE) 2.4.24<br>2/Win<br>Thermal C- ⁰ Ressitance<br>P ercent Deflection<br>**----- End of picture text -----**<br> ## STANDARD THICKNESSES 0.020 to 0.200-inch (0.5 to 5.0mm)* - 0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments *Inquire about availability of material and options above 0.200-inches - ** FG (fiberglass) is standard for thicknesses 0.020” (0.50mm) and 0.030” (0.76mm) ## OPTIONS PET dielectric “H” liner available for applications where easy slide assembly is desirable ## MATERIAL NAME AND THICKNESS Tflex™ indicates elastomeric gap filler product line 3xxx indicates high recovery ‘3 series’ 1.2 W/mK material - -DC1 designates proprietary tack eliminated coating ## EXAMPLES Tflex™ 3120 = standard 0.120-inch thick Tflex™ 300 material Tflex™ 3120DC1 = 0.120-inch thick material with DC1 coating Tflex™ 3120H = 0.120-inch thick material with hard PET liner - -H indicates hard PET liner option ## THR-DS-TFLEX-300 0612 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A15293-00 Rev F, 06/2012.
Updated at April 15, 2026
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