# Wireless LAN Module, 6 GHz, UART, Several Commercial and Industrial

![Product image](https://novapart.co/image/farnell:4240943RL/)

**URL**: https://novapart.co/products/453-00117C/wireless-lan-module-6-ghz-uart-several-commercial
**SKU**: 453-00117C
**Manufacturer**: EZURIO
**Price**: €23.2700
**Stock**: 10+
**Lead Time**: 155 days (indicative)

## Specifications

| Parameter | Value |
|---|---|
| Svhc | To Be Advised |
| Frequency Rf | 6GHz |
| Product Range | SONA IF573 Series |
| Module Interface | UART |
| Module Applications | Several Commercial and Industrial |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:4240943RL/)

A 

## Datasheet Sona™ IF573 _Version 1.2_ 

|**Version**|**Date**|**Notes**|**Contributors**|**Approver**|
|---|---|---|---|---|
|0.1|8 June 2023|Preliminary release|Various|Andy Ross|
|||Updates toTable 37: M.2 2230 E-Key|||
|0.2|13 July 2023|pin definitions– WL_DEV_WAKE and|Jacky Kuo|Andrew Chen|
|||BT_DEV_WAKE voltage|||
|0.3|8 Aug 2023|AddedTransmit PowertoTable 3:<br>Specifications|Jacky Kuo|Andrew Chen|
|0.4|11 Aug 2023|Updated7.1 M.2 1318 Solder-down|Jacky Kuo|Connie Lin|
|0.5|20 Oct 2023|UpdatedTable 12through Table 21 in<br>8.5WLAN Transmitter Characteristics|Jacky Kuo|Andy Ross|
||||Andrew Chen||
||||Connie Lin||
||||Dean Ramsier||
|1.0|23 Oct 2023|Initial release|Jacky Kuo|Andy Ross|
||||Kris Sidle||
||||Peter Scharpf||
||||Andrew Dobbing||
|||Updates toTable 36: M.2 1318 pin|||
|||definitionsandTable 37: M.2 2230 E-|Dean Ramsier||
|1.1|5 Dec 2023|Key pin definitions.Removed channel|Jacky Kuo|Andy Ross|
|||sets as duplicated in Regulatory|Andrew Chen||
|||Information Guide.|||
|1.2|11 Dec 2023|Updated19.1Certified Antennassection|Connie Lin|Andy Ross|



2 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

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|**CONTENTS**|**CONTENTS**|
|---|---|
|1|Scope .................................................................................................................................................................................. 5|
|2|Introduction .......................................................................................................................................................................... 5|
||2.1<br>General Description.................................................................................................................................................... 5|
|3|Sona IF573 Series Features Summary ............................................................................................................................... 6|
|4|Specifications ...................................................................................................................................................................... 8|
|5|WLAN Functional Description ............................................................................................................................................ 16|
||5.1<br>Overview .................................................................................................................................................................. 16|
|6|Bluetooth Functional Description ....................................................................................................................................... 19|
|7|Block Diagrams ................................................................................................................................................................. 20|
||7.1<br>M.2 1318 Solder-down ............................................................................................................................................. 20|
||7.2<br>M.2 2230 E-Key ....................................................................................................................................................... 21|
|8|Electrical Characteristics ................................................................................................................................................... 21|
||8.1<br>Absolute Maximum Ratings ...................................................................................................................................... 21|
||8.2<br>Recommended Operating Conditions ...................................................................................................................... 22|
||8.3<br>DC Electrical Characteristics .................................................................................................................................... 22|
||8.4<br>WLAN Radio Receiver Characteristics ..................................................................................................................... 22|
||8.5<br>WLAN Transmitter Characteristics ........................................................................................................................... 25|
|9|Bluetooth Radio Characteristics ........................................................................................................................................ 31|
|10|Host Interface Specifications ............................................................................................................................................. 34|
||10.1<br>SDIO Specifications ................................................................................................................................................. 34|
||10.1.1<br>Default Speed, High-Speed Modes .................................................................................................................... 34|
||10.1.2<br>SDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8V) .................................................................................... 35|
||10.1.3<br>SDR104 Mode (208 MHz) (1.8V) ....................................................................................................................... 36|
||10.2<br>PCI Express Interface .............................................................................................................................................. 36|
||10.3<br>PCM Interface Specifications ................................................................................................................................... 37|
||10.3.1<br>PCM Interface .................................................................................................................................................... 37|
||10.3.2<br>PCM Interface Timing ......................................................................................................................................... 37|
||10.4<br>JTAG Interface ......................................................................................................................................................... 42|
|11|Power-Up Sequence and Timing ....................................................................................................................................... 43|
||11.1<br>Description of Control Signals .................................................................................................................................. 43|
||11.2<br>Control Signal Timing Diagrams ............................................................................................................................... 43|
|12|Pin Definitions.................................................................................................................................................................... 46|
||12.1<br>M.2 1318 Solder-down ............................................................................................................................................. 46|
||12.2<br>M.2 2230 E-Key ....................................................................................................................................................... 49|
|13|Host Platform Implementation Details ............................................................................................................................... 52|
||13.1<br>M.2 1318 WLAN Interface Selection ........................................................................................................................ 52|
||13.2<br>Bluetooth Interface Requirements ............................................................................................................................ 52|



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© Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

||13.3<br>Low Power Clock ..................................................................................................................................................... 52|
|---|---|
||13.4<br>M.2 1318 WL_DEV_WAKE Mapping ....................................................................................................................... 52|
|14|Mechanical Specifications ................................................................................................................................................. 53|
||14.1<br>M.2 1318 .................................................................................................................................................................. 53|
||14.2<br>M.2 2230 E-Key ....................................................................................................................................................... 55|
||14.3<br>M.2 2230 E-Key Mounting ........................................................................................................................................ 55|
|15|RF Layout Design Guidelines ............................................................................................................................................ 57|
|16|Application Notes ............................................................................................................................................................... 57|
||16.1<br>Introduction .............................................................................................................................................................. 57|
||16.2<br>Shipping and Labelling ............................................................................................................................................. 58|
||16.2.1<br>M.2 1218 Solder-Down ....................................................................................................................................... 58|
||16.2.2<br>M.2 2230 E-Key Module ..................................................................................................................................... 65|
||16.3<br>Required Storage Conditions ................................................................................................................................... 69|
||16.3.1<br>Prior to Opening the Dry Packing ....................................................................................................................... 69|
||16.3.2<br>After Opening the Dry Packing ........................................................................................................................... 69|
||16.3.3<br>Temporary Storage Requirements after Opening ............................................................................................... 70|
||16.4<br>Baking Conditions .................................................................................................................................................... 70|
|17|Surface Mount Conditions ................................................................................................................................................. 71|
||17.1<br>Recommended Stencil Aperture .............................................................................................................................. 71|
||17.2<br>Soldering .................................................................................................................................................................. 72|
||17.2.1<br>Cautions When Removing the M.2 1318 from the Platform for RMA ................................................................. 73|
||17.2.2<br>Precautions for Use ............................................................................................................................................ 73|
|18|Reliability Test ................................................................................................................................................................... 74|
||18.1<br>Environmental and Mechanical ................................................................................................................................ 74|
||18.2<br>Reliability Prediction ................................................................................................................................................. 75|
|19|Regulatory ......................................................................................................................................................................... 76|
||19.1<br>Certified Antennas .................................................................................................................................................... 76|
|20|Bluetooth SIG Qualification ............................................................................................................................................... 77|
||20.1<br>Overview .................................................................................................................................................................. 77|
||20.2<br>Qualification Steps When Referencing a Laird Connectivity Controller Subsystem Design ..................................... 77|
|21|Additional Information ........................................................................................................................................................ 78|



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© Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

This document describes key hardware aspects of the Laird Connectivity Sona™ IF573 series wireless modules providing either PCIe v3.0 Gen2 or SDIO 3.0 interface for WLAN connection and high-speed 4-wire UART interface for Bluetooth[®] connection. This document is intended to assist device manufacturers and related parties with the integration of this radio into their host devices. Data in this document is drawn from several sources and includes information found in the Infineon CYW55573MIWBGT data sheet issued on March 23, 2023, along with other documents provided by Infineon. 

**Note:   The information in this document is subject to change.** Please contact Laird Connectivity to obtain the most recent version of this document. 

The Sona IF573 series wireless module is an integrated, small form factor Wi-Fi/Bluetooth module that is optimized for lowpower mobile devices, featuring: 

- Wi-Fi 6E: Tri-band 2x2 MIMO IEEE 802.11a/b/g/n/ac/ax WLAN 

- Bluetooth[®] 5.4: Dual Mode 

The integration of all WLAN and Bluetooth functionality in a single package supports low cost and simple implementation along with flexibility for platform-specific customization. It is available in both M.2 2230 E-Key and M.2 1318 solder-down form factor. 

This device is pre-calibrated and integrates the complete transmit/receive RF paths including bandpass filter, diplexer, switches, reference crystal oscillator, and power management units (PMU). Both variants support three integrated MHF4 connectors, with two ports for WLAN and one dedicated for Bluetooth. The M.2 1318 solder down module also supports an RF trace pin option for use with external antenna solutions.  For a list of certified antennas see Certified Antennas in the datasheet. 

The Sona IF573 series device supports IEEE 802.11ax tri-band (2.4/5/6 GHz) 2x2 MIMO with data rates up to MCS11 (287 Mbps PHY data rate for 2.4 GHz band and 1.2 Gbps PHY data rate for 5/6 GHz). The device has a dedicated Bluetooth port for best Wi-Fi + Bluetooth coexistence performance. The device’s low power consumption, radio architecture and power management unit (PMU) proprietary power save technologies allow for extended battery life. 

In addition, its tri-band IEEE 802.11ax and Bluetooth radio includes full digital MAC and baseband engines that handle all 802.11 CCK/OFDM/OFDMA® 2.4/5/6 GHz and Bluetooth 5.4 (Basic Rate, Enhanced Data Rate, and Bluetooth Low Energy) baseband and protocol processing. 

The Sona IF573 series wireless modules include two product SKUs which have different RF paths. Please contact Laird Connectivity Sales/FAE for further information. Ordering information is listed in Table 1. 

_**Table 1: Product ordering information**_ 

|**Part Number**|**Description**|
|---|---|
|453-00117R|Sona IF573 1318 Module, MHF4, Tape and Reel|
|453-00117C|Sona IF573 1318 Module, MHF4, Cut Tape|
|453-00118R|Sona IF573 1318 Module, RF Trace Pin, Tape and Reel|
|453-00118C|Sona IF573 1318 Module, RF Trace Pin, Cut Tape|
|453-00119|Sona IF573 M.2 2230 Module, Key E, SDIO/UART|
|453-00120|Sona IF573 M.2 2230 Module, Key E, PCIe/UART|
|453-00119-K1|Sona IF573 M.2 2230 Module Development Kit, SDIO/UART|
|453-00120-K1|Sona IF573 M.2 2230 Module Development Kit, PCIe/UART|



5 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

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**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

The Laird Connectivity Sona IF573 series device features are described in Table 2. 

_**Table 2: Sona IF573 series wireless module features**_ 

|**_Table 2: Sona IF573 series wireless module features_**|**_Table 2: Sona IF573 series wireless module features_**|||
|---|---|---|---|
|**Feature**|**Description**|||
|**Radio Front End**|▪Integrates the complete transmit/receive RF paths including bandpass filter, diplexer,|||
||switches, reference crystal oscillator, and power manage unit (PMU)|||
||▪Supports tri-band (2.4/5/6 GHz)|||
||▪Supports 20/40/80 MHz channel bandwidth|||
||▪Supports 2x2 WLAN antenna configuration with dedicated Bluetooth antennaport|||
|The_Bluetooth_®word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. Any use of such marks by||||
|Laird Connectivity is under license. Other trademarks and trade names are those of their respective owners.|Laird Connectivity is under license. Other trademarks and trade names are those of their respective owners.|||
|**Power Management**|Two buck regulator, multiple LDO regulators, and a power management unit (PMU) are||Two buck regulator, multiple LDO regulators, and a power management unit (PMU) are|
||integrated into the CYW55573MIWBGT. All regulators are programmable via the PMU. These||integrated into the CYW55573MIWBGT. All regulators are programmable via the PMU. These|
||blocks simplify power supply design for Bluetooth and WLAN functions in embedded designs.|||
|**Pre-Calibration**|RF system tested and calibrated in production|||
|**Sleep Clock**|An external sleep clock of 32.768 kHz is required. The external 32.768 kHz precision oscillator|||
||which meets the requirements listed following table must be used.|||
||**Parameter**<br>**LPO Clock**||**Unit**|
||Nominal input frequency<br>32.768||kHz|
||Frequency accuracy<br>±250||ppm|
||Duty cycle<br>30 – 70||%|
||Input signal amplitude<br>200 – 1800|mV, p-p||
||Signal type<br>Square-wave or sine-wave||-|
||Input impedance<br>> 100k||Ω|
||< 5||pF|
||Clock jitter (during initial startup)<br>< 10,000||ppm|
|**Host Interface**|The Sona IF573 M.2 card provides two interfaces for customers to choose:|||
||**1. SDIO/UART**, Wi-Fi section provides support for SDIO v3.0 and also is backward compatible|||
||with SDIO v2.0. Bluetooth section supports a high-speed 4-wire UART interface.|||
||**2. PCIe/UART**, Wi-Fi section provides support for PCIe Gen2 (3.0 Compliant). Bluetooth section|||
||supports a high-speed 4-wire UART interface.|||
|**Advanced WLAN**|▪IEEE 802.11a/b/g/n/ac/ax compliant, tri-band capable (2.4/5/6 GHz)|||
||▪2x2 MIMO providing up to 1.2 Gbps PHY data rate for 5/6 GHz (1024-QAM modulation)|||
||▪2x2 MIMO providing up to 287 Mbps PHY data rate for 2.4 GHz (1024-QAM modulation)|||
||▪Supports 20, 40, and 80 MHz channels with optional SGI (1024-QAM modulation)|||
||▪Background channel availability check (CAC) scan for immediate switch to candidate DFS|||
||channel|||
||▪On-chip power amplifiers and low-noise amplifiers for both bands|||
||▪Support wide variety of WLAN encryption: WPA/WPA2/WPA3/TKIP/AES and IEEE 802.11i|||
||compatibility|||
|**Advanced Bluetooth**|▪Bluetooth 5.4 (BDR + EDR + Bluetooth LE)|||
||▪Dedicated Bluetooth RF path port|||
||▪Bluetooth Class 1 or Class 2 transmitter operation|||
||▪Support data rate: 1 Mbps (GFSK), 2 Mbps (π/4-DQPSK), 3 Mbps (8-DPSK), LE-1 Mbps,||Support data rate: 1 Mbps (GFSK), 2 Mbps (π/4-DQPSK), 3 Mbps (8-DPSK), LE-1 Mbps,|
||LE-2 Mbps, LE-LR-500K (S=2) and LE-LR-125K (S=8)|||



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|**Feature**|**Description**|
|---|---|
||▪Supports extended synchronous connections (eSCO) for enhanced voice quality by allowing|
||for retransmission of dropped packets|
||▪Adaptive frequency hopping (AFH) for reducing radio frequency interference|
||▪Host controller interface (HCI) using a highspeed UART and PCM/I2S for audio data|
||▪Low power consumption improves battery life of IoT and embedded devices|
||▪Supports multiple simultaneous Advanced Audio Distribution Profiles (A2DP) for stereo|
||sound|
||▪On-chip memory includes 512 KB SRAM and 2 MB ROM|



7 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

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_**Table 3: Specifications**_ 

|**Feature**|**Description**|
|---|---|
|**Physical Interface**|M.2 2230 E-Key standard form factor|
||M.2 1318 108-pin LGA package (including 8 thermal ground pads under the package)|
|**Wi-Fi Interface**|PCIe v3.0 Gen2|
||Secure Digital I/O 2.0/3.0|
|**Bluetooth/BLE Interface**|Host Controller Interface (HCI) using high speed UART|
|**Main Chipset**|Infineon AIROC™ CYW55573MIWBGT|
|**Input Voltage**|Typical DC 3.3 V, operating range from DC 3.13V to 3.5V|
|**Requirements**||
|**I/O Signalling Voltage**|Compliant with M.2 standard|
||Typical DC 1.8 V ± 5%|
|**Operating Temperature**|-40° to +85°C (-40° to +185°F)|
||**Note**: Absolute junction temperature 125 °C limit is maintained through active thermal|
||monitoring, throttling, and turning off one of the TX chains or both.|
|**Operating Humidity**|10 to 90% (non-condensing)|
|**Storage Temperature**|-40° to +85°C (-40° to +185°F)|
|**Storage Humidity**|10 to 90% (non-condensing)|
|**MSL (Moisture Sensitivity**|4|
|**Level)**||
|**Maximum Electrostatic**|Conductive 8KV; Air coupled 12KV (follows EN61000-4-2)|
|**Discharge**||
|**Size**|M.2 1318<br>M.2 E-Key|
||▪<br>Length: 18 mm<br>▪<br>Length: 30 mm|
||▪<br>Width: 13 mm<br>▪<br>Width: 22 mm|
||▪<br>Thickness: 0.43 mm<br>Thickness: 3.1 mm|
|**Weight – g (oz.)**|M.2 1318<br>M.2 E-Key|
||▪<br>~0.7<br>▪<br>3|
|**Wi-Fi Media**|Direct Sequence-Spread Spectrum (DSSS)|
||Complementary Code Keying (CCK)|
||Orthogonal Frequency Division Multiplexing (OFDM)|
||Orthogonal Frequency Division Multiple Access (OFDMA)|
|**Bluetooth Media**|Frequency Hopping Spread Spectrum (FHSS)|
|**Wi-Fi Multimedia**|WMM|
||Wi-Fi Multimedia - PowerSave (WMM-PS with U-APSD)|
||WMM-Sequential Access (WMM-SA)|
|**Network Architecture**|Infrastructure (client operation)|
|**Types**||
|**Wi-Fi Standards**|IEEE 802.11ax, 11ac, 11a/b/g/n, 11d/h, 11i, 11r, 11w, 11e, 11k, 11ai, 11v|
|**Bluetooth Standards**|Bluetooth 2.1 + EDR, 3.0, 4.2, 5.0, 5.1, 5.2, 5.3, 5.4|



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|**Feature**|||**Description**||
|---|---|---|---|---|
|**Wi-Fi Data Rates**|||Support 802.11 ax/ac/a/b/g/n 2x2 MU-MIMO.||
|**Supported**|||802.11b  (DSSS, CCK) 1, 2, 5.5, 11 Mbps||
||||802.11a/g (OFDM) 6, 9, 12, 18, 24, 36, 48, 54 Mbps||
||||802.11n  (OFDM, HT20/HT40, MCS0-15)||
||||802.11ac  (OFDM, VHT20, MCS0-8; OFDM, VHT40/HT80, MCS0-9)||
||||802.11ax  (2.4 GHz / OFDM / HE20 / MCS0-11; 2.4 GHz / OFDMA / HE20 / MCS0-11)|802.11ax  (2.4 GHz / OFDM / HE20 / MCS0-11; 2.4 GHz / OFDMA / HE20 / MCS0-11)|
||||802.11ax  (5 GHz, 6 GHz / OFDM / HE20, HE40, HE80 / MCS0-11;||
||||5 GHz, 6 GHz / OFDMA / HE20, HE40, HE80 / MCS0-11)||
|**Modulation Table**|||BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024-QAM||
|Modulation Type|||OFDM (IEEE 802.11n/ac)<br>OFDM (IEEE 802.11ax)||
|ee — | Spatial stream| Moduiation | Coding faut —_—_}_—__00 —_}<br>~~ee~~<br>ee<br>ee<br>Poo of<br>OCU<br>PSK<br>2<br>S72<br>135<br>5<br>93825 868<br>| 738<br>72 | 163 | 146<br>36 T4806<br>Poi<br>at<br>sk<br>a2<br>3<br>4a<br>er 30s<br>es<br>2<br>63s<br>46<br>44<br>325<br>293) F721 7 681 <br>Po2<br>tT 2 ft 2 ft<br>psk<br>a4<br>9s a7<br>405<br>45<br>a8<br>975<br>58 [244 T a19<br>516 [488 [439 [toa | 1021 <br>P33 fT<br>3 UT 38<br>t6-AM 26<br>89<br>54<br>oO ti7_—STt30=O<br>344<br>325 [203<br>638 [65<br>585<br>144i [1361 <br>P44 at<br>tam<br>34<br>39433<br>i<br>90755<br>95<br>56 [488 [439<br>1032 [975 [878<br>2162 | 2042 <br>Pos<br>tT 5<br>fT 5<br>AM Ts<br>52578<br>08<br>120<br>34<br>60SO<br>Ts T5855<br>i376 [130 [117 ~‘ 2882 [2722 <br>Pp 6 | 6 [ 6 | i J<br>640aMm [34 7 585 | 65<br>1215 | 135<br>2633 [ 2025 F774 [731 [ 658 [1549 [ 1463 [ 1316 [3243 [| 3063 <br>Pa<br>td ce fs | edfest<br>eons | os fos | ers | rai 9 1721 | 1025 | 1463 J 603 | mos |<br>Pos<br>ft 8 Tit<br>56-cAM<br>34<br>78867<br>e280<br>351<br>300_~—S<br>03.2<br>975<br>878 T2065 [195 [1755 7 4324 [| 4083||||ee<br>T4806<br> [613<br> [919<br> [1225<br> [1838<br> [245<br> [<br>|<br> ||
|Pia ft 4<br>4<br>6AM<br>Vis fT 5<br>5<br>AM|||34<br>78867]<br>e280<br>351 | 00=C<br>1032=~<br>975<br>878 T2065 [195 [1755 [4324 | 4083 <br> 230456<br>26 Tao<br>aes<br>520,<br>i376 [i30_ 1172753 [260 [2345765 [5444|[367.5<br> [490|
|Peiset 7<br>| 7<br>AM<br>Pp 8<br>tf<br>8 fT 2<br>60am<br>Lio | 9 | 2<br>256-OAM <br>a|||56<br>130444<br>270 | 300<br>585 | 50721 | 1625 | 1463 9 3441 | 325 | 2025 Ff 7206 | 6806 <br>34<br>156 T1733<br>324<br>360702] 780<br>065<br>195 T1755<br>4129 | 300 [| 351<br>8647 | 8i67 <br> 56 TNA TNA<br>360<br>400=S 780<br>866.7<br>2094 | 2167 | 19 ~~ 4588 | 4333 [7<br>3900 FT 9608 | 9074 <br>| 2581 | 2438 | 2194 Ff 5162 | 4875 | 4388 Ff 10809 | 10208||<br> |<br> |<br> ||
|PMCS Index|<br>=<br>Modul<br>Coding|OFDMA(IEEE802.11ax)<br>-———zetoneU<br>StoneRUT<br>ObtoneRUT<br>2ztoneRU_ ET<br>BAtoneRU<br>886-tone|||RU|
|Pot<br>sk 2 kt<br>ts<br>35 33<br>3<br>75 7<br>6<br>172<br>163<br>14<br>4 | 325 | 293 F721 | 681 <br>Poo2) TC<br>SK<br>8<br>es<br>es<br>53s<br>5<br>4c<br>is<br>06 fT 96<br>258 [244<br>219 F516 JT 488 [39 FO 1081 | 1021 <br>P36<br>AM<br>2<br>35<br>33<br>3s 7<br>6?<br>6C5 4<br>28<br>344 | 325 7 293 7 638 | 65 | 585<br>144i [1961 <br>Ppo4<br>6AM<br>34 5s 5<br>4<br>06 | to<br>ss fig<br>516 | 488 fT 439<br>1032 | 975 | 878 Ff 2162 | 2042 <br>PS<br>OAM<br>as 7<br>6<br>4<br>33<br>12<br>8s<br>5s<br>as<br>6s<br>58S<br>1376<br>130 i782<br>272.2 <br>Po6TAM<br>a4<br>79<br>7s<br>6s<br>59 Tis<br>135<br>338<br>aig TO 287<br>774 [731 7 658 7 1549 [1463 [1316 T3243 [3063 <br>Ppo7 Tt<br>AM<br>56<br>8s<br>8s<br>75<br>i176 | 167 | 15<br>375<br>354 fT 319 Tes 8s<br>731 7 1721 | 1625 | 1463 7 3603 | 3403 <br>Pos yt<br>56-0AM<br>a4<br>06 Tio To<br>2 fo<br>ss<br>83<br>032 [97s<br>878<br>2065<br>195<br>1755<br>4324<br>408.3<br>Pg<br>tT 256-0AM 6<br>ne Ti fo<br>35222<br>20<br>50472<br>425<br>47 T1083 [975 9 2294 | 2167 | 195<br>4904 | 537 <br>Pot<br>t024-0aM<br>34<br>132<br>125<br>3s<br>265 ses<br>63<br>531<br>478<br>129 | i219 T 1097_JF 2581 | 2438 | 2194 T5404 [5104|||||
|Pp8<br>256-0AM<br>34|2||fo<br>8<br>4a<br>40<br>6<br>65<br>065 | 195<br>1755<br>4129 | 390 | 351<br>9647 [| 8167||
|**802.11ax/ac/n Spatial**|||2 (2x2 MU-MIMO)||
|**Streams**|||||
|**Bluetooth Data Rates**|||1, 2, 3 Mbps||
|**Supported**|||||
|**Bluetooth Modulation**|||GFSK @ 1 Mbps||
||||Pi/4-DQPSK @ 2 Mbps||
||||8-DPSK @ 3 Mbps||
|**Bluetooth LE Data Rates**|**Bluetooth LE Data Rates**||1, 2 Mbps, 500 Kbps (S=2), 125 Kbps (S=8)||
|**Supported**|||||
|**Bluetooth LE Modulation**|**Bluetooth LE Modulation**||GFSK @ 1, 2 Mbps||
||||GFSK @ 125, 500 Kbps||



9 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

|**Feature**||**Description**|
|---|---|---|
|**Regulatory Certifications**|United States (FCC)||
||EU - Member countries of European Union (ETSI)|EU - Member countries of European Union (ETSI)|
||Great Britain (UKCA)||
||Canada (ISED)||
||Australia/New Zealand (RCM)||
||Japan(MIC)||
|**2.4 GHz Frequency Bands**|**EU:**2.4 GHz to 2.483 GHz||
||**FCC/ISED:**2.4 GHz to 2.473 GHz||
||**UKCA**: 2.4 GHz to 2.483 GHz||
||**MIC:**2.4 GHz to 2.483 GHz||
||**RCM**: 2.4 GHz to 2.483 GHz||
|**5 GHz Frequency Bands**|**EU**||
||5.15 GHz to 5.35 GHz||
||5.47 GHz to 5.725 GHz||
||5.725 GHz to 5.85 GHz||
||**FCC**||
||5.15 GHz to 5.35 GHz||
||5.47 GHz to 5.725 GHz||
||5.725 GHz to 5.85 GHz||
||**ISED**||
||5.15 GHz to 5.35 GHz||
||5.47 GHz to 5.725 GHz||
||5.725 GHz to 5.85 GHz||
||**UKCA**||
||5.15 GHz to 5.35 GHz||
||5.47 GHz to 5.730 GHz||
||5.725 GHz to 5.850 GHz||
||**MIC**||
||5.15 GHz to 5.35 GHz||
||5.47 GHz to 5.725 GHz||
||**RCM**||
||5.15 GHz to 5.35 GHz||
||5.47 GHz to 5.725 GHz||
||5.725 GHz to 5.85 GHz||
|**6 GHz Frequency Bands**|**FCC / ISED**|**UKCA**|
||UNII-5, 5.925 GHz to 6.415 GHz|UNII-5, 5.945 GHz to 6.425 GHz|
||UNII-6, 6.435 GHz to 6.515 GHz|**MIC**|
||UNII-7, 6.535 GHz to 6.875 GHz|UNII-5, 5.945 GHz to 6.425 GHz|
||UNII-8, 6.895 GHz to 7.115 GHz|**RCM**|
||**EU**|UNII-5, 5.945 GHz to 6.425 GHz|
||UNII-5, 5.945 GHz to 6.425 GHz||



10 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

|**Transmit Power **|**802.11a **||
|---|---|---|
||6 Mbps|16.5 dBm (44.66 mW)|
|**_Note:_**_Transmit power on_<br>_each channel varies per_|54 Mbps|16 dBm (39.81 mW)|
|_individual country_|**802.11b **||
|_regulations. All values are_<br>_nominal with +/-2 dBm_|1 Mbps|17 dBm (50.11 mW)|
|_tolerance at room_|11 Mbps|17 dBm (50.11 mW)|
|_temperature._ <br>_Tolerance could be up to +/-_<br>_2.5 dBm across operating_|**802.11g **<br>6 Mbps|16.5 dBm (44.66 mW)|
|_temperature._|54 Mbps|16 dBm (39.81 mW)|
||**802.11n (2.4 GHz) **||
|**_Note:_**|HT20; MCS0-4, MCS8-12|16 dBm (39.81 mW)|
|_HT20/VHT20/HE20 –_|HT20; MCS5-7, MCS13-15|15 dBm (31.62 mW)|
|_20 MHz-wide channels_|**802.11ax (2.4 GHz)**||
|_HT40/VHT40/HE40 –_|HE20; MCS0-4|16 dBm (39.81 mW)|
|_40 MHz-wide channels_|HE20; MCS5-7|15 dBm (31.62 mW)|
|_HT80/VHT80/HE80 –_|HE20; MCS8-9|12.5 dBm (17.78 mW)|
|_80 MHz-wide channels_|HE20; MCS10-11|10.5 dBm (11.22 mW)|
||**802.11n (5 GHz) **||
||HT20; MCS0-4, MCS8-12|16.5 dBm (44.66 mW)|
||HT20; MCS5-7, MCS13-15|16 dBm (39.81 mW)|
||HT40; MCS0-4, MCS8-12|16 dBm (39.81 mW)|
||HT40; MCS5-7, MCS13-15|15 dBm (31.62 mW)|
||**802.11ac (5 GHz) **||
||VHT20; MCS0-4|16.5 dBm (44.66 mW)|
||VHT20; MCS5-7|16 dBm (39.81 mW)|
||VHT20; MCS8|14 dBm (25.12 mW)|
||VHT40; MCS0-4|16 dBm (39.81 mW)|
||VHT40; MCS5-7|15 dBm (31.62 mW)|
||VHT40; MCS8-9|12 dBm (15.85 mW)|
||VHT80; MCS0-4|16 dBm (39.81 mW)|
||VHT80; MCS5-7|15 dBm (31.62 mW)|
||VHT80; MCS8-9|12 dBm (15.85 mW)|
||**802.11ax (5 GHz) **||
||HE20; MCS0-4|16.5 dBm (44.66 mW)|
||HE20; MCS5-7|16 dBm (39.81 mW)|
||HE20; MCS8-9|14 dBm (25.12 mW)|
||HE20; MC10-11|13 dBm (19.95 mW)|
||HE40; MCS0-4|16 dBm (39.81 mW)|
||HE40; MCS5-7|15 dBm (31.62 mW)|
||HE40; MCS8-9|12 dBm (15.85 mW)|
||HE40; MC10-11|11.5 dBm (14.13 mW)|
||HE80; MCS0-4|16 dBm (39.81 mW)|
||HE80; MCS5-7|15 dBm (31.62 mW)|
||HE80;MCS8-9|12 dBm(15.85 mW)|



11 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

© Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

|**Feature**||**Description**|**Description**|
|---|---|---|---|
||HE80; MCS10-11||11 dBm (12.59 mW)|
||**802.11ax (6 Hz, UNII-5 / 6) **|||
||11a; 6M-24M||15.5 dBm (35.48 mW)|
||HE20; MCS0-6||15.5 dBm (35.48 mW|
||HE20; MCS7||15 dBm (31.62 mW)|
||HE20; MCS8||14.5 dBm (28.18 mW)|
||HE20; MCS9-11||12 dBm (15.85 mW)|
||HE40; MCS0-6||15.5 dBm (35.48 mW)|
||HE40; MCS7||14 dBm (25.12 mW)|
||HE40; MCS8||12.5 dBm (17.78 mW)|
||HE40; MCS9||12 dBm (15.85 mW)|
||HE40; MCS10-11||11 dBm (12.59 mW)|
||HE80; MCS0-6||15 dBm (31.62 mW)|
||HE80; MCS7||14 dBm (25.12 mW)|
||HE80; MCS8||12 dBm (15.85 mW)|
||HE80; MCS9||11 dBm (12.59 mW)|
||HE80; MCS10-11||10 dBm (10 mW)|
||**802.11ax (6 Hz, UNII-7 / 8) **|||
||11a; 6M-24M||15 dBm (31.62 mW)|
||HE20; MCS0-6||15 dBm (31.62 mW)|
||HE20; MCS7||13 dBm (19.95 mW)|
||HE20; MCS8||12 dBm (15.85 mW)|
||HE20; MCS9-11||10.5 dBm (11.22 mW)|
||HE40; MCS0-6||15 dBm (31.62 mW)|
||HE40; MCS7||12 dBm (15.85 mW)|
||HE40; MCS8||11 dBm (12.59 mW)|
||HE40; MCS9||10 dBm (10 mW)|
||HE40; MCS10-11||8.5 dBm (7.08 mW)|
||HE80; MCS0-6||14.5 dBm (28.18 mW)|
||HE80; MCS7||11 dBm (12.59 mW)|
||HE80; MCS8||10 dBm (10 mW)|
||HE80; MCS9-11||8.5 dBm (7.08 mW)|
||**Bluetooth **|||
||1 Mbps (1DH1 3, 5)||7 dBm (5 mW), Maximum|
||2 Mbps (2DH1, 3, 5)||3 dBm (1.99 mW), Maximum|
||3 Mbps (3DH1, 3, 5)||3 dBm (1.99 mW), Maximum|
||LE (1 Mbps, 2 Mbps)||7 dBm (5 mW), Maximum|
||LE-LR (S=2, S=8)||7 dBm (5 mW), Maximum|



12 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

|**Feature**|||**Description**|
|---|---|---|---|
|**Typical Receiver**||**802.11a:**||
|**Sensitivity**||6 Mbps|-92 dBm|
|(PER <= 10%)||54 Mbps|-75 dBm|
|**_Note:_**_All values nominal, +/-_||**802.11b:**||
|_3 dBm._||1 Mbps|-96 dBm(PER < 8%)|
|||11 Mbps|-90 dBm(PER < 8%)|
|||**802.11g:**||
|||6 Mbps|-93 dBm|
|||54 Mbps|-76 dBm|
|||**802.11n (2.4 GHz)**||
|||6.5 Mbps(MCS0;HT20)|-93 dBm|
|||65 Mbps(MCS7;HT20)|-75 dBm|
||**802.11ax (2.4 GHz)**|||
|||7.3 Mbps (MCS0; HE20)|-93 dBm|
|||121.9 Mbps (MCS11; HE20)|-62 dBm|
|||7.3 Mbps(MCS0;HE20/RU242)|-93 dBm|
|||**802.11n (5 GHz)**||
|||6.5 Mbps(MCS0;HT20)|-93 dBm|
|||65 Mbps (MCS7; HT20)|-73 dBm|
|||13.5Mbps (MCS0; HT40)|-90 dBm|
|||135Mbps(MCS7;HT40)|-71 dBm|
|||**802.11ac (5 GHz)**||
|||6.5 Mbps(MCS0;VHT20)|-93 dBm|
|||78 Mbps (MCS8; VHT20)|-70 dBm|
|||13.5 Mbps (MCS0; VHT40)|-90 dBm|
|||180 Mbps (MCS9; VHT40)|-65 dBm|
|||29.3 Mbps (MCS0; VHT80)|-87 dBm|
|||390 Mbps(MCS9;VHT80)|-62 dBm|
|||**802.11ax (5 GHz)**||
|||7.3 Mbps (MCS0; HE20)|-90 dBm|
|||121.9 Mbps (MCS11; HE20)|-60 dBm|
|||7.3 Mbps (MCS0; HE20/RU242)|-90 dBm|
|||14.6 Mbps (MCS0; HE40)|-88 dBm|
|||243.8 Mbps (MCS11; HE40)|-58 dBm|
|||14.6 Mbps (MCS0; HE40/RU484)|-88 dBm|
|||30.6 Mbps (MCS0; HE80)|-87dBm|
|||510.4 Mbps (MCS11; HE80)|-55 dBm|
|||30.6 Mbps(MCS0;HE80/RU996)|-87 dBm|
|||**802.11ax (6 GHz, UNII-5)**||
|||6 Mbps|-90 dBm|
|||24 Mbps|-83 dBm|
|||7.3 Mbps (MCS0; HE20)|-90 dBm|
|||121.9 Mbps (MCS11; HE20)|-60 dBm|
|||7.3 Mbps (MCS0; HE20/RU242)|-90 dBm|
|||14.6 Mbps (MCS0; HE40)|-89 dBm|
|||243.8 Mbps (MCS11; HE40)|-56 dBm|
|||14.6 Mbps (MCS0; HE40/RU484)|-89 dBm|
|||30.6 Mbps (MCS0; HE80)|-87 dBm|
|||510.4 Mbps (MCS11; HE80)|-54 dBm|
|||30.6 Mbps(MCS0;HE80/RU996)|-87 dBm|



13 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

© Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

|**Feature**|||**Description**|**Description**||
|---|---|---|---|---|---|
|||**802.11ax (6 GHz, UNII-6)**||||
||||6 Mbps|-89 dBm||
||||24 Mbps|-82 dBm||
||||7.3 Mbps (MCS0; HE20)|-89 dBm||
||||121.9 Mbps (MCS11; HE20)|-59 dBm||
||||7.3 Mbps (MCS0; HE20/RU242)|-89 dBm||
||||14.6 Mbps (MCS0; HE40)|-88 dBm||
||||243.8 Mbps (MCS11; HE40)|-55 dBm||
||||14.6 Mbps (MCS0; HE40/RU484)|-88 dBm||
||||30.6 Mbps (MCS0; HE80)|-85 dBm||
||||510.4 Mbps (MCS11; HE80)|-54 dBm||
||||30.6 Mbps(MCS0;HE80/RU996)|-85 dBm||
|||**802.11ax (6GHz, UNII-7)**||||
||||6 Mbps|-86 dBm||
||||24 Mbps|-81 dBm||
||||7.3 Mbps (MCS0; HE20)|-86 dBm||
||||121.9 Mbps (MCS11; HE20)|-58 dBm||
||||7.3 Mbps (MCS0; HE20/RU242)|-86 dBm||
||||14.6 Mbps (MCS0; HE40)|-85 dBm||
||||243.8 Mbps (MCS11; HE40)|-55 dBm||
||||14.6 Mbps (MCS0; HE40/RU484)|-85 dBm||
||||30.6 Mbps (MCS0; HE80)|-84 dBm||
||||510.4 Mbps (MCS11; HE80)|-52 dBm||
||||30.6 Mbps(MCS0;HE80/RU996)|-84 dBm||
|||**802.11ax (6 GHz, UNII-8)**||||
||||6 Mbps|-85 dBm||
||||24 Mbps|-79 dBm||
||||7.3 Mbps (MCS0; HE20)|-85 dBm||
||||121.9 Mbps (MCS11; HE20)|-56 dBm||
||||7.3 Mbps (MCS0; HE20/RU242)|-85 dBm||
||||14.6 Mbps (MCS0; HE40)|-84 dBm||
||||243.8 Mbps (MCS11; HE40)|-53 dBm||
||||14.6 Mbps (MCS0; HE40/RU484)|-84 dBm||
||||30.6 Mbps (MCS0; HE80)|-83 dBm||
||||510.4 Mbps (MCS11; HE80)|-51 dBm||
||||30.6 Mbps(MCS0;HE80/RU996)|-83 dBm||
||||**Bluetooth:**|||
||||1 Mbps (1DH5)|-91 dBm||
||||2Mbps(2DH5)|-93 dBm||
||||3 Mbps(3DH5)|-87 dBm||
||||LE-1 Mbps|-95 dBm||
||||LE-2 Mbps|-92 dBm||
||||LE-LR (S=2)|-102 dBm||
||||LE-LR (S=8)|-107 dBm||
|**Operating Systems**||Linux||||
|**Supported**||Android||||
|**Security**||▪|WPA, WPA2 (Enterprise) and WPA3 (Enterprise) support for powerful encryption and|WPA, WPA2 (Enterprise) and WPA3 (Enterprise) support for powerful encryption and||
||||authentication|||
|||▪|AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility|AES and TKIP in hardware for faster data encryption and IEEE 802.11i compatibility||
|||▪|Reference WLAN subsystemprovides Wi-Fi Protected Setup (WPS)|||



14 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

© Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

|**Feature**||||**Description**|
|---|---|---|---|---|
|**Compliance**||**EU**|||
|||EN 300 328||EN 62368-1:2014|
|||EN 301 489-1||EN 300 440|
|||EN 301 489-17||EN 303 687|
|||EN 301 893||2011/65/EU(RoHS)|
|||**FCC**||**ISED Canada**|
|||47 CFR FCC Part 15.247||RSS-247|
|||47 CFR FCC Part 15.407||RSS-248|
|||47 CFR FCC Part 2.1091|||
|||**AS/NZS**||**MIC**|
|||AS/NZS 4268:2017||ARIB STD-T66/RCR STD-33 (2.4 GHz)|
|||||ARIB STD-T71 (5 GHz)|
|||||Article 2 Paragraph 1 of Item 80 :|
|||||LPI(ZR),6 GHz|
|**Certifications**||**_Bluetooth®_ SIG**<br>**Qualification**|Q||
|||D063147|||
|**Warranty**||One Year Warranty|||
|||**_All specifications are subject to change without notice_**|||



15 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

## 5 WLAN FUNCTIONAL DESCRIPTION 

The Sona IF573 series wireless module is designed based on the Infineon AIROC CYW55573MIWBGT Wi-Fi 6E chipset (dualcore 2x2 MIMO). It is optimized for high speed, reliability, and low-power embedded applications. It is integrated with tri-band WLAN (2.4/5/6 GHz) and Bluetooth 5.4. Its functionality is listed in Table 4. 

## _**Table 4: WLAN functions**_ 

- **Feature Description** 

- ~~ee~~ **WLAN** ▪ Enhanced MAC for supporting IEEE 802.11a/b/g/n/ac/ax features **MAC** ▪ Transmission and reception of HE-SU and HE-ER-SU PPDU ▪ Reception of HE-MU PPD -OFDMA/MU-MIMO frame ▪ Transmission of HE-TB PPDU (Uplink MU OFDMA) ▪ Transmission and reception of A-MPDUs/AMSDUs for very high throughput (VHT) 

   - Support for power management schemes, including WMM power-save, programmable state machine (PSM) operation 

   - Support for all ACK and Block-ACK policies as per standard 

   - ▪ Interframe space timing support, including RIFS ▪ Support for RTS/CTS and CTS-to-nowhere frame sequences for protecting frame exchanges ▪ Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon transmission time (TBTT) generation in hardware and capturing the TSF timer on an external time synchronization pulse 

   - Hardware offload for cipher suites/encryption types WEP, TKIP(WPA), AES(WPA2), support for WPA3SAE and key management 

||▪<br>▪|Timing synchronization function (TSF), network allocation vector (NAV) maintenance, and target beacon<br>transmission time (TBTT) generation in hardware and capturing the TSF timer on an external time<br>synchronization pulse<br>Hardware offload for cipher suites/encryption types WEP, TKIP(WPA), AES(WPA2), support for WPA3-<br>SAE and key management|
|---|---|---|
||▪|Support for coexistence with Bluetooth|
||▪|RTS-CTS based BW signalingmechanism support|
|**WLAN**|▪|WLAN Encryption features supported include:|
|**Security**||–<br>Temporal Key Integrity Protocol (TKIP)/Wired Equivalent Privacy (WEP)|
|||–<br>Advanced Encryption Standard (AES)/Wi-Fi Multi-Media (WMM)<br>–<br>WLAN Authentication and Private Infrastructure (WPAI)|



16 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

## **Feature Description** 

|**Feature**|**Descriptionptiontion**|**Descriptionptiontion**|**Descriptionptiontion**||||||
|---|---|---|---|---|---|---|---|---|
|**WLAN**|Channel frequency supported.||||||||
|**Channel**|**2.4 GHz / 20 MHz**||**5 GHz / 20 MHz**||**5 GHz / 40 MHz**||**5 GHz / 80 MHz**||
||**Channel**|**Channel**<br>**Frequency**|**Channel**|**Channel**<br>**Frequency**|**Channel**|**Frequency**|**Channel**|**Channel**<br>**Frequency**|
|||**(MHz)**||**(MHz)**||**(MHz)**||**(MHz)**|
||1|2412|36|5180|38|5190|42|5210|
||2|2417|40|5200|46|5230|58|5290|
||3|2422|44|5220|54|5270|106|5530|
||4|2427|48|5240|62|5310|122|5610|
||5|2432|52|5260|102|5510|138|5690|
||6|2437|56|5280|110|5550|155|5775|
||7|2442|60|5300|118|5590|||
||8|2447|64|5320|126|5630|||
||9|2452|100|5500|134|5670|||
||10|2457|104|5520|142|5710|||
||11|2462|108|5540|151|5755|||
||12|2467|112|5560|159|5795|||
||13|2472|116|5580|||||
||||120|5600|||||
||||124|5620|||||
||||128|5640|||||
||||132|5660|||||
||||136|5680|||||
||||140|5700|||||
||||144|5720|||||
||||149|5745|||||
||||153|5765|||||
||||157|5785|||||
||||161|5805|||||
||||165|5825|||||



|||||**6 GHz / UNII-5 **|**6 GHz / UNII-5 **|**6 GHz / UNII-5 **||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
||**20 MHz**|||**40 MHz**||||**80 MHz**||**80 MHz**||
|**Channel**|**Frequency (MHz)**||**Channel**|**Channel**|**Frequency (MHz)**||**Channel**|||**Frequency (MHz)**||
|1||5955|3|||5965|7||||5985|
|5||5975|11|||6005|23||||6065|
|9||5995|19|||6045|39||||6145|
|13||6015|27|||6085|55||||6225|
|17||6035|35|||6125|71||||6305|
|21||6055|43|||6165|87||||6385|
|25||6075|51|||6205||||||
|29||6095|59|||6245||||||
|33||6115|67|||6285||||||
|37||6135|75|||6325||||||
|41||6155|83|||6365||||||
|45||6175|91|||6405||||||
|49||6195||||||||||
|53||6215||||||||||
|57||6235||||||||||
|61||6255||||||||||
|65||6275||||||||||
|69||6295||||||||||
|73||6315||||||||||
|77||6335||||||||||
|81||6355||||||||||
|85||6375||||||||||
|89||6395||||||||||
|93||6415||||||||||



17 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

## **Feature Description** 

|||||**6 GHz / UNII**|**6 GHz / UNII**|**6 GHz / UNII-6 **|||||
|---|---|---|---|---|---|---|---|---|---|---|
||**20 MHz**|**20 MHz**|**20 MHz**||**40 MHz**|**40 MHz**||**80 MHz**|**80 MHz**|**80 MHz**|
|Channel|||**Frequency**|**Channel**|**Channel**|**Frequency**|**Channel**|||**Frequency**|
||||**(MHz)**|||**(MHz)**||||**(MHz)**|
|97|||6435|99||6445|103|||6465|
|101|||6455|107||6485|119|||6545|
|105|||6475|115||6525|||||
|109|||6495||||||||
|113|||6515||||||||



|||||**6 GHz / UNII**|**6 GHz / UNII**|**6 GHz / UNII-7 **|||||
|---|---|---|---|---|---|---|---|---|---|---|
||**20 MHz**|**20 MHz**|**20 MHz**||**40 MHz**|**40 MHz**||**80 MHz**|**80 MHz**|**80 MHz**|
|**Channel**|||**Frequency**|**Channel**|**Channel**|**Frequency**|**Channel**|||**Frequency**|
||||**(MHz)**|||**(MHz)**||||**(MHz)**|
|117|||6535|123||6565|135|||6625|
|121|||6555|131||6605|151|||6705|
|125|||6575|139||6645|167|||6785|
|129|||6595|147||6685|183|||6865|
|133|||6615|155||6725|||||
|137|||6635|163||6765|||||
|141|||6655|171||6805|||||
|145|||6675|179||6845|||||
|149|||6695|187||6885|||||
|153|||6715||||||||
|157|||6735||||||||
|161|||6755||||||||
|165|||6775||||||||
|169|||6795||||||||
|173|||6815||||||||
|177|||6835||||||||
|181|||6855||||||||
|185|||6875||||||||



|||||**6 GHz / UNII**|**6 GHz / UNII**|**6 GHz / UNII-8 **|||||
|---|---|---|---|---|---|---|---|---|---|---|
||**20 MHz**|**20 MHz**|**20 MHz**||**40 MHz**|**40 MHz**||**80 MHz**|**80 MHz**|**80 MHz**|
|**Channel**|||**Frequency**|**Channel**|**Channel**|**Frequency**|**Channel**|||**Frequency**|
||||**(MHz)**|||**(MHz)**||||**(MHz)**|
|189|||6895|195||6925|199|||6945|
|193|||6915|203||6965|215|||7025|
|197|||6935|211||7005|||||
|201|||6955|219||7045|||||
|205|||6975|227||7085|||||
|209|||6995||||||||
|213|||7015||||||||
|217|||7035||||||||
|221|||7055||||||||
|225|||7075||||||||
|229|||7095||||||||
|233|||7115||||||||



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## 6 BLUETOOTH FUNCTIONAL DESCRIPTION 

The Sona IF573 series wireless module includes a fully integrated Bluetooth baseband/radio. Several features and functions are listed in Table 5. 

## _**Table 5: Bluetooth functions**_ 

|**Feature**||**Description**|
|---|---|---|
|**Bluetooth Interface**|▪|Voice interface:|
|||–<br>Supported by PCM transports and bi-directional operations.|
|||–<br>Sample rates 8k for NBS and 16k for WBS supported.|
|||–<br>Sample width is limited to 16-bits.|
|||–<br>Synchronization clock width of 1 or 3 (short or long)|
|||–<br>Bit clocks of 128k, 256k, 512k, 1024k and 2024k, the only difference being the|
|||number of 16bit slots.|
|||–<br>HFP samples can be taken from any available slot. Slot 0 is the default slot.|
||▪|High-Speed UART interface|
|**Bluetooth Core**|▪|Supports all Bluetooth 5.3 and 4.2 features|
|**functionality**|▪|Dual-mode Bluetooth low energy|
||▪|Bluetooth LE LE-2Mbps mode, LE-Long Range mode, Advertising Extensions, Slot|
|||Availability Masks|
||▪|Extended inquiry response (EIR): Shortens the time to retrieve the device name, specific|
|||profile, and operating mode|
||▪|Encryption pause resume (EPR): Enables the us of Bluetooth technology in a much more|
|||secure environment|
||▪|Sniff subrating (SSR): Optimizes power consumption for low duty cycle asymmetric data|
|||flow, which subsequently extends battery life.|
||▪|Secure simple pairing (SSP): Reduces the number of steps for connecting two devices,|
|||with minimal or no user interaction required.|
||▪|Link supervision time out (LSTO): Additional commands added to HCI and link|
|||management protocol (LMP) for improved link time-out supervision.|
||▪|QoS enhancements: Changes to data traffic control, which results in better link|
|||performance. Audio, human interface device (HID), bulk traffic. SCO, and enhanced SCO|
|||(eSCO) are improved with the erroneous data (ED) and packet boundary flag (PBF)|
|||enhancements.|
|**Bluetooth Features**|▪|Supports features of Bluetooth Core Specification version 5.2:|
|||–<br>LE Isochronous Channels|
|||–<br>LE Power Control|
||▪|Supports features of Bluetooth Core Specification version 5.1:|
|||–<br>Direction Finding (AoA/AoD)|
|||–<br>Additional Advertising Channels|
|||–<br>Periodic Advertising Sync Transfer (PAST)|
|||–<br>GATT Caching|
||▪|Supports features of Bluetooth Core Specification version 5.0:|
|||–<br>LE 2Mbps|
|||–<br>LE Long Range (LE-LR)|
|||–<br>Stable Modulation Index for LE|
|||–<br>LE Advertising Extension|
|||–<br>Slot Availability Masks (SAM)|
|||–<br>Channel Selection Algorithm|
|||–<br>High Duty Cycle Non-Connectable Advertising|
||▪|Supports features of Bluetooth Core Specification version 4.0 + EDR|
|||–<br>Adaptive frequency hopping (AFH)|
|||–<br>Quality of service (QoS)|
|||–<br>Extended synchronous connections (eSCO) – Voice Connections|
|||–<br>Fast connect (interlaced page and inquiry scans)|



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|**Feature**|||**Description**|
|---|---|---|---|
|||–|Secure simple pairing (SSP)|
|||–|Sniff subrating (SSR)|
|||–|Encryption pause resume (EPR)|
|||–|Extended inquiry response (EIR)|
|||–|Link supervision timeout (LST)|
||▪|Multipoint operation with up to seven active slaves||
|||–|Maximum of seven simultaneous active ACL links|
|||–|Maximum of three simultaneous active SCO and eSCO connections with|
||||scattement support|
||▪|High-speed HCI UART transport support with low-power out-of-band BT_DEV_WAKE and||
|||BT_HOST_WAKE signaling.||



_**Figure 1: M.2 1318**_ 

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_**Figure 2: M.2 2230 E-Key**_ 

Table 6 summarizes the absolute maximum ratings and Table 7 lists the recommended operating conditions for the Sona IF573 series wireless module. Absolute maximum ratings are those values beyond which damage to the device can occur. Functional operation under these conditions, or at any other condition beyond those indicated in the operational sections of this document, is not recommended. 

**Note:** Maximum rating for signals follows the supply domain of the signals. 

_**Table 6: Absolute maximum ratings**_ 

|**Symbol (Domain)**|**Description**|**Max Rating**|**Unit**|
|---|---|---|---|
|VBAT|External DC power supply (M.2 1318)|+6.0|V|
|VDDIO|DC supply voltage for digital I/O (M.2 1318)|2.2|V|
|3V3|External 3.3V power supply (M.2 2230 E-Key)|4.0|V|
|Storage|Storage temperature|-40 to +125|°C|
|Antenna|Maximum RF input (reference to 50-Ω input)|+10|dBm|
|ESD|Electrostatic discharge tolerance|2000|V|



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_**Table 7: Recommended operating conditions**_ 

|**Symbol (Domain)**|**Parameter**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|
|VBAT|External DC power supply|3.13|3.3|3.47|V|
|VDDIO|DC supply voltage for digital I/O|1.71|1.8|1.89|V|
|T-ambient|Ambient temperature|-40|25|+85|°C|



Table 8 list the general DC electrical characteristics over recommended operating conditions (unless otherwise specified). 

_**Table 8: General DC electrical characteristics (For 1.8V operation VDDIO)**_ 

|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VIH|High Level Input Voltage|—|0.65 x VDDIO|—|—|V|
|VIL|Low Level Input Voltage|—|—|—|0.35 x VDDIO|V|
|VOH|Output high Voltage|—|VDDIO – 0.4|—|—|V|
|VOL|Output low Voltage|—|—|—|0.45|V|



Table 9, Table 10, and Table 11 summarize the Sona IF573 series wireless module receiver characteristics. 

|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|**_Table 9: WLAN receiver characteristics for 2.4 GHz single chain operation_**<br>**Item**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**<br>~~es~~<br>~~Genes es Gs I Ee~~|
|---|---|---|---|---|---|---|---|
|Frequency Range|Receive input frequency||—|2.412|—|2.484|GHz|
||range|||||||
|Modulation Type|Sensitivity|||||||
||CCK, 1 Mbps||See Note1|—|-96|—|dBm|
||CCK, 11 Mbps|||—|-90|—||
||OFDM, 6 Mbps|||—|-93|—||
||OFDM, 54 Mbps|||—|-76|—||
||HT20, MCS0|||—|-93|—||
||HT20, MCS7|||—|-75|—||
||HE20, MCS0|||—|-93|—||
||HE20, MCS11|||—|-62|—||
|ACI - OFDM|Adjacent channel rejection|ection||||||
|[Difference between  interfering and desired signal|OFDM, 6 Mbps||See Note1|—|30|—|dB|
|(25 MHz apart)]|OFDM, 54 Mbps|||—|15|—||
|ACI – 11n MCS0-7|HT20, MCS0|||—|30|—||
|[Difference between  interfering and desired signal|HT20, MCS7|||—|10|—||
|(25 MHz apart)]||||||||
|ACI – 11ax MCS0-11|HE20, MCS0|||—|30|—||
|[Difference between  interfering and desired signal|HE20, MCS7|||—|10|—||
|(25 MHz apart)]|HE20, MCS11|||—|TBD|—||



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_**Table 10: WLAN receiver characteristics for 5 GHz single chain operation**_ 

|**Item**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|FrequencyRange|Receive input frequencyrange|—|5.15|—|5.825|GHz|
|Modulation Type|Sensitivity||||||
||OFDM, 6 Mbps|See Note1|—|-92|—|dBm|
||OFDM, 54 Mbps||—|-75|—||
||HT20, MCS0||—|-93|—||
||HT20, MCS7||—|-73|—||
||HT40, MCS0||—|-90|—||
||HT40, MCS7||—|-71|—||
||VHT20, MCS0||—|-93|—||
||VHT20, MCS8||—|-70|—||
||VHT40, MCS0||—|-90|—||
||VHT40, MCS9||—|-65|—||
||VHT80, MCS0||—|-87|—||
||VHT80, MCS9||—|-62|—||
||HE20, MCS0||—|-92|—||
||HE20, MCS11||—|-60|—||
||HE40, MCS0||—|-90|—||
||HE40, MCS11||—|-58|—||
||HE80, MCS0||—|-87|—||
||HE80, MCS11||—|-55|—||
|ACI - OFDM|Adjacent channel rejection||||||
|[Difference between|OFDM, 6 Mbps||—|25|—|dB|
|interfering and desired|OFDM, 54 Mbps|See Note1|—|5|—||
|signal(20 MHz apart)]|||||||
|ACI – MCS0-11|MCS0||—|25|—|dB|
|[Difference between|MCS7|See Note1|—|5|—||
|interfering and desired|MCS11||—|TBD|—||
|signal(20 MHz apart)]|||||||
|ACI – MCS0-11|MCS0||—|24|—|dB|
|[Difference between|MCS7|See Note1|—|5|—||
|interfering and desired|MCS11||—|TBD|—||
|signal(40 MHz apart)]|||||||
|ACI – MCS0-11|MCS0||—|TBD|—|dB|
|[Difference between|MCS7|See Note1|—|TBD|—||
|interfering and desired|MCS11||—|TBD|—||
|signal(80 MHz apart)]|||||||



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_**Table 11: WLAN receiver characteristics for 6 GHz single chain operation**_ 

|**Item**|**Parameter**|**Conditions**|**UNII-5**|**Typical (Sensitivity)**<br>**UNII-6**|**Typical (Sensitivity)**<br>**UNII-6**<br>**UNII-7**|**Typical (Sensitivity)**<br>**UNII-6**<br>**UNII-7**|**UNII-8**|**Unit**|
|---|---|---|---|---|---|---|---|---|
|Frequency|Receive input frequency|—|5950 -|6435 -|6435 -|6535 -|6895 -|MHz|
|Range|range||6415|6515||6875|7115||
|Modulation Type|OFDM, 6Mbps|See Note1|-92|-91||-90|-88|dBm|
||OFDM, 24Mbps||-83|-82||-81|-79||
||HE20, MCS0||-92|-91||-90|-89||
||HE20, MCS7||-74|-73||-72|-70||
||HE20, MCS8||-69|-68||-67|-66||
||HE20, MCS9||-68|-67||-66|-64||
||HE20, MCS11||-60|-59||-58|-56||
||HE40, MCS0||-90|-89||-88|-86||
||HE40, MCS7||-71|-70||-69|-67||
||HE40, MCS8||-67|-66||-65|-63||
||HE40, MCS9||-65|-64||-63|-61||
||HE40, MCS11||-56|-55||-55|-53||
||HE80, MCS0||-87|-85||-84|-83||
||HE80, MCS7||-68|-67||-65|-64||
||HE80, MCS8||-64|-63||-62|-60||
||HE80, MCS9||-62|-61||-60|-58||
||HE80, MCS11||-54|-54||-52|-51||
|ACI - OFDM|6 Mbps|See Note1|25|25||25|25|dB|
|[Difference|||||||||
|between  interfering|||||||||
|and desired signal|||||||||
|(20 MHz apart)]|||||||||
|ACI – MCS0-11|MCS0|See Note1|25|25||25|25||
|[Difference|MCS7||5|5||5|5||
|between  interfering<br>and desired signal|MCS9||TBD|TBD||TBD|TBD||
|(20 MHz apart)]|MCS11||TBD|TBD||TBD|TBD||
|ACI – MCS0-11|MCS0|See Note1|24|24||24|24||
|[Difference|MCS7||5|5||5|5||
|between  interfering<br>and desired signal|MCS9||TBD|TBD||TBD|TBD||
|(40 MHz apart)]|MCS11||TBD|TBD||TBD|TBD||



**Note 1** : Performance data are measured in single chain operation. 

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Table 12 through Table 21 summarize the Sona IF573 series wireless module transmitter characteristics. 

|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~|**_Table 12: WLAN transmitter characteristics for 2.4 GHz operation (VBAT = 3.3V, VDDIO = 1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Conditions**<br>**Min**<br>**Typ**<br>~~a~~<br>~~es es es es es~~||**Max**|**Unit**|
|---|---|---|---|---|---|---|---|---|---|
||Ftx|Transmit output frequencyrange|—||2.402|—|2.484||GHz|
||Pout|Outputpower|See Note2|—||—||—|—|
|||11b mask compliant|1-11Mbps|—||17||—|dBm|
|||11gmask compliant|6-48Mbps|—||16.5||—||
|||11gEVM compliant|54Mbps|—||16||—||
|||11n HT20 mask compliant|MCS0-4|—||16||—||
|||11n HT20 EVM compliant|MCS5-7|—||15||—||
|||11ax HE20 mask compliant|MCS0-4|—||16||—||
|||11ax HE20 EVM compliant|MCS5-7|—||15||—||
|||11ax HE20 EVM compliant|MCS8-9|—||12.5||—||
|||11ax HE20 EVM compliant|MCS10-11|—||10.5||—||
||ATx|Transmitpower accuracyat 25℃|—|-2.0||—||+2.0|dB|



_**Table 13: WLAN current consumption on 2.4 GHz (VBAT = 3.3V, VDDIO = 1.8V, BT_REG_ON = Low)**_ 

|**Modulation**|**Data Rate**|**Spatial Stream**|**Output Power**<br>**(dBm)**|**VBAT Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|
|---|---|---|---|---|---|
|CCK|1 Mbps|1|19|272|5.6|
|BPSK|6 Mbps|1|18.5|261|3.6|
|64-QAM|HT20 MCS7|1|17|244|4.1|
|64-QAM|HT20 MCS15|2|17|439|5.0|
|256-QAM|HE20 MCS9|2|14.5|393|5.4|
|1024-QAM|HE20 MCS11|2|12.5|358|4.9|



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_**Table 14: WLAN transmitter characteristics for 5 GHz operation (VBAT=3.3V, VDDIO=1.8V)**_ 

|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Ftx|Transmit output frequencyrange|—|5.15|—|5.925|GHz|
|Pout|Outputpower|See Note2|—|—|—|—|
||11a mask compliant|6-36Mbps|—|16.5|—|dBm|
||11a EVM compliant|48-54Mbps|—|16|—||
||11n HT20 mask compliant|MCS0-4|—|16.5|—||
||11n HT20 EVM compliant|MCS5-7|—|16|—||
||11n HT40 mask compliant|MCS0-4|—|16|—||
||11n HT40 EVM compliant|MCS5-7|—|15|—||
||11ac VHT20 mask compliant|MCS0-4|—|16.5|—||
||11ac VHT20 EVM compliant|MCS5-7|—|16|—||
||11ac VHT20 EVM compliant|MCS8|—|14|—||
||11ac VHT40 mask compliant|MCS0-4|—|16|—||
||11ac VHT40 EVM compliant|MCS5-7|—|15|—||
||11ac VHT40 EVM compliant|MCS8-9|—|12|—||
||11ac VHT80 mask compliant|MCS0-4|—|16|—||
||11ac VHT80 EVM compliant|MCS5-7|—|15|—||
||11ac VHT80 EVM compliant|MCS8-9|—|12|—||
||11ax HE20 mask compliant|MCS0-4|—|16.5|—||
||11ax HE20 EVM compliant|MCS5-7|—|16|—||
||11ax HE20 EVM compliant|MCS8-9|—|14|—||
||11ax HE20 EVM compliant|MCS10-11|—|13|—||
||11ax HE40 mask compliant|MCS0-4|—|16|—||
||11ax HE40 EVM compliant|MCS5-7|—|15|—||
||11ax HE40 EVM compliant|MCS8-9|—|12|—||
||11ax HE40 EVM compliant|MCS10-11|—|11.5|—||
||11ax HE80 mask compliant|MCS0-4|—|16|—||
||11ax HE80 EVM compliant|MCS5-7|—|15|—||
||11ax HE80 EVM compliant|MCS8-9|—|12|—||
||11ax HE80 EVM compliant|MCS10-11|—|11|—||
|ATx|Transmitpower accuracyat 25℃|—|-2.0|—|+2.0|dB|



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_**Table 15: WLAN current consumption on 5 GHz (VBAT = 3.3V, VDDIO = 1.8V, BT_REG_ON = Low)**_ 

|**Modulation**|**Bandwidth**<br>**(MHz)**|**Data Rate**|**Spatial**<br>**Stream**|**Output Power**<br>**(dBm)**|**VBAT Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|
|---|---|---|---|---|---|---|
|BPSK|20|6 Mbps|1|18.5|401|3.6|
|64-QAM|20|54 Mbps|1|18|384|3.3|
|BPSK|20|MCS0|2|18.5|715|6.3|
|64-QAM|20|MCS7|2|18|720|5.8|
|256-QAM|20|MCS9|2|16|655|6.9|
|1024-QAM|20|MCS11|2|15|631|7.2|
|BPSK|40|MCS0|2|18|715|5.0|
|64-QAM|40|MCS7|2|17|700|4.5|
|256-QAM|40|MCS9|2|14|604|5.5|
|1024-QAM|40|MCS11|2|13.5|595|5.9|
|BPSK|80|MCS0|2|18|761|4.0|
|64-QAM|80|MCS7|2|17|730|3.7|
|256-QAM|80|MCS9|2|14|656|4.3|
|1024-QAM|80|MCS11|2|13|635|4.6|



_**Table 16: WLAN transmitter characteristics for UNII-5 and UNII-6 operation (VBAT = 3.3V, VDDIO = 1.8V)**_ 

|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Ftx|Transmit output frequencyrange|—|5.925|—|6.53|GHz|
|Pout|Outputpower|See Note2|—|—|—|—|
||11a mask compliant|6-24Mbps|—|15.5|—|dBm|
||11ax HE20 mask compliant|MCS0-6|—|15.5|—||
||11ax HE20 EVM compliant|MCS7|—|15|—||
||11ax HE20 EVM compliant|MCS8|—|14.5|—||
||11ax HE20 EVM compliant|MCS9-11|—|12|—||
||11ax HE40 mask compliant|MCS0-6|—|15.5|—||
||11ax HE40 EVM compliant|MCS7|—|14|—||
||11ax HE40 EVM compliant|MCS8|—|12.5|—||
||11ax HE40 EVM compliant|MCS9|—|12|—||
||11ax HE40 EVM compliant|MCS10-11|—|11|—||
||11ax HE80 mask compliant|MCS0-6|—|15|—||
||11ax HE80 EVM compliant|MCS7|—|14|—||
||11ax HE80 EVM compliant|MCS8|—|12|—||
||11ax HE80 EVM compliant|MCS9|—|11|—||
||11ax HE80 EVM compliant|MCS10-11|—|10|—||
|ATx|Transmitpower accuracyat 25℃|—|-2.0|—|+2.0|dB|



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_**Table 17: WLAN current consumption on UNII-5 band (VBAT = 3.3V, VDDIO = 1.8V, BT_REG_ON = Low)**_ 

|**Modulation**|**Bandwidth**<br>**(MHz)**|**Data Rate**|**Spatial**<br>**Stream**|**Output Power**<br>**(dBm)**|**VBAT Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|
|---|---|---|---|---|---|---|
|BPSK|20|6 Mbps|1|17.5|326|4.3|
|64-QAM|20|24 Mbps|1|17.5|336|3.6|
|BPSK|20|MCS0|2|17.5|631|6.5|
|64-QAM|20|MCS7|2|17|645|5.8|
|256-QAM|20|MCS9|2|14|548|5.1|
|1024-QAM|20|MCS11|2|14|536|4.8|
|BPSK|40|MCS0|2|17.5|638|4.9|
|64-QAM|40|MCS7|2|16|587|4.5|
|256-QAM|40|MCS9|2|14|534|4.1|
|1024-QAM|40|MCS11|2|13|518|3.8|
|BPSK|80|MCS0|2|17|691|4.1|
|64-QAM|80|MCS7|2|16|659|3.8|
|256-QAM|80|MCS9|2|13|571|4.5|
|1024-QAM|80|MCS11|2|12|558|4.2|



_**Table 18: WLAN current consumption on UNII-6 band (VBAT = 3.3V, VDDIO = 1.8V, BT_REG_ON = Low)**_ 

|**Modulation**|**Bandwidth**<br>**(MHz)**|**Data Rate**|**Spatial**<br>**Stream**|**Output Power**<br>**(dBm)**|**VBAT Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|
|---|---|---|---|---|---|---|---|
|BPSK|20|6 Mbps|1|17.5|341||4.4|
|64-QAM|20|24 Mbps|1|17.5|343||3.6|
|BPSK|20|MCS0|2|17.5|631||6.3|
|64-QAM|20|MCS7|2|17|637||5.9|
|256-QAM|20|MCS9|2|14|535||5.3|
|1024-QAM|20|MCS11|2|14|534||4.9|
|BPSK|40|MCS0|2|17.5|634||5.1|
|64-QAM|40|MCS7|2|16|581||4.6|
|256-QAM|40|MCS9|2|14|530||5.8|
|1024-QAM|40|MCS11|2|13|511||5.4|
|BPSK|80|MCS0|2|17|695||4.1|
|64-QAM|80|MCS7|2|16|666||5.0|
|256-QAM|80|MCS9|2|13|578||4.6|
|1024-QAM|80|MCS11|2|12|555||4.2|



28 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

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**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

_**Table 19: WLAN transmitter characteristics for UNII-7 and UNII-8 operation (VBAT = 3.3V, VDDIO = 1.8V)**_ 

|**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Ftx|Transmit output frequencyrange|—|6.53|—|7.125|GHz|
|Pout|Outputpower|See Note2|—|—|—|—|
||11a mask compliant|6-24Mbps|—|15|—|dBm|
||11ax HE20 mask compliant|MCS0-6|—|15|—||
||11ax HE20 EVM compliant|MCS7|—|13|—||
||11ax HE20 EVM compliant|MCS8|—|12|—||
||11ax HE20 EVM compliant|MCS9-11|—|10.5|—||
||11ax HE40 mask compliant|MCS0-6|—|15|—||
||11ax HE40 EVM compliant|MCS7|—|12|—||
||11ax HE40 EVM compliant|MCS8|—|11|—||
||11ax HE40 EVM compliant|MCS9|—|10|—||
||11ax HE40 EVM compliant|MCS10-11|—|8.5|—||
||11ax HE80 mask compliant|MCS0-6|—|14.5|—||
||11ax HE80 EVM compliant|MCS7|—|11|—||
||11ax HE80 EVM compliant|MCS8|—|10|—||
||11ax HE80 EVM compliant|MCS9-11|—|8.5|—||
|ATx|Transmitpower accuracyat 25℃|—|-2.0|—|+2.0|dB|



_**Table 20: WLAN current consumption on UNII-7 band (VBAT = 3.3V, VDDIO = 1.8V, BT_REG_ON = Low)**_ 

|**Modulation**|**Bandwidth**<br>**(MHz)**|**Data Rate**|**Spatial**<br>**Stream**|**Output Power**<br>**(dBm)**|**VBAT Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|
|---|---|---|---|---|---|---|---|
|BPSK|20|6 Mbps|1|17|321||4.4|
|64-QAM|20|24 Mbps|1|17|322||3.7|
|BPSK|20|MCS0|2|17|615||6.4|
|64-QAM|20|MCS7|2|15|576||5.9|
|256-QAM|20|MCS9|2|12.5|518||5.3|
|1024-QAM|20|MCS11|2|12.5|504||4.9|
|BPSK|40|MCS0|2|17|643||5.1|
|64-QAM|40|MCS7|2|14|552||4.7|
|256-QAM|40|MCS9|2|12|512||4.3|
|1024-QAM|40|MCS11|2|10.5|483||5.4|
|BPSK|80|MCS0|2|16.5|681||4.2|
|64-QAM|80|MCS7|2|13|590||5.0|
|256-QAM|80|MCS9|2|12|571||4.5|
|1024-QAM|80|MCS11|2|10.5|540||4.7|



29 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

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_**Table 21: WLAN current consumption on UNII-8 band (VBAT = 3.3V, VDDIO = 1.8V, BT_REG_ON = Low)**_ 

|**Modulation**|**Bandwidth**<br>**(MHz)**|**Data Rate**|**Spatial**<br>**Stream**|**Output Power**<br>**(dBm)**|**VBAT Current**<br>**Consumption**<br>**(mA)**|**VIO Current**<br>**Consumption**<br>**(mA)**|
|---|---|---|---|---|---|---|
|BPSK|20|6 Mbps|1|17|335|4.4|
|64-QAM|20|24 Mbps|1|17|333|3.7|
|BPSK|20|MCS0|2|17|630|6.3|
|64-QAM|20|MCS7|2|15|585|5.8|
|256-QAM|20|MCS9|2|12.5|521|5.2|
|1024-QAM|20|MCS11|2|12.5|526|6.7|
|BPSK|40|MCS0|2|17|637|5.0|
|64-QAM|40|MCS7|2|14|544|4.6|
|256-QAM|40|MCS9|2|12|516|4.4|
|1024-QAM|40|MCS11|2|10.5|480|5.5|
|BPSK|80|MCS0|2|16.5|661|4.1|
|64-QAM|80|MCS7|2|13|582|4.9|
|256-QAM|80|MCS9|2|12|569|4.5|
|1024-QAM|80|MCS11|2|10.5|541|4.7|



**Note 2:** Final TX power values on each channel are limited by regulatory requirements. 

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Table 22 through Table 26 describe the performance of the Bluetooth transmitter and receiver and the current consumption at 25°C. 

_**Table 22: BR / EDR transmitter performance (VBAT = 3.3V, VDDIO = 1.8V)**_ 

|**Test Parameter**|**Test Parameter**|**Min**|**Typ**|**Max**|**BT Spec.**|**Unit**|
|---|---|---|---|---|---|---|
|Maximum RF Output Power|GFSK|—|—|7|0 ~ +20|dBm|
||π/4-DQPSK|—|3|—|||
||8-DPSK|—|3|—|||
|Frequency Range||2.4|—|2.4835|2.4 ≤ f ≤ 2.4835|GHz|
|20 dB Bandwidth||—|914.5|—|≤ 1000|KHz|
|Δf1avg Maximum Modulation||140|154|175|140 < Δf1avg < 175|KHz|
|Δf2max Minimum Modulation||115|147|—|≥ 115|KHz|
|Δf2avg/Δf1avg||—|0.95|—|≥ 0.80|—|
|Initial Carrier Frequency||—|± 25|± 75|≤ ± 75|KHz|
|Frequency Drift (DH1 packet)||—|± 8|± 25|± 25|KHz|
|Frequency Drift (DH3 packet)||—|± 8|± 40|± 40|KHz|
|Frequency Drift (DH5 packet)||—|± 8|± 40|± 40|KHz|
|Drift rate||—|5|20|20|KHz/50us|
|EDRꙍi||—|—|± 75|≤ ± 75|KHz|
|EDRꙍ0||—|—|± 10|≤ ± 10|KHz|
|EDR (ꙍi +ꙍ0)||—|—|± 75|≤ ± 75|KHz|
|RMS DEVM for π/4-DQPSK|RMS DEVM for π/4-DQPSK|—|—|≤ 0.2|≤ 0.2|—|
|RMS DEVM for 8-DPSK||—|—|≤ 0.13|≤ 0.13|—|
|Peak DEVM for π/4-DQPSK|Peak DEVM for π/4-DQPSK|—|—|≤ 0.35|≤ 0.35|—|
|Peak DEVM for 8-DPSK||—|—|≤ 0.25|≤ 0.25|—|
|99% DEVM for π/4-DQPSK||—|—|≤ 0.30|≤ 0.30|—|
|99% DEVM for 8-DPSK||—|—|≤ 0.20|≤ 0.20|—|
|EDR In-Band Spurious||M-N| ≥ 2.5 MHz|—|-43|-40|< -40|dBm|
|Emission|1.5 MHz < |M-N| <|—|-31|-20|≤ -20|dBm|
||2.5 MHz||||||
||1.0 MHz < |M-N| <|—|-38|-26|≤ -26|dBm|
||1.5 MHz||||||



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_**Table 23: Basic Rate receiver performance (VBAT = 3.3V, VDDIO = 1.8V)**_ 

|**Test Parameter**|**Test Parameter**|**Min**|**Typ**|**Max**|**Bluetooth Spec.**|**Unit**|
|---|---|---|---|---|---|---|
|Sensitivity (1DH5)|BER ≤ 0.1%|—|-91|—|≤ -70|dBm|
|Maximum Input|BER ≤ 0.1%|—|—|-20|≥ -20|dBm|
|Interference Performance|Co-Channel|—|8.5|11|11|dB|
||C/I 1 MHz adjacent channel|—|-1.4|0|0|dB|
||C/I 2 MHz adjacent channel|—|-41|-30|-30|dB|
||C/I ≥ 3 MHz adjacent channel|—|-42.5|-40|-40|dB|
||C/I image channel|—|-31.5|-9|-9|dB|
||C/I 1-MHz adjacent to image channel|—|-44.5|-20|-20|dB|



_**Table 24: Enhanced Data Rate receiver performance (VBAT = 3.3V, VDDIO = 1.8V)**_ 

|**Test Parameter**||**Min**|**Typ**|**Max**|**Bluetooth Spec.**|**Unit**|
|---|---|---|---|---|---|---|
|Sensitivity (BER ≤ 0.01%)|π/4-DQPSK|—|-93|—|≤ -70|dBm|
||8-DPSK|—|-87|—|≤ -70|dBm|
|Maximum Input (BER ≤ 0.1%)|π/4-DQPSK|—|—|-20|≥ -20|dBm|
||8-DPSK|—|—|-20|≥ -20|dBm|
|C/I Co-Channel (BER ≤ 0.1%)|π/4-DQPSK|—|10.5|13|≤ ±13|dB|
||8-DPSK|—|18|21|≤ ±21|dB|
|C/I 1 MHz adjacent Channel|π/4-DQPSK|—|-6.5|0|≤ 0|dB|
||8-DPSK|—|-1|5|≤5|dB|
|C/I 2 MHz adjacent Channel|π/4-DQPSK|—|-38.5|-30|≤ -30|dB|
||8-DPSK|—|-36.5|-25|≤ -25|dB|
|C/I ≥ 3 MHz adjacent Channel|π/4-DQPSK|—|-42.5|-40|≤ -40|dB|
||8-DPSK|—|-41.5|-33|≤ -33|dB|
|C/I image channel|π/4-DQPSK|—|-30|-7|≤ -7|dB|
||8-DPSK|—|-22.5|0|≤ 0|dB|
|C/I 1 MHz adjacent to image channel|π/4-DQPSK|—|-47.5|-20|≤ -20|dB|
||8-DPSK|—|-41.5|-13|≤ -13|dB|
|Out-of-Band Blocking Performance|30-2000MHz|—|-10|—|—|dBm|
|(CW)|2-2.399GHz|—|-27|—|—|dBm|
|BER ≤ 0.1%|2.484-3GHz|—|-27|—|—|dBm|
||3-12.75GHz|—|-10|—|—|dBm|



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_**Table 25: BLE RF Specifications (VBAT = 3.3V, VDDIO = 1.8V)**_ 

|**_Table 25: BLE RF Specifications (VBAT = 3.3V, VDDIO = 1.8V)_**|**_Table 25: BLE RF Specifications (VBAT = 3.3V, VDDIO = 1.8V)_**|**_Table 25: BLE RF Specifications (VBAT = 3.3V, VDDIO = 1.8V)_**|**_Table 25: BLE RF Specifications (VBAT = 3.3V, VDDIO = 1.8V)_**|**_Table 25: BLE RF Specifications (VBAT = 3.3V, VDDIO = 1.8V)_**||||||
|---|---|---|---|---|---|---|---|---|---|
|**Parameter**|||**Conditions**|||**Min**|**Typ**|**Max**|**Unit**|
|Frequencyrange|||—|||2402|—|2480|MHz|
|Rx sensitivity1|||GFSK, PER ≤ 30.8%|1 Mbps||—|-95|—|dBm|
|||||2 Mbps||—|-92|—|dBm|
|||||500 Kbps||—|-102|—|dBm|
|||||125 Kbps||—|-107|—|dBm|
|Txpower2|||—|||—|—|7|dBm|
|Δf1 average|||1 Mbps|||225|255|275.5|KHz|
||||2 Mbps|||450|500|550|KHz|
||||125 Kbps|s||225|255|275|KHz|
|Δf2 average|||1 Mbps|||185|230|—|KHz|
|Δf2 maximum3|||2 Mbps|||370|450|—|KHz|
|Δf1 average (Stable Modulation)|||1 Mbps|||247.5|250|252.5|KHz|
||||2 Mbps|||495|500|550|KHz|
||||125 Kbps|s||247.5|250|252.5|KHz|
|Δf2 avg<br>Δf1 avg<br> ratio|||1 Mbps<br>2 Mbps|||0.8<br>0.8|1.0<br>1.0|—<br>—|%<br>%|
|**_Table 26: Bluetooth transmitter current consumption (VBAT = 3.3V, VDDIO = 1.8V, WL_REG_ON = OFF)_**<br>**Operation Mode**<br>**Data Rate**<br>**VBAT Current Consumption(mA)**<br>**VIO Current Consumption(mA)**<br>~~ee~~<br>~~esGe~~||||||||||
|Basic Data Rate|1DH5||18.9||||0.76|||
|Enhanced Data Rate|2DH5||18.4||||0.77|||
||3DH5||18.3||||0.77|||
|Low-Energy|1 Mbps||20.3||||0.76|||
||2 Mbps||13.4||||0.71|||
||500 Kbps||17.9||||0.75|||
||125 Kbps||23.6||||0.78|||



## **Notes:** 

## [1] Dirty Tx is Off. 

[2] The Bluetooth LE TX power cannot exceed 10 dBm EIRP specification limit. The front-end losses and antenna gain/loss must be factored in so as not to exceed the limit. 

[3] At least 99.9% of all Δf2 maximum frequency values recorded over 10 packets must be greater than 185 KHz. 

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## 10 HOST INTERFACE SPECIFICATIONS 

The Sona IF573 series wireless module SDIO host interface pins are powered from the VDDIO voltage supply, which is set internally at 1.8V on the M.2 module. The SDIO electrical specifications are identical for the 1-bit SDIO and 4-bit SDIO modes. 

**Note** : The SDIO host signals must be 1.8V at all times as defined by the M.2 standard. 

## _**Figure 3: SDIO protocol timing diagram - Default mode (1.8V)**_ 

_**Figure 4: SDIO protocol timing diagram – High-Speed mode (1.8V)**_ 

**Note:** Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. 

_**Table 27: SDIO timing requirements**_ 

|**_Table 27: SDIO timing requirements_**<br>**Symbol**<br>~~a~~|**_Table 27: SDIO timing requirements_**<br>**Symbol**<br>~~a~~|**_Table 27: SDIO timing requirements_**<br>**Parameter**<br>**Condition**<br>~~eses ~~|**_Table 27: SDIO timing requirements_**<br>**Parameter**<br>**Condition**<br>~~eses ~~|**Min.**<br>**Typ. **<br>**Max.**<br> ~~ss~~|**Min.**<br>**Typ. **<br>**Max.**<br> ~~ss~~|**Min.**<br>**Typ. **<br>**Max.**<br> ~~ss~~|**Unit**|
|---|---|---|---|---|---|---|---|
||fPP|Clock Frequency|Default Speed|0|-|25|MHz|
||||High-Speed|0|-|50||
||TWL|Clock low time|Default Speed|10|-|-|ns|
||||High-Speed|7|-|-||
||TWH|Clock high time|Default Speed|10|-|-|ns|
||||High-Speed|7|-|-||
||TISU|Input Setup time|Default Speed|5|-|-|ns|
||||High-Speed|6|-|-||
||TIH|Input Hold time|Default Speed|5|-|-|ns|
||||High-Speed|2|-|-||
||TODLY|Output delay time|Default Speed|-|-|14|ns|
|||CL≦40pF(1 card)|High-Speed|-|-|14||
||TOH|Output hold time|High-Speed|0|-|-|ns|



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_**Figure 5: SDIO protocol timing Diagram – SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)**_ 

**Note:** Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. 

|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|**_Table 28: SDIO timing requirements - SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>fPP<br>Clock Frequency<br>SDR12/25/50<br>25<br>-<br>100<br>MHz<br>~~ee~~<br>~~ee ee ee~~|
|---|---|---|---|---|---|---|
|TISU|Input setuptime|SDR12/25/50|3|--|-|ns|
|TIH|Input Hold time|SDR12/25/50|0.8|-|-|ns|
|TCLK|Clock Time|SDR12/25/50|10|-|40|ns|
|TCR, TCF|Raise time, Fall time|SDR12/25/50|-|-|0.2*TCLK|ns|
||TCR, TCF<2ns (max) at 100MHz||||||
||CCARD=10pF||||||
|TODLY|Output delay time|SDR12/25/50|-|-|7.5|ns|
||CL≦30pF||||||
|TOH|Output hold time|SDR12/25/50|1.5|-|-|ns|
||CL=15pF||||||



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_**Figure 6: SDIO protocol timing Diagram - SDR104 mode (up to 208 MHz) (1.8V)**_ 

**Note:** Over full range of values specified in the Recommended Operating Conditions unless otherwise specified. 

|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|**_Table 29: SDIO timing requirements -  SDR104 mode (up to 208MHz) (1.8V)_**<br>**Symbol**<br>**Parameter**<br>**Condition**<br>**Min.**<br>**Typ.**<br>**Max.**<br>**Unit**<br>~~aee~~|
|---|---|---|---|---|---|---|---|---|
|||fPP|Clock Frequency|SDR104|0|-|208|MHz|
|||TISU|Input setup time|SDR104|1.4|--|-|ns|
|||TIH|Input Hold time|SDR104|0.8|-|-|ns|
|||TCLK|Clock Time|SDR104|4.8|-|-|ns|
|||TCR, TCF|Raise time, Fall time|SDR104|-|-|0.2*TCLK|ns|
||||TCR, TCF <0.96ns (max) at 208MHz||||||
||||CCARD=10pF||||||
|||TOP|Card Output phase|SDR104|0|-|10|ns|
|||TODW|Output timing pf variable data window|SDR12/25/50|2.88|-|-|ns|



## 10.2 PCI Express Interface 

The Sona IF573 series wireless module supports the PCIe interface, which provides high-performance serial I/O interconnects and is also protocol compliant and electrically compatible with the PCI Express Base Specification v3.0 running at Gen2 speeds. 

Organization of the PCIe core is in logical layers: Transaction Layer, Data Link Layer, and Physical Layer, as shown in Figure 1Figure 7. A configuration or link management block is provided for enumerating the PCIe configuration space and supporting generation and reception of System Management Messages by communicating with PCIe layers. 

Each layer is partitioned into dedicated transmit and receive units that allow point-to-point communication between the host and Sona IF573 device. The transmit side processes outbound packets whereas the receive side processes inbound packets. Packets are formed and generated in the Transaction and Data Link Layer for transmission onto the high-speed links and onto the receiving device. A header is added at the beginning to indicate the packet type and any other optional fields. 

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## _**Figure 7: PCI Express Layer Model**_ 

## 10.5 PCM Interface Specifications 

The Sona IF573 series wireless module supports a PCM interface. The PCM interface on the Sona IF573 series wireless module can connect to linear PCM codec devices in Master/Slave mode. In Master mode, the Sona IF573 generates the BT_PCM_CLK and BT_PCM_SYNC signals, and in Slave mode, these signals are provided by another master on the PCM interface and are input to the Sona IF573 module. 

The configuration of the PCM interface may be adjusted by the host through the use of vendor-specific HCI commands. 

## 10.3.2 PCM Interface Timing 

_**Figure 8: PCM timing specification – Short Frames Sync, Master Mode**_ 

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_**Table 30: PCM timing specification – Short Frames Sync, Master Mode**_ 

|**_Table 30: PCM timing specification – Short Frames Sync, Master Mode_**|**_Table 30: PCM timing specification – Short Frames Sync, Master Mode_**|||||
|---|---|---|---|---|---|
|**Reference**|**Characteristics**|**Min.**|**Typ.**|**Max.**|**Unit**|
|1|PCM bit clock frequency|-|-|12.0|MHz|
|2|PCM bit clock LOW|41.0|-|-|ns|
|3|PCM bit clock HIGH|41.0|-|-|ns|
|4|BT_PCM_SYNC delay|0|-|25.0|ns|
|5|BT_PCM_OUT delay|0|-|25.0|ns|
|6|BT_PCM_IN setup|8.0|-|-|ns|
|7|BT_PCM_IN hold|8.0|-|-|ns|
|8|Delay from rising edge of BT_PCM_CLK during last bit|0|-|25.0|ns|
||period to BT_PCM_OUT becoming high impedance|||||



_**Figure 9: PCM timing specification – Short Frame Sync, Slave Mode**_ 

_**Table 31: PCM timing specification – Short Frame Sync, Slave Mode**_ 

|**_Table 31: PCM timing specification – Short Frame Sync, Slave Mode_**|**_Table 31: PCM timing specification – Short Frame Sync, Slave Mode_**|||||
|---|---|---|---|---|---|
|**Reference**|**Characteristics**|**Min.**|**Typ.**|**Max.**|**Unit**|
|1|PCM bit clock frequency|-|-|12.0|MHz|
|2|PCM bit clock LOW|41.0|-|-|ns|
|3|PCM bit clock HIGH|41.0|-|-|ns|
|4|BT_PCM_SYNC setup|8.0|-|-|ns|
|5|BT_PCM_SYNC hold|8.0|-|-|ns|
|6|BT_PCM_OUT delay|0|-|25.0|ns|
|7|BT_PCM_IN setup|8.0|-|-|ns|
|8|BT_PCM_IN hold|8.0|-|-|ns|
|9|Delay from rising edge of BT_PCM_CLK during last bit|0|-|25.0|ns|
||period to BT_PCM_OUT becoming high impedance|||||



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_**Figure 10: PCM timing specification – Long Frame Sync, Master Mode**_ 

_**Table 32: PCM timing specification – Long Frame Sync, Master Mode**_ 

|**Reference**|**Characteristics**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|1|PCM bit clock frequency|-|-|12.0|MHz|
|2|PCM bit clock LOW|41.0|-|-|ns|
|3|PCM bit clock HIGH|41.0|-|-|ns|
|4|BT_PCM_SYNC delay|0|-|25.0|ns|
|5|BT_PCM_OUT delay|0|-|25.0|ns|
|6|BT_PCM_IN setup|8.0|-|-|ns|
|7|BT_PCM_IN hold|8.0|-|-|ns|
|8|Delay from rising edge of BT_PCM_CLK during last bit period to|0|-|25.0|ns|
||BT_PCM_OUT becoming high impedance|||||



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_**Figure 11: PCM timing specification – Long Frame Sync, Slave Mode**_ 

_**Table 33: PCM timing specification – Long Frame Sync, Slave Mode**_ 

|**_Table 33: PCM timing specification – Long Frame Sync, Slave Mode_**|**_Table 33: PCM timing specification – Long Frame Sync, Slave Mode_**|||||
|---|---|---|---|---|---|
|**Reference**|**Characteristics**|**Min.**|**Typ.**|**Max.**|**Unit**|
|1|PCM bit clock frequency|-|-|12.0|MHz|
|2|PCM bit clock LOW|41.0|-|-|ns|
|3|PCM bit clock HIGH|41.0|-|-|ns|
|4|BT_PCM_SYNC setup|8.0|-|-|ns|
|5|BT_PCM_SYNC hold|8.0|-|-|ns|
|6|BT_PCM_OUT delay|0|-|25.0|ns|
|7|BT_PCM_IN setup|8.0|-|-|ns|
|8|BT_PCM_IN hold|8.0|-|-|ns|
|9|Delay from rising edge of BT_PCM_CLK during last bit|0|-|25.0|ns|
||period to BT_PCM_OUT becoming high impedance|||||



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_**Figure 12: PCM timing specification – Short Frame Sync, Receive Only, Burst Mode**_ 

_**Table 34: PCM timing specification – Short Frame Sync, Receive Only, Burst Mode**_ 

|**Reference**|**Characteristics**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|1|PCM bit clock frequency|-|-|24.0|MHz|
|2|PCM bit clock LOW|20.8|-|-|ns|
|3|PCM bit clock HIGH|20.8|-|-|ns|
|4|BT_PCM_SYNC setup|8.0|-|-|ns|
|5|BT_PCM_SYNC hold|8.0|-|-|ns|
|6|BT_PCM_IN setup|8.0|-|-|ns|
|7|BT_PCM_IN hold|8.0|-|-|ns|



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_**Figure 13: PCM timing specification – Long Frame Sync, Receive Only, Burst Mode**_ 

_**Table 35: PCM timing specification – Long Frame Sync, Receive Only, Burst Mode**_ 

|**Reference**|**Characteristics**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|
|1|PCM bit clock frequency|-|-|24.0|MHz|
|2|PCM bit clock LOW|20.8|-|-|ns|
|3|PCM bit clock HIGH|20.8|-|-|ns|
|4|BT_PCM_SYNC setup|8.0|-|-|ns|
|5|BT_PCM_SYNC hold|8.0|-|-|ns|
|6|BT_PCM_IN setup|8.0|-|-|ns|
|7|BT_PCM_IN hold|8.0|-|-|ns|



## 10.4 JTAG Interface 

The Sona IF573 supports the JTAG interface for use with proprietary debug and characterization test tools during board bringup. 

**Note:** The JTAG interface is disabled by default and not exposed on the M.2 2230 E-Key interface. 

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Sona IF573 has two signals that allow the host to control power consumption by enabling or disabling the Bluetooth, WLAN, and internal regulator block. 

- WL_REG_ON: Used to power up the WLAN. When this pin is high, the internal regulators are enabled and the WLAN section is out of reset. When this pin is low the WLAN section is in reset.  This signal is connected to the W_DISABLE1# pin on the M.2 interface. 

- BT_REG_ON: Used to power up the Bluetooth section. If both the BT_REG_ON and WL_REG_ON pins are low, the regulators are disabled. When this pin is low and WL_REG_ON is high, the Bluetooth section is in reset.  This signal is connected to the W_DISABLE2# pin on the M.2 interface. 

- **M.2 1318** - VBAT and VDDIO should not rise 10% - 90% faster than 40 microseconds. 

- **M.2 1318** - VBAT should be up before or at the same time as VDDIO. VDDIO should NOT be present first or be held high before VBAT is high. 

- Do not access the digital interface for at least 150 milliseconds after VDDC and VDDIO are available. 

_**Figure 14: WL_REG_ON = ON, BT_REG_ON = ON**_ 

_**Figure 15: WL_REG_ON = OFF, BT_REG_ON = OFF**_ 

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_**Figure 16: WL_REG_ON = ON, BT_REG_ON = OFF**_ 

_**Figure 17: WL_REG_ON = OFF, BT_REG_ON = ON**_ 

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_**Figure 18: WLAN Power-Up Sequence for PCIe Host**_ 

_**Figure 19: WLAN Boot-Up Sequence for SDIO Host**_ 

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## 12 PIN DEFINITIONS 

_**Table 36: M.2 1318 pin definitions**_ 

|**Pin #**|**Pin #**|**Name**|**Type**|**Voltage**<br>**Ref.**|**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|---|
|1||UIM_POWER_SRC/GPIO1|-|-|NA|-|
|2||UIM_POWER_SNK|-|-|NA|-|
|3||UIM_SWP|-|-|NA|-|
|4||3.3V|PWR|3.3V|Power SupplyInput|-|
|5||3.3V|PWR|3.3V|Power SupplyInput|-|
|6||GND|-|-|Ground|GND|
|7||RESERVED|-|-|NA|-|
|8||ALERT|-|-|NA|-|
|9||I2C_CLK|-|-|NA|-|
|10|10|I2C_DATA|-|-|NA|-|
|11|11|COEX_RXD|I|VDDIO|WLAN_JTAG_TMS|NC|
|12|12|COEX_TXD|I|VDDIO|WLAN_JTAG_TCK|NC|
|13|13|COEX3|I|VDDIO|WLAN_JTAG_TDI|NC|
|14|14|SYSCLK/GNSS_0|-|-|NA|-|
|15|15|TX_BLANKING/GNSS_1|-|-|NA|-|
|16|16|RESERVED|-|-|NA|-|
|17|17|GND|-|-|Ground|GND|
|18|18|RESERVED|I|VDDIO|▪<br>SDIO mode: WL_DEV_WAKE|NC|
||||||▪<br>PCIe mode: Reserved||
|19|19|RESERVED|O|VDDIO|WLAN_JTAG_TDO|NC|
|20|20|GND|-|-|Ground|GND|
|21|21|RESERVED|I|VDDIO|Reserved|NC|
|22|22|RESERVED|I|VDDIO|▪<br>PCIe mode: WL_DEV_WAKE|NC|
||||||▪<br>SDIO mode: Reserved||
|23|23|GND|-|-|Ground|GND|
|24|24|GPIO_1|I|VDDIO|WLAN Interface Select|-|
||||||▪<br>Pull to VDDIO for PCIe||
||||||▪<br>Pull to GND for SDIO||
|25|25|RESERVED|I|VDDIO|JTAG_SEL|GND|
||||||Reserved||
||||||**Must bepulled to GND for normal operation**||
|26|26|GND|-|-|Ground|GND|
|27|27|SUSCLK(32kHz)|I|VDDIO|External Sleep Clock (32.768 kHz)|-|
||||||**This clock must beprovided**||



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|**Pin #**|**Pin #**|**Name**|**Type**|**Voltage**<br>**Ref.**|**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|---|
|28|28|W_DISABLE1#|I|VDDIO|This pin controls the internal WL_REG_ON signal and|NC|
||||||has an internal 200K pull-down.||
||||||**This pin must be driven/pulled high to enable**||
||||||**WLAN**||
||||||Recommend controlling this signal via host GPIO for||
||||||optimalpower control.||
|29|29|PEWAKE#|O|VDDIO|PCI power management event output. Used to request|NC|
||||||a change in the device or system power state. The||
||||||assertion and de-assertion of this signal are||
||||||asynchronous to the PCIe reference clock.||
|30|30|CLKREQ#|O|VDDIO|PCIe clock request signal which indicates when the|NC|
||||||REFCLK to the PCIe interface can be gated.||
||||||▪<br>1 = the clock can be gated.||
||||||▪<br>0 = the clock is required.||
|31|31|PERST#|I|VDDIO|PCIe System Reset|NC|
|32|32|GND|-|-|Ground|GND|
|33|33|REFCLKn0|I|-|PCIE Differential Pair Clock Source (100 MHz)|NC|
||||||Negative Input.||
|34|34|REFCLKp0|I|-|PCIE Differential Pair Clock Source (100 MHz)|NC|
||||||Positive Input.||
|35|35|GND|-|-|Ground|GND|
|36|36|PETn0|O|-|PCIE Transmitter Differential Pair|NC|
||||||Negative Output||
|37|37|PETp0|O|-|PCIE Transmitter Differential Pair|NC|
||||||Positive Output||
|38|38|GND|-|-|Ground|GND|
|39|39|PERn0|I|-|PCIE Receiver Differential Pair|NC|
||||||Negative Input||
|40|40|PERp0|I|-|PCIE Receiver Differential Pair|NC|
||||||Positive Input||
|41|41|GND|-|-|Ground|GND|
|42|42|VENDOR DEFINED|PWR|VDDIO|1.8V IO Supplyfor all digital I/O|-|
|43|43|VENDOR DEFINED|-|-|NA|-|
|44|44|VENDOR DEFINED|-|-|NA|-|
|45|45|SDIO RESET#|-|-|NA|-|
|46|46|SDIO WAKE#|O|VDDIO|WL_HOST_WAKE|NC|
||||||Reserved||
|47|47|SDIO DATA3|I/O|VDDIO|SDIO Data line 3|NC|
|48|48|SDIO DATA2|I/O|VDDIO|SDIO Data line 2|NC|
|49|49|SDIO DATA1|I/O|VDDIO|SDIO Data line 1|NC|
|50|50|SDIO DATA0|I/O|VDDIO|SDIO Data line 0|NC|
|51|51|SDIO CMD|I/O|VDDIO|SDIO command line|NC|
|52|52|SDIO CLK|I|VDDIO|SDIO Clock Input|NC|
|53|53|UART WAKE#|O|VDDIO|BT_HOST_WAKE|NC|
||||||Reserved||



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|**Pin #**|**Name**|**Type**|**Voltage**<br>**Ref.**|**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|
|54|UART CTS|I|VDDIO|BT UART CTS|-|
|||||**Hardware handshake is required**||
|55|UART_Tx|O|VDDIO|BT UART Transmit|-|
|56|UART_Rx|I|VDDIO|BT UART Receive|-|
|57|UART_RTS|O|VDDIO|BT UART RTS|-|
|||||**Hardware handshake is required**||
|58|PCMFR1|I/O|VDDIO|BT_PCM Sync.|NC|
|||||Master mode: Generated by radio||
|||||Slave mode: Generated byexternal host||
|59|PCMIN|I|VDDIO|BT_PCM data input.|NC|
|60|PCMOUT|O|VDDIO|BT_PCM data output|NC|
|61|PCMCLK|I/O|VDDIO|BT_PCM Clock|NC|
|||||Master mode: Generated by radio||
|||||Save mode: Generated byexternal host||
|62|GND|-|-|Ground|GND|
|63|W_DISABLE2#|I|VDDIO|This pin controls the internal BT_REG_ON signal and|NC|
|||||has an internal 200K pull-down.||
|||||**Thispin must be controlled by host GPIO**||
|64|LED_2#|I/O|VDDIO|Reserved|NC|
|65|LED_1#|I/O|VDDIO|BT Interface Select/GPIO_12|-|
|||||**Thispin must bepulled high **||
|66|RESERVED|I|VDDIO|BT_DEV_WAKE|NC|
|||||Reserved||
|67|RESERVED|I|VDDIO|WLAN_JTAG_TRST|NC|
|||||Reserved||
|68|GND|-|-|Ground|GND|
|69|USB_D-|-|-|NA|NC|
|70|USB_D+|-|-|NA|NC|
|71|GND|-|-|Ground|GND|
|72|3.3V|PWR|3.3V|Power SupplyInput|-|
|73|3.3V|PWR|3.3V|Power SupplyInput|-|
|74~|GND|-|-|Ground|GND|
|78||||||
|79|BT_S|-|-|Bluetooth RF for trace antenna variant|-|
|||||Unused for MHF4 antenna connector variant||
|80~|GND|-|-|Ground|GND|
|85||||||
|86|WL_C0|-|-|WLAN RF Antenna 0 for trace antenna variant||
|||||Unused for MHF4 antenna connector variant||
|87~|GND|-|-|Ground|GND|
|93||||||
|94|WL_C1|-|-|WLAN RF Antenna 1 for trace antenna variant||
|||||Unused for MHF4 antenna connector variant||



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|**Pin #**|**Name**|**Type**|**Voltage**<br>**Ref.**||**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|---|
|95~|GND|-|-|Ground||GND|
|96|||||||
|G1~|GND|-|-|Ground||GND|
|G10|||||||



_**Table 37: M.2 2230 E-Key pin definitions**_ 

|**Pin**<br>**#**|**Name**|**Type**|**Voltage**<br>**Ref.**|**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|
|1|GND|-|-|Ground|GND|
|2|3.3V|PWR|3.3V|DC supply voltage for module.|-|
|||I/P||Operational is 3.13V to 3.6V||
|3|USB_D+|-|-|NA|NC|
|4|3.3V|PWR|3.3V|DC supply voltage for module.|-|
|||I/P||Operational is 3.13V to 3.6V||
|5|USB_D-|-|-|NA|NC|
|6|LED1#|I/O|3.3V|GPIO_12|NC|
|||||Reserved||
|7|GND|-|-|Ground|GND|
|8|PCM_CLK|I/O|1.8V|PCM clock. Can be master (Output) or slave (Input)|NC|
|9|SDIO CLK|I|1.8V|SDIO clock input|NC|
|10|PCM_SYNC|I/O|1.8V|PCM Sync. Can be master (Output) or slave (Input)|NC|
|11|SDIO CMD|I/O|1.8V|SDIO command line|NC|
|12|PCM_OUT|O|1.8V|PCM data output.|NC|
|13|SDIO DATA0|I/O|1.8V|SDIO data lin0|NC|
|14|PCM_IN|I|1.8V|PCM data input.|NC|
|15|SDIO DATA1|I/O|1.8V|SDIO data lin1|NC|
|16|LED2#|I/O|3.3V|GPIO_13|NC|
|||||Reserved||
|17|SDIO DATA2|I/O|1.8V|SDIO data lin2|NC|
|18|GND|-|-|Ground|GND|
|19|SDIO DATA3|I/O|1.8V|SDIO data lin3|NC|
|20|UART WAKE#|O|3.3V|BT_HOST_WAKE|NC|
|||||Reserved||
|21|SDIO WAKE#|O|1.8V|WL_HOST_WAKE|NC|
|||||Reserved||
|22|UART_TXD|O|1.8V|BT UART Transmit|NC|
|23|SDIO RESET#|-|-|NC|NC|
|32|UART_RXD|I|1.8V|BT UART Receive|NC|
|33|GND|-|-|Ground|GND|



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|**Pin**<br>**#**|**Name**|**Type**|**Voltage**<br>**Ref.**|**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|
|34|UART_RTS|O|1.8V|BT UART RTS|NC|
|||||**Hardware handshake is required**||
|35|PERp0|I|-|PCIE Receiver Differential Pair Positive Input|NC|
|36|UART_CTS|I|1.8V|BT UART CTS|NC|
|||||**Hardware handshake is required**||
|37|PERn0|I|-|PCIE Receiver Differential Pair Negative Input|NC|
|38|VENDER|O|1.8V|WLAN_JTAG_TDO|NC|
||DEFINED38|||Reserved||
|39|GND|-|-|Ground|GND|
|40|VENDER|I|1.8V|WL_DEV_WAKE|NC|
||DEFINED40|||Reserved||
|41|PETp0|O|-|PCIE Transmitter Differential Pair Positive Output|NC|
|42|VENDER|I|1.8V|BT_DEV_WAKE|NC|
||DEFINED42|||Reserved||
|43|PETn0|O|-|PCIE Transmitter Differential Pair Negative Output|NC|
|44|COEX3|I|1.8V|WLAN_JTAG_TDI|NC|
|||||Reserved||
|45|GND|-|-|Ground|GND|
|46|COEX2|I|1.8V|WLAN_JTAG_TCK|NC|
|||||Reserved||
|47|REFCLKp0|I|-|PCIE Differential Pair Clock Source (100 MHz) Positive Input.|NC|
|48|COEX1|I|1.8V|WLAN_JTAG_TMS|NC|
|||||Reserved||
|49|REFCLKn0|I|-|PCIE Differential Pair Clock Source (100 MHz) Negative Input.|NC|
|50|SUSCLK|I|3.3V|External Sleep Clock (32.768 kHz)|-|
|||||**This clock must be provided**||
|51|GND|-|-|Ground|GND|
|52|PERST0#|I|3.3V|PCIe System Reset|NC|
|53|CLKREQ0#|O|3.3V|PCIe clock request signal which indicates when the REFCLK|NC|
|||||to the PCIe interface can be gated.||
|54|W_DISABLE2#|I|3.3V|This pin controls the internal BT_REG_ON signal and has a|NC|
|||||10K pull-up on the M.2 2230 module.||
|||||**This pin must be controlled by host GPIO**||
|55|PEWAKE0#|O|3.3V|PCI power management event output. Used to request a|NC|
|||||change in the device or system power state. The assertion and||
|||||deassertion of this signal is asynchronous to the PCIe||
|||||reference clock.||
|56|W_DISABLE1#|I|3.3 V|This pin controls the internal WL_REG_ON signal and has a|NC|
|||||10K pull-up on the M.2 2230 module.||
|||||Recommend controlling this signal via host GPIO for optimal||
|||||power control.||



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|**Pin**<br>**#**|**Name**|**Type**|**Voltage**<br>**Ref.**|**Function**|**If Not**<br>**Used**|
|---|---|---|---|---|---|
|57|GND|-|-|Ground|GND|
|58|I2C DATA|-|-|NC|NC|
|59|RESERVED|-|-|NC|NC|
|60|I2C CLK|-|-|NC|NC|
|61|RESERVED|-|-|NC|NC|
|62|ALERT#|-|-|NC|NC|
|63|GND|-|-|Ground|GND|
|64|RESERVED|-|-|NC|NC|
|65|RESERVED|-|-|NC|NC|
|66|UIM_SWP|-|-|NC|NC|
|67|RESERVED|-|-|NC|NC|
|68|UIM_POWER_SNK|-|-|NC|NC|
|69|GND|-|-|Ground|GND|
|70|UIM_POWER_SRC|-|-|NC|NC|
|71|RESERVED|-|-|NC|NC|
|72|3.3V|PWR|3.3V|DC supply voltage for module.|--|
|||I/P||Operational is 3.13V to 3.6V||
|73|RESERVED|-|-|NC|NC|
|74|3.3V|PWR|3.3V|DC supply voltage for module.|--|
|||I/P||Operational is 3.13V to 3.6V||
|75|GND|-|-|Ground|GND|



**Note** The transmit/receive differential pairs of the PCIe bus include "PERp0", "PERn0", "PETp0" and "PETn0", which have a built-in decoupling capacitor. 

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## 14 HOST PLATFORM IMPLEMENTATION DETAILS 

The Sona IF573 M.2 1318 module must be configured for either PCIe or SDIO WLAN interface.  Configuration is done with resistor strapping as specified in Table 38. 

_**Table 38: Wi-Fi host interface configuration table**_ 

|**_Table 38: Wi-Fi host interface configuration table_**|||||
|---|---|---|---|---|
|**WLAN/Bluetooth Interface**||**GPIO_1 (Pin24)**||**LED_1# (Pin 65)**|
|PCIe / UART|H||H||
|SDIO /UART|L||H||



**Note:** The M.2 2230 E-Key module strapping is implemented on the M.2 carrier board. 

The CYW55573 Bluetooth CPU core requires the UART_CTS input to be held low at the point the BT_REG_ON (W_DISABLE2#) signal goes high to enable secure firmware download.  In addition, the HCI interface uses the standard H4 protocol which requires four-wire hardware handshaking. 

This requires that the host implement GPIO control over BT_REG_ON/W_DISABLE2# and implement full RTS/CTS handshaking. 

The Sona IF573 requires a 32KHz clock on the SUSCLK input.  This clock drives various internal state machines and must be provided by the host even if low power operation is not needed. 

## 13.4 M.2 1318 WL_DEV_WAKE Mapping 

The WL_DEV_WAKE feature is mapped to different pins on the M.2 1318 module depending on the WLAN interface selection. See Table 39 for details. 

_**Table 39: M.2 1318 WL_DEV_WAKE Mapping**_ 

|**WLAN Interface**|**M.2 1318 Pin**|**M.2 1318 Pin**|**M.2 1318 Pin**|**Internal GPIO**|
|---|---|---|---|---|
|PCIe|22|||GPIO_8|
|SDIO|18|||LHL_GPIO1|



**Note:** This feature is subject to software support and not currently implemented. 

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## 14 MECHANICAL SPECIFICATIONS 

Module dimensions of Sona IF573 M.2 1318 package is 18 x 13 x 1.9 mm. Detailed drawings are shown in Figure 20 

_**Figure 20: M.2 1318**_ 

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_**Figure 21: M.2 1318 (MHF4 variant) – Top View**_ 

_**Figure 22: M.2 1318 (trace antenna variant) – Top View**_ 

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## 14.2 M.2 2230 E-Key 

Module dimensions of Sona IF573 M.2 2230 E-Key module is 22 x 30 x 2.7 mm. Detailed drawings are shown in Figure 23. 

_**Figure 23: Sona IF573 M.2 2230**_ 

**Note:** The Wi-Fi MAC address is located on the product label. The last digit of Wi-Fi MAC address is assigned to either _0, 2, 4, 6, 8, A, C, E._ The BT MAC address is the Wi-Fi MAC address plus 1. 

## 14.5 M.2 2230 E-Key Mounting 

The Sona IF573 M.2 2230 E-Key module connects to the host via a standard PCI EXPRESS M2 connector. 

Kyocera’s 6411 series provides 1.8mm, 2.3mm and 3.2mm connector heights. JAE’s SM3 series provides 1.2mm, 2.15mm, 3.1mm and 4.1mm connector heights. 

The Sona IF573 M.2 2230 E-Key module is a single-sided component module so we recommend the connectors listed in Table 40. 

_**Table 40: Recommended M.2 2230 E-Key Connectors**_ 

|**M.2 Key-E Connector**|**Connector Height**|
|---|---|
|KYOCERA  24-6411-067-101-894E|2.3 mm|
|JAE SM3ZS067U310AERxxxx|3.1 mm|



The corresponding standoffs are listed in Table 41. 

_**Table 41: Recommended M.2 E-Key Standoffs**_ 

|**M.2 Key-E Connector**|**Stand-off**|
|---|---|
|KYOCERA  24-6411-067-101-894E|EMI STOP F50M16-041525P1D4M|
|JAE SM3ZS067U310AERxxxx|JAE SM3ZS067U310-NUT1-Rxxxx|



Detailed layout and stencil opening are show in Figure 24. 

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## _**Figure 24: M.2 2230 E-Key connector/standoff mounting**_ 

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## 15 RF LAYOUT DESIGN GUIDELINES 

The following is a list of RF layout design guidelines and recommendation when installing a Laird Connectivity radio into your device. 

- Do not run antenna cables directly above or directly below the radio. 

- Do not place any parts or run any high-speed digital lines below the radio. 

- Ensure that there is the maximum allowable spacing separating the antenna connectors on the Laird Connectivity radio from the antenna. In addition, do not place antennas directly above or directly below the radio. 

- Laird Connectivity recommends the use of a double-shielded cable for the connection between the radio and the antenna elements. 

- Be sure to put a 10uF/16V/0603 capacitor on EACH 3.3V power pin. Place the capacitor as close as possible to the pin to ensure correct PMU operation. 

- Use proper electro-static-discharge (ESD) procedures when installing the Laird Connectivity radio module. To avoid negatively impacting Tx power and receiver sensitivity, do not cover the antennas with metallic objects or components. 

## 16 APPLICATION NOTES 

Laird Connectivity’s surface mount modules are designed to conform to all major manufacturing guidelines. This application note is intended to provide additional guidance beyond the information that is presented in the user manual. This application note is considered a living document and will be updated as new information is presented. 

The modules are designed to meet the needs of several commercial and industrial applications. They are easy to manufacture and conform to current automated manufacturing processes. 

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## 16.2 Shipping and Labelling 

_**Figure 25: Sona IF573 Reel specifications, 161-00459: Sona IF573 Reel specifications, 161-00459**_ 

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_**Figure 26: Sona IF573 Tape specifications, 161-00543**_ 

There are 1,000 Sona IF573 modules taped in a reel (and packaged in a pizza box) and three boxes per carton (3,000 modules per carton). Reel, boxes, and carton are labeled with the appropriate labels. See Figure 27 for more information. 

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_**Figure 27: Sona IF573 packaging processes, 453-00117R**_ 

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## The following labels are located on the antistatic bag. 

**==> picture [283 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 28: Sona IF573 Moisture Sensitivity Level Label, 160-02008<br>**----- End of picture text -----**<br>


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**==> picture [305 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 29: Sona IF573 Bag and Box Product Identifier Label, 160-02371<br>**----- End of picture text -----**<br>


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## The following label is located on the pizza box. 

_**Figure 30: Sona IF573 Bag and Box Product Identifier Label, 160-02371**_ 

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The following package label is located on adjacent sides of the master carton. Sf [| es 2 || 

_**Figure 31: Sona IF573 Carton Product Identifier Label, 160-0273**_ 

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_**Figure 32: Sona IF573 M.2 2230 Shipping Tray, Bottom, 161-00355**_ 

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_**Figure 33: Sona IF573 M.2 2230 Shipping Tray, Top, 161-00356**_ 

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_**Figure 34: Sona IF573 M.2 2230 Packaging Process, 453-00119-PKG**_ 

The following label is placed on the bag and the inner box. 

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_**Figure 35: Sona IF573 M.2 2230 Bag and Box Product Identifier Label, 160-02373**_ 

The following label is located on the adjacent sides of the master carton. 

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_**Figure 36: Sona IF573 M.2 2230 Carton Product Identifier Label, 160-02374**_ 

The following are required storage conditions _**prior**_ **to opening the dry packing** : 

- Normal temperature: 5~40˚C 

- Normal humidity: 80% (Relative humidity) or less 

- Storage period: One year or less 

**Note:** Humidity means relative humidity. 

The following are required storage conditions _**after**_ **opening the dry packing** (to prevent moisture absorption): 

- Storage conditions for one-time soldering: 

   - Temperature: 5-25°C 

   - 

      - Humidity: 60% or less 

   - Period: 72 hours or less after opening 

- Storage conditions for two-time soldering 

   - Storage conditions following opening and prior to performing the 1[st] reflow: 

      - Temperature: 5-25°C 

      - Humidity: 60% or less 

      - Period: A hours or less after opening 

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- 

- Storage conditions following completion of the 1[st] reflow and prior to performing the 2[nd] reflow 

- Temperature: 5-25°C 

- Humidity: 60% or less 

- Period: B hours or less after completion of the 1[st] reflow 

**Note:** Should keep A+B within 72 hours. 

The following are temporary storage requirements after opening: 

- Only re-store the devices once prior to soldering. 

- Use a dry box or place desiccant (with a blue humidity indicator) with the devices and perform dry packing again using vacuumed heat-sealing. 

The following indicate the required storage period, temperature, and humidity for this temporary storage: 

- Storage temperature and humidity: 

**Temperature: +5 to +40°C Temperature: +5 to +25°C Temperature: +5 to +40°C Temperature: +5 to +25°C Humidity: 80% or less** H **Humidity: 60% or less** 1 ‘ ' ‘ **Humidity: 80% or less** ‘ **Humidity: 60% or less** *** *** 

   - *** - External atmosphere temperature and humidity of the dry packing 

- Storage period: 

      - 

      - 

- X1+X2 – Refer to After Opening the Dry Packing storage requirements.  Keep is X1+X2 within 72 hours. 

- Y – Keep within two weeks or less. 

## 16.4 Baking Conditions 

Baking conditions and processes for the module follow the J-STD-033 standard which includes the following: 

- The calculated shelf life in a sealed bag is 12 months at <40 ℃ and <80% relative humidity. 

- Once the packaging is opened, the SiP must be mounted (per MSL4/Moisture Sensitivity Level 4) within 72 hours at <30˚C and <60% relative humidity. 

- If the SiP is not mounted within 72 hours or if, when the dry pack is opened, the humidity indicator card displays >10% humidity, then the product must be baked for 48 hours at 125 ˚C (±5 ˚C). 

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## 17 SURFACE MOUNT CONDITIONS 

The following soldering conditions are recommended to ensure device quality. 

_**Figure 37: Sona IF573 M.2 1318 stencil aperture**_ **Note** : The stencil thickness is 0.12mm 

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## **Note:** When soldering, the stencil thickness should be 0.12 mm. 

Convection reflow or IR/Convection reflow (one-time soldering or two-time soldering in air or nitrogen environment) Measuring point – IC package surface Temperature profile: 

## _**Figure 38: Temperature profile**_ 

- Solder paste alloy: SAC305(Sn96.5 / Ag3.0 / Cu 0.5) 

- Pre-heat temperature: 150 ℃ ~ 200 ℃ ; Soak time: 60 second ~ 120 second 

- ▪ Peak temperature: 235 ℃ ~ 250 ℃ 

- Time above 220 ℃ : 40 second ~ 90 second 

- Optimal cooling rate < 3 ℃ /second 

- ▪ The oxygen concentration < 2000 ppm 

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- Bake the platform before removing the Sona IF573 module from the platform. Reference Baking Conditions. 

- ▪ Remove the Sona IF573 module by using a hot air gun. This process should be carried out by a skilled technician. 

Recommended conditions: 

- One-side component platform: 

   - Set the hot plate at 280°C. 

   - Put the platform on the hot plate for 8~10 seconds. 

   - Remove the device from platform. 

- Two-side components platform: 

   - Use two hot air guns. 

   - On the bottom, use a pre-heated nozzle (temp setting of 200~250°C) at a suitable distance from the platform PCB. 

   - – On the top, apply a remove nozzle (temp setting of 330°C). Heat until device can be removed from platform PCB. 

**==> picture [222 x 144] intentionally omitted <==**

**----- Start of picture text -----**<br>
Remove Nozzle<br>Platform PCB  SIP<br>inn<br>Pre-heat Nozzle<br>**----- End of picture text -----**<br>


- Remove the residue solder under the bottom side of device. (Note: Alternate module pictured as an example) 

_(Not accepted for RMA)_ 

_**Figure 39: Example M.2 1318 with residue solder on the bottom**_ 

**==> picture [118 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
(Accepted for RMA analysis)<br>**----- End of picture text -----**<br>


_**Figure 40: Sona IF573 module without residue solder**_ 

- Remove and clean the residue flux as needed. 

- Opening/handling/removing must be done on an anti-ESD treated workbench. All workers must also have undergone anti-ESD treatment. 

- The devices should be mounted within one year of the date of delivery. 

- The Sona IF573 modules are MSL level 4 rated. 

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## 18 RELIABILITY TEST 

The Sona IF573 modules were tested for reliability. Test items and the corresponding standards are shown in Table 42. 

The following are the followed reliability test procedures. 

_**Table 42: Sona IF573 M.2 1318 Solder-down Module Reliability Test Items and Standards**_ 

|**Test Item**||**Specification**|**Standard**|**Test**<br>**Result**|
|---|---|---|---|---|
||**Pre-check:**||||
||1.|Function check (Tools and SOP supplied by customers).|||
||2.|Mechanical check.|||
||**Pre-conditioning:**||||
||1.|Bake: 125°C for 24 hours.|||
||2.|Moisture Soak: 30°C/60% RH for 192 hours|||
|Step 1: Pre-<br>conditioning|3.|Not shorter than 15 minutes and not longer than 4 hours after<br>removal from the temperature/humidity chamber, subject the<br>sample to 3 cycles of the reflow.|JESD22-A113|Pass|
||**Post-check:**||||
||1.|Function check (Tools and SOP supplied by customers).|||
||2.|Mechanical check.|||
||3.|Perform inspections of short, open, delamination of DUTs by|||
|||Optical Microscope (under 40X optical magnification).|||
||4.|X-RAY / CSAM (SAT) on any failed samples (Notify customers).|||
||5.|Cross-sections analysis based on X-RAY and CSAM results.|||
||1.|Dwell on -40°C for 15 minutes|||
|Step 2:<br>Temperature<br>Cycling|2.<br>3.|Shock to 85°C with in ramp rate 15℃/minute<br>Dwell on 85°C for 15 minutes|JESD22-A113|Pass|
|Non-operating|4.|Shock to -40°C with in ramp rate 15 degree C/minute|||
||5.|Repeat step1-4 and stopto check functions at 500/ 700 cycles|||
||1.|Vibration Wave Form: Sine Waveform|||
||2.|Vibration frequency / Displacement: 20-80 Hz/1.5mm|||
|Vibration<br>Non-operating<br>Unpackaged|3.<br>4.|Vibration frequency / Acceleration: 80-2000 Hz/20g<br>Cycle Time: 4 min/cycle|JEDEC 22-<br>B103B (2016)|Pass|
|device|5.|Number of Cycles: 4 cycle/axis|||
||6.|Vibration Axes: X, Y and Z (Rotate each axis on vertical|||
|||vibration table)|||
|Mechanical<br>Shock|1.<br>2.|Pulse shape: Half-sine waveform<br>Impact acceleration: 1500 g|JEDEC 22-||
|Non-operating<br>Unpackaged<br>device|3.<br>4.<br>5.|Pulse duration: 0.5 ms<br>Number of shocks: 30 shocks (5 shocks for each face)<br>Orientation: Bottom, top, left, right, front and rear faces|B110B.01<br>(2019)|Pass|



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_**Table 43: Sona IF573 M.2 2230 E-Key Module Reliability Test Item and Standards**_ 

|**Test Item**|**Specification**||**Standard**|**Test**|
|---|---|---|---|---|
|||||**Result**|
|Thermal Shock|1.  Temperature: -40 ~ 85℃<br>2. Ramp time: Less than 10 seconds.<br>3. Dwell Time: 10 minutes<br>4. NumberofCycles:500 times||*JESD22-A106<br>*IEC 60068-2-14 for dwell time and<br>number of cycles|*IEC 60068-2-14 for dwell time and<br>Pass|
||1. Vibration Wave Form: Sine Waveform||||
||2. Vibration frequency / Displacement: 20-80||||
||Hz/1.5mm||||
|Vibration|3. Vibration frequency / Acceleration: 80-2000||||
|Non-operating|Hz/20g||JEDEC 22-B103B (2016)|Pass|
|Unpackaged device|4. Cycle Time: 4 min/cycle||||
||5. Number of Cycles: 4 cycle/axis||||
||6. Vibration Axes：X, Y and Z (Rotate each axis||||
||on vertical vibrationtable)||||
||1. Pulse shape: Half-sine waveform||||
||2. Impact acceleration: 1500 g||||
|Mechanical Shock|3. Pulse duration: 0.5 ms||||
|Non-operating|4. Number of shocks: 30 shocks (5 shocks for each|4. Number of shocks: 30 shocks (5 shocks for each|4. Number of shocks: 30 shocks (5 shocks for each<br>JEDEC 22-B110B.01 (2019)|Pass|
|Unpackaged device|face)||||
||5. Orientation: Bottom, top, left, right, front and rear|5. Orientation: Bottom, top, left, right, front and rear|5. Orientation: Bottom, top, left, right, front and rear||
||faces||||



|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|**Test Item** <br>**Specification** <br>**Standard** <br>~~[~~|
|---|---|---|---|---|---|---|---|---|
||Mean Time Between Failure (MTBF)||Mean Time Between Failure (MTBF)||1.|Normal Operating Temperature:45℃||Telcordia SR-332 Issue 4 (2016)|
||||||2.|High Temperature: 85℃|||
||||||||||
||**Laird Part Number**|**Laird Part Number**||||**Environment**||**Test Result 45**℃ <br>**(Hours)**|
||453-00117R|||Ground, Fixed, Uncontrolled||Ground, Fixed, Uncontrolled||13,987,080.94|
||453-00117C|||Ground, Mobile||Ground, Mobile||10,659,368.74|
||453-00118R||||||||
||453-00118C||||||||
||||||||||
||**Laird Part Number**|**Laird Part Number**||||**Environment**||**Test Result 85**℃ <br>**(Hours)**|
||453-00117R||||Ground, Fixed, Uncontrolled|||2,751,512.41|
||453-00117C||||Ground, Mobile|||2,095,110.62|
||453-00118R||||||||
||453-00118C||||||||
||||||||||
||**Laird Part Number**|**Laird Part Number**||||**Environment**||**Test Result 45**℃ <br>**(Hours)**|
||453-00119||||Ground, Fixed, Uncontrolled|||8,861,616.79|
||453-00120||||Ground, Mobile|||6,713,673.22|
||||||||||
||**Laird Part Number**|**Laird Part Number**||||**Environment**||**Test Result 85**℃ <br>**(Hours)**|
||453-00119||||Ground, Fixed, Uncontrolled|||1,752,775.15|
||453-00120||||Ground, Mobile|||1.327,284.04|



https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

75 

© Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

## 19 REGULATORY 

**Note:** For complete regulatory information, refer to the Sona IF573 Regulatory Information document which is also available from the Sona IF573 product page. 

The Sona IF573 holds current certifications in the following countries: 

|**Country/Region**|**Regulatory ID**|
|---|---|
|USA (FCC)|SQG-SONAIF573|
|EU|N/A|
|UKCA|N/A|
|Canada (ISED)|3147A-SONAIF573|
|Japan (MIC)|201-220656|
|Australia|N/A|
|New Zealand|N/A|



The Sona IF573 module was tested with antennas listed in the following table. The OEM can choose a different manufacturer’s antenna but must make sure it is of same type and that the gain is lesser than or equal to the antenna that is approved for use. 

|**Manufacturer**|**Model**|**Laird Connectivity**<br>**Part Number**|**Type**|**Connector**|**2.4 GHz**|**Peak Gain (dBi)**<br>**2.4 GHz**<br>**5 GHz**<br>**6 GHz**|**Peak Gain (dBi)**<br>**2.4 GHz**<br>**5 GHz**<br>**6 GHz**|**Peak Gain (dBi)**<br>**2.4 GHz**<br>**5 GHz**<br>**6 GHz**|
|---|---|---|---|---|---|---|---|---|
|Laird Connectivity|FlexMIMO 6E|EFD2471A3S-10MH4L|PIFA|MHF4L|2.2|2.2|3.8|3.3|
|Laird Connectivity|FlexPIFA 6E|EFB2471A3S-10MH4L|PIFA|MHF4L|2.2|2.2|3.9|3.8|
|Laird Connectivity|Mini NanoBlade<br>Flex 6 GHz|EMF2471A3S-10MH4L|PCB Dipole|MHF4L|2.4|2.4|4.4|5.2|
|Joymax<br>Electronics|Dipole 6E|TWX-100BRSAX-2001<br>/ TWX-100BRS3B|Dipole|RP-SMA|2||4.0|4.0|



76 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

## 20.1 Overview 

The Sona IF573 Series module is listed on the Bluetooth SIG website as a qualified Controller Subsystem. 

**Design Name Owner Declaration ID Link to listing on the SIG website** ~~a es Rs~~ Sona IF573 Laird D057578 https://launchstudio.bluetooth.com/ListingDetails/158180 Connectivit y 

It is a mandatory requirement of the Bluetooth Special Interest Group (SIG) that every product implementing Bluetooth technology has a Declaration ID. Every Bluetooth design is required to go through the qualification process, even when referencing a Bluetooth Design that already has its own Declaration ID. The Qualification Process requires each company to register as a member of the Bluetooth SIG – www.bluetooth.org 

The following is a link to the Bluetooth Registration page: https://www.bluetooth.org/login/register/ 

For each Bluetooth Design, it is necessary to purchase a Declaration ID. This can be done before starting the new qualification, either through invoicing or credit card payment. The fees for the Declaration ID will depend on your membership status, please refer to the following webpage: 

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/fees 

For a detailed procedure of how to obtain a new Declaration ID for your design, please refer to the following SIG document, (login is required to views this document): 

https://www.bluetooth.org/DocMan/handlers/DownloadDoc.ashx?doc_id=283698&vId=317486 

## 20.2 Qualification Steps When Referencing a Laird Connectivity 

To qualify your product when referencing a Laird Connectivity Controller Subsystem design, follow these steps: 

1. To start a listing, go to: https://www.bluetooth.org/tpg/QLI_SDoc.cfm 

**Note:** A user name and password are required to access this site. 

2. In step 1, select the option, New Listing and Reference a Qualified Design. 

3. Enter D057578 in the Controller Subsystem table entry. 

4. Enter your complimentary Host Subsystem and optional Profile Subsystem QDID in the table entry. 

5. Select your pre-paid Declaration ID from the drop-down menu or go to the Purchase Declaration ID page. 

**Note:** Unless the Declaration ID is pre-paid or purchased with a credit card, you cannot proceed until the SIG invoice is paid. 

6. Once all the relevant sections of step 1 are finished, complete steps 2, 3, and 4 as described in the help document accessible from the site. 

Your new design will be listed on the SIG website and you can print your Certificate and DoC. 

For further information please refer to the following training material: 

https://www.bluetooth.org/en-us/test-qualification/qualification-overview/listing-process-updates 

If you require assistance with the qualification process please contact our recommended Bluetooth Qualification Expert (BQE), Steve Flooks, steve.flooks@eurexuk.com. 

77 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 

## 21 ADDITIONAL INFORMATION 

Please contact your local sales representative or our support team for further assistance: 

|Headquarters|Laird Connectivity|
|---|---|
||50 S. Main St. Suite 1100|
||Akron, OH 44308 USA|
|Phone|Americas: +1-800-492-2320|
||Europe: +44-1628-858-940|
||Hong Kong: +852-2762-4823|
|Website|www.lairdconnect.com/|
|Technical Support|www.lairdconnect.com/resources/support|
|Sales Contact|www.lairdconnect.com/contact|



**Note:** Information contained in this document is subject to change. 

Laird Connectivity’s products are subject to standard Terms & Conditions. 

© Copyright 2023 Laird Connectivity. All Rights Reserved. Patent pending. Any information furnished by Laird Connectivity and its agents is believed to be accurate and reliable. All www.lairdconnect.com specifications are subject to change without notice. Responsibility for the use and application of Laird Connectivity materials or products rests with the end user since Laird Connectivity and its agents cannot be aware of all potential uses. Laird Connectivity makes no warranties as to non-infringement nor as to the fitness, merchantability, or sustainability of any Laird Connectivity materials or products for any specific or general uses. Laird Connectivity or any of its affiliates or agents shall not be liable for incidental or consequential damages of any kind. All Laird Connectivity products are sold pursuant to the Laird Connectivity Terms and Conditions of Sale in effect from time to time, a copy of which will be furnished upon request. Nothing herein provides a license under any Laird Connectivity or any third-party intellectual property right. 

78 © Copyright 2023 Laird Connectivity, Inc. All Rights Reserved 

https://www.lairdconnect.com/ 

**Americas** : +1-800-492-2320 **Europe** : +44-1628-858-940 **Hong Kong** : +852-2762-4823 



## Links

- [View this product on Novapart](https://novapart.co/products/453-00117C/wireless-lan-module-6-ghz-uart-several-commercial)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/laird-connectivity/453-00117c/wlan-module-6ghz-uart/dp/4240943RL)
---

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