60-12-20264-TW10

**T-WING[®] HEAT SPREADERS** 

Thin Heat Spreaders 

Parker Chomerics’ family of thin heat spreaders provides a low-cost, effective means of cooling IC devices in restricted spaces where conventional heat sinks are inappropriate. 

## **FEATURES/BENEFITS** 

- Component junction temperature reduction of 10 to 20°C is common 

- Easily added to existing designs to lower component temperatures and improve reliability 

- Custom shapes available for complex designs 

## **TYPICAL APPLICATIONS** 

- Microprocessors 

- Memory modules 

- Laptop PCs and other high density, handheld portable electronics 

- High speed disk drives 

## **DESIGN DETAILS** 

- Low profile (0.33 mm/0.013 in) allows use in limited space environments 

- Easy peel and stick adhesion to all surfaces, including packages with residual silicone mold release 

- Offers low cost cooling for many package types 

- Low application force (<5 psi/ 0.03 MPa) minimizes risk of damage to component 

- Available in a range of standard sizes 

- Pliable nature allows conformance to concave or otherwise non-flat surfaces for optimal thermal and mechanical performance 

## **TESTING SUMMARY** 

Summaries of test procedures used for T-WING heat spreaders are described below. Thermal performance, adhesion strength and visual inspection were used as pass/fail criteria. 

## **Apparatus** 

Anatek[®] Thermal Analyzer: The ATA was used to measure Rj-a before and after environmental stressing. PQFP: 196 lead, plastic PQFPs known to contain silicone mold release were evaluated. T-WING Heat Spreader: 1 in x 4 in T-WING parts were applied to the PQFP packages with a 5 psi (0.03 MPa) mounting pressure. 

- Light weight (0.039 oz/in[2] ) 

- Standard parts are scored for easy forming and alignment 

- Easy removal for device replacement 

- Available die-cut on continuous rolls 

**Phone +1 781-935-4850  www.parker.com/chomerics** 

1 

## **THERMAL PERFORMANCE** 

Various sizes of T-WING heat spreaders were applied to a 196 lead PQFP using less than 5 psi (0.03 MPa) bonding pressure. Within 30 minutes of application, the test boards were mounted in an Analysis Tech[®] thermal analyzer. The devices were heated to equilibrium (45 to 60 minutes) with approximately 3 watt load on 3 x 3 in (7.6 x 7.6 cm) test boards. 

Two test environments were used: restricted convention, achieved with a 1 x 5 x 6 in (2.5 x 12.7 x 15.2 cm) plexiglass box; and 100 LFM (30 m/ min) air flow. Results were obtained using thermocouples for Tc (centered on case) and Rj-a. 

## **Environmental Stressing** 

Control: Specimens were maintained for 1000 hours at standard laboratory conditions, 23°C, 35-60% RH. 

Heat Aging: Test specimens were placed in a forced convection hot air oven maintained at 150°C ±5°C for 1000 hours. Test specimens were then removed and tested. 

## Elevated Temperature/ High Humidity: 

Specimens were placed in a humidity chamber maintained at 85°C ± 2°C and 90%-0 +10% RH for 1000 hours. 

Temperature Cycling: Specimens were subjected to 500 cycles from -50°C to +150°C in a Tenney Temperature Cycling Oven. 

Temperature Shock: Specimens were subjected to 100 temperature shocks by immersion into -50° and +150°C liquids. Temperatures were monitored with thermocouples. 

## **Evaluation Procedure** 

Visual: All test specimens were examined for de-bonding, delamination or other signs that the tape was failing after environmental stress. 

Thermal Performance: T-WING was applied to the PQFP with 5 psi mounting pressure. After a one hour dwell, the Rj-a of each specimen was measured at 100 LFM and under restricted convection conditions. The Rj-a was again measured after environmental stressing. 

90° Peel Strength: A T-WING heat spreader was applied to each PQFP with 5 psi mounting pressure. The specimens were subjected to environmental stress and then tested for 90° peel strength at room temperature. 

## **Results** 

Visual: There was no visual evidence of T-WING adhesion failure to the PQFP after the environmental stresses. 

Thermal Performance: The before and after thermal resistances are given in Table 4. The data shows that the thermal resistances were essentially unchanged by the exposures. 

90° Peel Strength: The results of the peel strength tests are given above. The data shows that the average peel strength actually increases with high temperature/humidity and temperature shock, while remaining unchanged with heat aging and decreasing slightly with temperature cycling. 

## **APPLICATION INSTRUCTIONS** 

**Materials needed:** Clean cotton cloth or rag, industrial solvent, rubber gloves. **Step 1:** For best results, clean the top surface of the component using a lint-free cotton cloth. 

**Step 2:** Wipe the bonding surface of the component with an industrial solvent, such as MEK, acetone or isopropyl alcohol. In the case of a plastic package, select a cleaner that will not chemically attack the plastic substrate. Do not touch the cleaned surface during any part of the assembly process. If the surface has been contaminated, repeat Steps 1 and 2. 

**Step 3:** Remove the clear release liner from the T-WING part, exposing the pressure-sensitive adhesive (PSA). Avoid touching exposed adhesive with fingers. 

**Step 4:** For best bond strength and contact area, center the exposed PSA onto the component. Press and smooth the entire T-WING bonding area with firm finger pressure of about 5 psi, for 5 seconds. 

Note: Bond strength will increase as a function of time as the adhesive continues to wet out the bonding surface. Increasing any of the application variables (pressure, temperature and time) can improve bonding results. 

**Phone +1 781-935-4850  www.parker.com/chomerics** 

2 

## **T-WING[®] Heat Spreaders** 

**==> picture [394 x 272] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Properties Test Method<br>Color Black Visual<br>Total Thicknesses, in (mm) 0.013 (0.33) ASTM D374<br>PSA Type Silicone based --<br>PSA Thickness, in (mm) 0.002 (0.05) Visual<br>Insulator Type Black polyester --<br>Insulator Layer Thickness, in (mm) 0.001 (0.025) --<br>Weight, oz/in [2] 0.039 --<br>Thermal Conductor Copper --<br>Maximum Operating Temperature, °F (°C) 257 (125) --<br>Thermal Conductor Thickness, in (mm) 0.007 (0.178) --<br>Dielectric Strength,  Vac/mil (kVac/mm) 5,000 (200) for each  ASTM D149<br>dielectric layer<br>Volume Resistivity, ohm-cm N/A ASTM D149<br>Dielectric Constant @ 1,000 MHz N/A ASTM D150<br>Dissipation Factor @ 1,000 kHz N/A Chomerics<br>Flammability Rating (See UL File E140244) V-0 UL 94<br>Chomerics<br>RoHS Compliant Yes Certification<br>Shelf Life, months from date of manufacture 12 Chomerics<br>sical<br>y<br>Ph<br>Electrical<br>Regulatory<br>**----- End of picture text -----**<br>


## **Typical Properties** 

**==> picture [501 x 138] intentionally omitted <==**

**----- Start of picture text -----**<br>
Typical Thermal Properties<br>Standard Part Size in (mm)<br>(Performed on surface of 196 lead 3 Watt PQFP package)<br>Without  0.5 x 2   0.5 x 3   0.75 x 3   1 x 3   1 x 4   1.5 x 4<br>Environment* Properties T-WING  (12.7 x 50.8) (12.7 x 76.2) (19.1 x 76.2) (25.4 x 76.2) (25.4 x 101.6) (38.1 x<br>101.6)<br>Thermal Resistance<br>Restricted   Rj-a, °C/W 26 25 23 23 22 20 19<br>Convection**<br>Case<br>92 82 78 76 72 70 68<br>Temperature, °C<br>Thermal Resistance<br>Rj-a, °C/W 18 16 14 14 14 13 12<br>100 LFM***<br>Case<br>68 57 52 49 46 44 44<br>Temperature, °C<br>**----- End of picture text -----**<br>


* Measured values do not account for heat losses through bottom of case and leads. Ambient temperature range from 21[o] C to 24[o] C. 

** Restricted convection in a simulated notebook computer environment - a 1 x 5 x 6 in (2.54 x 12.7 x 15.2 cm) plexiglass box. 

*** T-WING long axis perpendicular to air flow direction in wind tunnel. 

**Notes** 

Rj-a = thermal resistance from junction to ambient LFM = airflow rate (linear feet per minute) 

**Phone +1 781-935-4850  www.parker.com/chomerics** 

3 

## **Typical Adhesion Performance** 

**==> picture [506 x 95] intentionally omitted <==**

**----- Start of picture text -----**<br>
Test Procedure Result Test Method<br>Lap Shear - Room Temperature apply/60 min. R.T. dwell/R.T. pull 960 oz/in [2]  (414 kPa) ASTM D1000<br>Lap Shear - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 53 oz/in [2]  (23 kPa) ASTM D1000<br>90° Peel - Room Temperature apply/1 min. R.T. dwell/R.T. pull 40 oz/in (441 g/cm) ASTM B571/D2861<br>90° Peel - Elevated Temperature apply/60 min. R.T. dwell/100°C pull 20 oz/in (220 g/cm) ASTM B571/D2861<br>Creep Adhesion, days 275°F (135°C), 7 oz/in [2]  (3 kPa), on aluminum >80 days, no failure P.S.T.C. No. 7<br>**----- End of picture text -----**<br>


## **Environmental Stress Thermal Performance** 

**==> picture [222 x 151] intentionally omitted <==**

**----- Start of picture text -----**<br>
Environment Before After<br>Heat Aging<br>Rj-a, °C/W Restricted Convection 20.3 20.6<br>Rj-a, °C/W 100 LFM 12.7 13.1<br>High Temperature/Humidity<br>Rj-a, °C/W Restricted Convection 21.4 21.4<br>Rj-a, °C/W 100 LFM 14.1 14<br>Temperature Cycling<br>Rj-a, °C/W Restricted Convection 21.4 21.7<br>Rj-a, °C/W 100 LFM 14.1 13.9<br>**----- End of picture text -----**<br>


## **Environmental Stress Adhesive Performance** 

**==> picture [232 x 109] intentionally omitted <==**

**----- Start of picture text -----**<br>
90° Peel Strength<br>Environment<br>oz/in gm/cm<br>Control 36 393<br>Heat Aging 36 393<br>High Temperature/Humidity 46 514<br>Temperature Shock 38 424<br>Temperature Cycling 30 335<br>**----- End of picture text -----**<br>


Note: Average of three samples tested per ASTM B571/D2861. 

Note: Tested with a 1” x 4” (25.4 x 101.6 mm) T-WING. 

**Phone +1 781-935-4850  www.parker.com/chomerics** 

4 

## Ordering Information 

## **T-WING[®] Heat Spreaders** 

Standard Parts: Refer to table below for part numbers and sizes. T-WING heat spreaders are available in standard packages of 100 parts/pkg. 

Custom Parts: Custom configured T-WING parts are also available. Contact Parker Chomerics’ Applications Engineering Department for details. 

**==> picture [299 x 169] intentionally omitted <==**

**----- Start of picture text -----**<br>
Available in standard sizes 1,000 parts per plastic tray. Also available die-cut<br>on continuous rolls.<br>A<br>B<br>| c u C I T<br>Folding Scores<br>0.0015 in. Black PET<br>0.007 in. RA Copper Sa<br>0.0015 in. Black PET<br>Release Liner<br>Sn el _T <_—<br>0.002 in. Thermattach PSA<br>**----- End of picture text -----**<br>


|**Part Numbers**|**Size (inches/mm)**|**Size (inches/mm)**|**Size (inches/mm)**|
|---|---|---|---|
||**A: Length, inches (mm)**|**B: Width, inches (mm)**|**C: Adhesive Width, inches (mm)**|
|60-12-20264-TW10|2.0 (50.8)|0.50 (12.7)|0.50 (12.7)|
|60-12-20265-TW10|3.0 (76.2)|0.50 (12.7)|0.50 (12.7)|
|60-12-20266-TW10|3.0 (76.2)|0.75 (19.1)|0.75 (19.1)|
|60-12-20267-TW10|3.0 (76.2)|1.00 (25.4)|1.00 (25.4)|
|60-12-20268-TW10|4.0 (101.6)|1.00 (25.4)|1.00 (25.4)|
|60-12-20269-TW10|4.0 (101.6)|1.50 (38.1)|1.50 (38.1)|



**Phone +1 781-935-4850  www.parker.com/chomerics** 

5