450-0104C

**TiWi-uB2 Module DATASHEET** 

## **TiWi-uB2 Bluetooth Module** 

## **FEATURES** 

## **DESCRIPTION** 

- Built in CC2564 single-chip Bluetooth fully supports BT 2.1 + EDR, BLE 4.0. 

- RF Output Power: +10 dBm (Class 1.5) 

- RF Receive Sensitivity: -94 dBm 

- Miniature Size: 7 mm x 7 mm x 1.5 mm 

LSR would like to announce a low-cost and lowpower consumption module which has all of the Bluetooth functionalities. The highly integrated TiWi-uB2 module makes the use of Bluetooth headsets and other applications possible. 

- Operating Voltage: 2.2V to 4.8V 

- Operating temperature: -30 to +85[o] C 

- Worldwide acceptance: FCC (USA), IC (Canada), and CE (Europe) 

- RoHS compliant 

- Supports maximum Bluetooth data rates over HCI UART interface. 

- Supports multiple Bluetooth profiles with enhanced QoS, both mono and stereo, assisted A2DP 

## **APPLICATIONS** 

The TiWi-uB2 module fully supports the dual mode Bluetooth and BLE operation, and the output power can support class 1.5. The SIP module provides UART interface / audio PCM interface for Bluetooth. 

- Medical (ex Heart Rate Monitor, Blood Pressure Sensor, Blood Glucose Meter) 

- Thermometer 

- Flood Alarm 

- Heating Control 

- Automatic Key Control 

- Industrial Sensors 

- Toys 

- Entertainment Devices 

- Mobile Accessories 

The SIP module is specifically developed for Smart phones and Portable devices. 

Need to get to market quickly?  Not an expert in Bluetooth?  Need a custom antenna?  Do you need help with your host board?  LS Research Design Services will be happy to develop custom hardware or software, or help integrate the design.  Contact us at sales@lsr.com or call us at 262-375-4400. 

- All Bluetooth Wireless Applications 

## **ORDERING INFORMATION** 

|**Order Number**|**Description**|
|---|---|
|450-0104|TiWi-uB2 Module (Tray)|
|450-0104R|TiWi-uB2 Module (Tape & Reel)|
|450-0105|TiWi-uB2 EM Board|
||**Table 1 Orderable Model Numbers**|



The information in this document is subject to change without notice. 

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## **MODULE ACCESSORIES** 

**==> picture [326 x 244] intentionally omitted <==**

**----- Start of picture text -----**<br>
Order Number  Description<br>2.4 GHz Dipole Antenna with Reverse<br>001-0001<br>Polarity SMA Connector<br>U.FL to Reverse Polarity SMA Bulkhead<br>080-0001<br>Cable 105mm<br>**----- End of picture text -----**<br>


**Table 2 Module Accessories** 

The information in this document is subject to change without notice. 

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## **BLOCK DIAGRAM** 

**Figure 1 TiWi-uB2 Module Block Diagram** 

The information in this document is subject to change without notice. 

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## **TABLE OF CONTENTS** 

**FEATURES .......................................................................................................................... 1 APPLICATIONS ................................................................................................................... 1 DESCRIPTION ..................................................................................................................... 1 ORDERING INFORMATION ................................................................................................ 1 MODULE ACCESSORIES ................................................................................................... 2 BLOCK DIAGRAM ............................................................................................................... 3 FOOTPRINT AND PIN DEFINITIONS.................................................................................. 6 PIN DESCRIPTIONS ............................................................................................................ 7 ELECTRICAL SPECIFICATIONS ........................................................................................ 8 Absolute Maximum Ratings ....................................................................................................................... 8 Recommended Operating Conditions ...................................................................................................... 8 General Characteristics .............................................................................................................................. 9 Bluetooth RF Characteristics .................................................................................................................. 11 BLUETOOTH POWER-UP/ DOWN SEQUENCE .............................................................. 12 nSHUTD Requirements ............................................................................................................................. 12 SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS ..................................................... 13 BLUETOOTH HCI UART ................................................................................................... 14 BLUETOOTH AUDIO CODEC/PCM .................................................................................. 15 SOLDERING RECOMMENDATIONS ................................................................................ 16 Recommended Reflow Profile for Lead Free Solder ............................................................................. 16 CLEANING ......................................................................................................................... 17 OPTICAL INSPECTION ..................................................................................................... 17 REWORK ........................................................................................................................... 17 SHIPPING, HANDLING, AND STORAGE ......................................................................... 17 Shipping ..................................................................................................................................................... 17 Handling ..................................................................................................................................................... 17 Moisture Sensitivity Level (MSL) ............................................................................................................. 17** 

The information in this document is subject to change without notice. 

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**Storage ....................................................................................................................................................... 17 Repeating Reflow Soldering .................................................................................................................... 18 AGENCY CERTIFICATIONS ............................................................................................. 19 AGENCY STATEMENTS ................................................................................................... 19 Federal Communication Commission Interference Statement ............................................................ 19 Industry Canada Statements.................................................................................................................... 20 OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS ....................................................................................................... 21 OEM LABELING REQUIREMENTS FOR END-PRODUCT .............................................. 22 OEM END PRODUCT USER MANUAL STATEMENTS.................................................... 23 EUROPE ............................................................................................................................ 24 CE Notice ................................................................................................................................................... 24 Declaration of Conformity (DOC) ............................................................................................................ 24 BLUETOOTH CERTIFICATION ......................................................................................... 24 MECHANICAL DATA......................................................................................................... 25 Tape & Reel Dimensions .......................................................................................................................... 27 Tray Dimensions ....................................................................................................................................... 28 DEVICE MARKINGS .......................................................................................................... 29 Rev 1 Devices ............................................................................................................................................ 29 Rev 2 Devices ............................................................................................................................................ 29 CONTACTING LS RESEARCH ......................................................................................... 30** 

The information in this document is subject to change without notice. 

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## **FOOTPRINT AND PIN DEFINITIONS** 

**Figure 2 TiWi-uB2 Module Schematic View** 

**Figure 3 TiWi-uB2 Module Footprint View** 

The information in this document is subject to change without notice. 

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## **PIN DESCRIPTIONS** 

|**Module**<br>**Pin**|**Name**|**I/O Type**|**Description**|
|---|---|---|---|
|1<br>~~Rs~~<br>~~a~~|HCI_CTS<br>~~Rs ~~<br>~~es es~~|I<br> ~~Gn~~<br>~~es~~|HCI UART CLEAR-TO-SEND<br>~~Gn~~|
|2<br>~~a~~<br>~~a~~|HCI_TX<br>~~es es~~<br>~~es~~|O<br>~~es~~<br>~~es~~|HCI UART DATA TRANSMIT|
|3<br>~~a~~<br>~~a~~<br>~~es~~|HCI_RX<br>~~es es~~<br>~~es~~<br>~~es es~~|I<br>~~es~~<br>~~es~~<br>~~es~~|HCI UART DATA RECEIVE|
|4<br>~~a~~<br>~~es~~|HCI_RTS<br>~~es ~~<br>~~es es~~|O<br> ~~es~~<br>~~es~~|HCI UART REQUEST-TO-SEND|
|5<br>~~es ~~<br>~~ss~~<br>~~a~~|GND<br> ~~es es~~<br>~~ss~~<br>~~es es~~|GND<br>~~es~~<br>~~ss~~<br>~~es~~|GROUND<br>~~ss~~|
|6<br>~~a~~<br>~~a~~|GND<br>~~es es~~<br>~~es es~~|GND<br>~~es~~<br>~~es~~|GROUND|
|7<br>~~a~~<br>~~a~~|GND<br>~~es es~~<br>~~es es~~|GND<br>~~es~~<br>~~es~~|GROUND|
|8<br>~~a~~<br>~~a~~|SLOW_CLK_IN<br>~~es es~~<br>~~ss~~|I<br>~~es~~<br>~~ss~~|32.768 kHz CLOCK IN|
|9<br>~~a~~|GND<br>~~es~~|GND<br>~~es~~|GROUND|
|10<br>~~a~~|NC1<br>~~ss~~|O<br>~~ss~~|NO CONNECT 1 (DO NOT CONNECT)|
|11<br>~~a~~|NC2<br>~~ss~~|O<br>~~ss~~|NO CONNECT 2 (DO NOT CONNECT)|
|12<br>~~a~~|VBAT<br>~~ss~~|PI<br>~~ss~~|POWER TO MODULE (2.2V - 4.8V)|
|13<br>~~a~~|GND<br>~~es~~|GND<br>~~es~~|GROUND|
|14<br>~~a~~|BT_ANT<br>~~ss~~|RF<br>~~ss~~|ANTENNA, 50 OHMS|
|15<br>~~a~~|GND<br>~~ss~~|GND<br>~~ss~~|GROUND|
|16<br>~~a~~|nSHUTD<br>~~ss~~|I<br>~~ss~~|SHUTDOWN INPUT (ACTIVE LOW)|
|17<br>~~a~~|GND<br>~~es es~~|GND<br>~~es~~|GROUND|
|18<br>~~a~~|VDD_IO<br>~~es es~~|PI<br>~~es~~|I/O POWER SUPPLY (1.8V NOMINAL)|
|19<br>~~ss~~<br>~~a~~|AUD_IN<br>~~es es~~<br>~~ss~~<br>~~es~~|I<br>~~es~~<br>~~ss~~|PCM DATA INPUT (IF NOT USED, DO NOT CONNECT)<br>~~ss~~|
|20<br>~~a~~|AUD_OUT<br>~~es~~|O|PCM DATA OUTPUT (IF NOT USED, DO NOT CONNECT)|
|21<br>~~a~~<br>~~a~~<br>~~a~~|AUD_CLK<br>~~es~~<br>~~ss~~<br>~~es es~~|IO<br>~~ss~~<br>~~es~~|PCM CLOCK (IF NOT USED, DO NOT CONNECT)|
|22<br>~~a~~|AUD_FSYNC<br>~~es es~~|IO<br>~~es~~|PCM FRAME SYNCH (IF NOT USED, DO NOT CONNECT)|
|23<br>~~a~~<br>~~ss~~<br>~~a~~|NC3<br>~~es es~~<br>~~ss~~<br>~~es~~|O<br>~~es~~<br>~~ss~~|NO CONNECT 3 (DO NOT CONNECT)<br>~~ss~~|
|24<br>~~a~~<br>~~a~~|TX_DBG<br>~~es~~<br>~~es es~~|O<br>~~es~~|LOGGER OUTPUT|
|25-33<br>~~a~~<br>~~a~~|GND<br>~~es~~<br>~~es es~~|GND<br>~~es~~|GROUND|



## **Table 3 TiWi-uB2 Pin Descriptions** 

The information in this document is subject to change without notice. 

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## **ELECTRICAL SPECIFICATIONS** 

## **Absolute Maximum Ratings** 

||**Description**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|**Symbol**|||||
||||||
|VBAT|Input supply Voltage|-0.5|5.5|V|
|VDD_IO|Digital Bluetooth I/O Voltage<br>|-0.5<br>~~**1**~~|2.145|V|



**Table 4 Absolute Maximum Ratings** ~~**[1]**~~ 

## **Recommended Operating Conditions** 

## **Test conditions: Ambient Temp = 25°C** 

||**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|**Symbol**|||||
||||||
|VBAT|2.2|3.3|4.8|V|
|VDD_IO|1.62|1.8|1.92|V|



**Table 5 Recommended Operating Conditions** 

1 Under no circumstances should exceeding the ratings specified in the Absolute Maximum Ratings section be allowed.  Stressing the module beyond these limits may result permanent damage to the module that is not covered by the warranty. 

The information in this document is subject to change without notice. 

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## **General Characteristics** 

||**Description**|
|---|---|
|**Characteristic**||
|||
|Model Name|TiWi-uB2|
|Product Description|Bluetooth Wireless Module|
|Dimension|7.0 mm x 7.0 mm x 1.5 mm (W*L*T)|
|BT Interface|HCI UART, Audio PCM|
|Operating temperature|-30°C to 85°C|
|Storage temperature|-40°C to 85°C|
|Humidity|Operating Humidity 10% to 95% Non-Condensing<br>Storage Humidity 5% to 95% Non-Condensing|
|Weight|0.18 g  +/- 0.01g|



**Table 6 General Characteristics** 

## **Current Consumption – for Different Bluetooth BR/EDR Scenarios** 

Conditions: VBAT = 3.6 V, VDD_IO = 1.8V, 25°C, 26 MHz fast clock, nominal unit, 4 dBm output power 

**Mode Description Master/Slave Average Current Unit** Idle current (ARM off) Master/slave 2.5 mA ~~a~~ SCO link HV3 Master/slave 12 mA ~~a~~ eSCO link EV3 64 kbps, no retransmission Master/slave 11.5 mA ~~a~~ eSCO link 2-EV3 64 kbps, no retransmission Master/slave 8.3 mA ~~a~~ GFSK full throughput: TX = DH1, RX = DH5 Master/slave 38.5 mA ~~a~~ EDR full throughput: TX = 2-DH1, RX = 2-DH5 Master/slave 39.2 mA ~~a~~ EDR full throughput: TX = 3-DH1, RX = 3-DH5 Master/slave 39.2 mA ~~a a~~ Sniff, one attempt, 1.28 s Master/slave 76/100 µA Page or inquiry scan 1.28 s, 11.25 ms Master/slave 300 µA ~~a~~ Page (1.28 s) and inquiry (2.56 s) scans, 11.25 ms Master/slave 430 µA ~~a a~~ Low power scan, 1.28-s interval, quiet environment Master/slave 135 µA **Table 7 Bluetooth Power Consumption** 

The information in this document is subject to change without notice. 

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## **Current Consumption – for Different Bluetooth LE Scenarios** 

Conditions: VBAT = 3.6 V, VDD_IO = 1.8V, 25°C, 26 MHz fast clock, nominal unit, 10 dBm output power 

||**Description**|**Average Current**|**Unit**|
|---|---|---|---|
|**Mode**||||
|||||
|Advertising, non-<br>connectable|Advertising in all 3 channels<br>1.28msec advertising interval<br>15Bytes advertise data|104|µA|
|Advertising,<br>discoverable|Advertising in all 3 channels<br>1.28msec advertising interval<br>15Bytes advertise data|121|µA|
|Scanning|Listening to a single frequency per window<br>1.28msec scan interval<br>11.25msec scan window|302|µA|
|Connected (master role)|500msec connection interval<br>0msec Slave connection latency<br>Empty Tx/Rx LL packets|169|µA|



**Table 8 Bluetooth Power Consumption** 

## **Power Consumption** – **Bluetooth** 

Conditions: VBAT = 3.3V, VDD_IO = 1.8V, Ambient Temp = 25°C 

||**Typ**|**Max**|**Unit**|
|---|---|---|---|
|**Packet type**||||
|||||
|DM1|47.1||mA|
|DH1|30.2||mA|
|DM3|21.3||mA|
|DH3|17.4||mA|
|DM5|15.6||mA|
|DH5|13.0||mA|
|Deep Sleep Mode|0.033||mA|
|Constant RX|44.5||mA|
|BER Mode|38.8||mA|



||**Typ**|**Max**|**Unit**|
|---|---|---|---|
|**Packet type**||||
|||||
|DM1|0.069||mA|
|DH1|0.069||mA|
|DM3|0.069||mA|
|DH3|0.069||mA|
|DM5|0.069||mA|
|DH5|0.069||mA|
|Deep Sleep mode|0.032||mA|
|Constant RX|0.069||mA|
|BER Mode|0.069||mA|



**Table 10 Bluetooth VDDIO Power Consumption** 

The information in this document is subject to change without notice. 

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## **Bluetooth RF Characteristics** 

## **General Specifications** 

||**Description**|
|---|---|
|**Feature**||
|||
|Bluetooth Standard|Bluetooth 4.0 (with EDR)|
|Host Interface|HCI UART, PCM|
|Antenna Reference|Small antennas with 0~2 dBi peak gain|
|Frequency Band|2.402 GHz ~ 2.480 GHz|
|Number of Channels|79 channels|
|Modulation|FHSS, GFSK, DPSK, DQPSK|



**Table 11 Bluetooth General Specifications** 

## **RF Characteristics** 

## **Test Conditions : VBAT = 3.3V, VDD_IO = 1.8V** 

|~~|~~<br>~~es~~|**Condition**<br>~~|~~<br>|~~|~~<br>~~(ee)~~|**25°C Typ**<br>~~|~~<br>~~ee)~~|~~|~~<br>~~|~~|**BT Spec**<br>~~|~~<br>~~|ee!~~|**Unit**<br>~~|~~<br>~~(ee)~~|
|---|---|---|---|---|---|---|
|**Characteristic**<br>~~|~~<br>~~es~~||**-30°C Typ**<br>~~|~~<br>~~(ee)~~||**85°C Typ**<br>~~|~~<br>~~|~~|||
|~~|~~<br>~~es~~||~~|~~<br>~~(ee)~~||~~|~~<br>~~|~~|||
|Output Power<br>~~esI~~|Class 1.5<br>~~I~~|9.5<br>~~(ee)~~|10<br>~~ee)~~|10.8<br>~~|~~|~~|ee!~~|dBm<br>~~(ee)~~|
|Modulation<br>GFSK<br>~~esI~~<br>~~oo~~|dF1 avg<br>~~I~~<br>~~oo~~|158<br>~~(ee) ~~|158<br> ~~ee) ~~|158<br> ~~| ~~|140~ 175<br> ~~| ee! ~~|KHz<br> ~~(ee)~~|
||dF2 max<br>~~I~~<br>~~oo~~|138|137|136|>115|KHz|
||dF2avg/ dF1avg<br>~~oo~~<br>~~I~~|90|90|90|80|%|
|Modulation<br>EDR at<br>8DPSK|RMS DEVM<br>~~or~~|5<br>~~or~~|5<br>~~or~~|5<br>~~or~~|13<br>~~or~~|%<br>~~or~~|
||99% DEVM<br>~~ee~~|10<br>~~ee~~|10<br>~~ee~~|10<br>~~ee~~|20<br>~~ee~~|%<br>~~ee~~|
||Peak DEVM<br>~~ee~~<br>~~I~~|13<br>~~ee~~|13<br>~~ee~~|13<br>~~ee~~|25<br>~~ee~~|%<br>~~ee~~|
|Sensitivity at<br>Dirty Tx On|GFSK at BER = 0.1%<br>~~I~~<br>~~ee~~|-95<br>~~ee~~|-94<br>~~ee~~|-93<br>~~ee~~|-70<br>~~ee~~|dBm<br>~~ee~~|
||π/4-DQPSK at BER = 0.01%<br>~~ee~~<br>~~ee~~|-93<br>~~ee~~<br>~~ee~~|-92<br>~~ee~~<br>~~ee~~|-91<br>~~ee~~<br>~~ee~~|-70<br>~~ee~~<br>~~ee~~|dBm<br>~~ee~~<br>~~ee~~|
||8DPSK at BER = 0.01%<br>~~rr~~|-86<br>~~rr~~|-85<br>~~rr~~|-84<br>~~rr~~|-70<br>~~rr~~|dBm<br>~~rr~~|
|Maximum<br>Input Level|GFSK at BER = 0.1%<br>~~or~~|-5<br>~~or~~|-5<br>~~or~~|-5<br>~~or~~|-20<br>~~or~~|dBm<br>~~or~~|
||π/4-DQPSK at BER = 0.1%<br>~~ee~~|-10<br>~~ee~~|-10<br>~~ee~~|-10<br>~~ee~~|-20<br>~~ee~~|dBm<br>~~ee~~|
||8DPSK at BER = 0.1%<br>~~ee~~<br>~~es~~|-10<br>~~ee~~<br>~~es~~|-10<br>~~ee~~<br>~~es~~|-10<br>~~ee~~<br>~~es~~|-20<br>~~ee~~<br>~~es~~|dBm<br>~~ee~~<br>~~es~~|



**Table 12 Bluetooth RF Characteristics** 

The information in this document is subject to change without notice. 

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## **BLUETOOTH POWER-UP/ DOWN SEQUENCE** 

**Figure 4 Bluetooth Power-Up/Down Sequence** 

## **nSHUTD Requirements** 

||**Symbol**|**Min**|**Max**|**Unit**|
|---|---|---|---|---|
|**Parameter**|||||
||||||
|Operation mode level(1)|VIH|1.42|1.98|V|
|Shutdown mode level(1)|VIL|0|0.4|V|
|Minimum time for nSHUT_DOWN low to reset the device||5|||
|Rise/fall times|Tr/Tf||20|us|



(1) Internal pull-down retains shutdown mode when no external signal is applied to this pin. 

**Table 13 nSHUTD Requirements** 

The information in this document is subject to change without notice. 

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## **SLOW CLOCK (32 KHZ) SOURCE REQUIREMENTS** 

## **External Slow Clock signal characteristics** 

|~~Te~~|**Condition**<br>~~Te ~~|~~[I~~|~~[I~~|~~[I~~|**Max**<br>~~[I~~|**Unit**|
|---|---|---|---|---|---|---|
|**Characteristic**<br>~~Te~~||**Sym**<br>~~[I~~|**Min**<br>~~[I~~|**Typ**<br>~~[I~~|||
|~~Te~~||~~[I~~|~~[I~~|~~[I~~|||
|Input slow clock frequency<br>~~ee~~|~~ee~~|~~ee~~|~~ee~~|32768<br>~~ee~~|~~ee~~|Hz<br>~~ee~~|
|Input slow clock accuracy<br>(Initial + temp + aging)<br>~~a~~|~~ee~~|~~ee~~|-250<br>~~ee~~||250|ppm|
|Input transition time<br>tr/tf- 10% to 90%<br>~~a~~|~~ee~~|~~ee~~|tr/tf<br>~~ee~~||100|ns|
|Frequency input duty cycle<br>~~ee~~|~~ee~~|~~ee~~|15<br>~~ee~~|50<br>~~ee~~|85<br>~~ee~~|%<br>~~ee~~|
|Phase noise<br>~~ee~~|At 1 kHz<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|~~ee~~<br>~~ee~~|-125<br>~~ee~~|dBc/Hz<br>~~ee~~|
|Jitter<br>~~ee~~<br>~~e~~|Integrated over<br>300 to 15000 Hz<br>~~ee~~<br>~~ee~~<br>~~ee~~|~~ee~~<br>~~e~~<br>~~ee~~|~~ee~~<br>~~e~~<br>~~ee~~|~~ee~~<br>~~e~~<br>~~ee~~|1<br>~~ee~~<br>~~e~~|Hz<br>~~ee~~<br>~~e~~|
|Slow clock input voltage limits<br>~~e~~<br>~~eee~~|Square wave,<br>DC coupled<br>~~ee~~<br>~~ee ~~<br>~~eee~~|VIH<br>~~e~~<br> ~~ee~~<br>~~eee~~<br>~~**e**f~~|0.65 x<br>VDD_IO<br>~~e~~<br>~~ee~~<br>~~eee~~<br>~~f~~<br>~~ft~~|~~e~~<br>~~ee~~<br>~~eee~~<br>~~ft~~<br>~~|~~|VDD_IO<br>~~e~~<br>~~eee~~|V peak<br>~~e~~<br>~~eee~~|
|||VIL<br>~~eee~~<br>~~**e**f~~|0<br>~~eee~~<br>~~f~~<br>~~ft~~|~~eee~~<br>~~ft~~<br>~~|~~|0.35 x<br>VDD_IO<br>~~eee~~|V peak<br>~~eee~~|
|Input impedance<br>~~eee~~<br>~~e~~|~~eee~~<br>~~e~~|~~eee~~<br>~~**e**f~~|1<br>~~eee~~<br>~~f~~<br>~~ft~~|~~eee~~<br>~~ft~~<br>~~|~~|~~eee~~|MΩ<br>~~eee~~|
|Input capacitance<br>~~a~~|||||5|pF|



**Table 14 32 kHz Clock Requirements** 

The information in this document is subject to change without notice. 

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## **BLUETOOTH HCI UART** 

**Figure 5 Bluetooth HCI UART Timing** 

||**Characteristic**||||**Max**|**Unit**|
|---|---|---|---|---|---|---|
|**Symbol**||**Condition**|**Min**|**Typ**|||
||||||||
|~~a ~~|Baud rate<br> ~~GG~~|~~GG~~|37.5<br>~~GG~~|~~GG~~|4000<br>~~GG~~|kbps<br>~~GG~~|
|~~a ~~|Baud rate accuracy<br> ~~GO~~|~~GO~~|-2.5<br>~~GO~~|~~GO~~|1.5<br>~~GO~~|%<br>~~GO~~|
|t3<br>~~a~~|CTS low to TX_DATA on<br>~~GO~~|~~GO~~|0<br>~~GO~~|2<br>~~GO~~|~~GO~~|us<br>~~GO~~|
|t4<br>~~a ~~<br>~~a~~|CTS high to TX_DATA off<br> ~~GO~~|Hardware flow control<br>~~GO~~|~~GO~~|~~GO~~|1<br>~~GO~~|byte<br>~~GO~~|
|t6<br>~~a~~<br>~~a~~|CTS high pulse width||1|||Bit|
|t1<br>~~a~~<br>~~a~~|RTS low to RX_DATA on||0|2||us|
|t2<br>~~a~~|RTS high to RX_DATA off|Interrupt set to ¼ FIFI|||16|byte|



**Table 15 Bluetooth HCI UART Timing** 

The information in this document is subject to change without notice. 

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## **BLUETOOTH AUDIO CODEC/PCM** 

**Figure 6 Bluetooth PCM Timing** 

## **PCM Master** 

||**Parameter**|||**Max**|**Unit**|
|---|---|---|---|---|---|
|**Symbol**||**Condition**|**Min**|||
|||||||
|Tclk|Cycle time||166.67 (6 MHz)|15625 (64 kHz)|ns|
|TW|High or low pulse width||50% of Tclkmin||ns|
|tis|AUD_IN setup time||25||ns|
|tih|AUD_IN hold time||0||ns|
|top|AUD_OUT propagation time|40pF load|0|10|ns|
|top|FSYNC_OUT propagation time|40pF load|0|10|ns|



**Table 16 Bluetooth PCM Master Timing** 

## **PCM Slave** 

||**Parameter**|||**Max**|**Unit**|
|---|---|---|---|---|---|
|**Symbol**||**Condition**|**Min**|||
|||||||
|Tclk<br>~~a~~|Cycle time||62.5 (16 MHz)||ns|
|TW<br>~~a~~|High or low pulse width||40% of Tclk||ns|
|tis<br>~~a~~<br>~~a~~|AUD_IN setup time||8||ns|
|tih<br>~~a~~<br>~~a~~|AUD_IN hold time<br>~~es~~|~~es~~<br>~~ss~~|0<br>~~es~~<br>~~ss~~|~~es~~|ns<br>~~es~~|
|tis<br>~~a~~<br>~~a ee~~|AUD_FSYNC setup time<br>~~es~~<br>~~ee~~|~~es~~<br>~~ee~~<br>~~ss~~|8<br>~~es~~<br>~~ee~~<br>~~ss~~|~~es~~<br>~~ee~~|ns<br>~~es~~<br>~~ee~~|
|tih<br>~~ss~~|AUD_FSYNC hold time<br>~~ss~~|~~ss~~<br>~~ss~~|0<br>~~ss~~<br>~~ss~~|~~ss~~|ns<br>~~ss~~|
|top<br>~~es~~|AUD_OUT propagation time<br>~~es~~|40pF load<br>~~es~~|0<br>~~es~~|21<br>~~es~~|ns<br>~~es~~|



**Table 17 Bluetooth PCM Slave Timing** 

The information in this document is subject to change without notice. 

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## **SOLDERING RECOMMENDATIONS** 

## **Recommended Reflow Profile for Lead Free Solder** 

**Figure 7 Recommended Soldering Profile** 

**Note: The quality of solder joints on the surface mount pads where they contact the host board should meet the appropriate IPC Specification.  See IPC-A-610-D Acceptability of Electronic Assemblies, section 8.2.1 “Bottom Only Terminations.”** 

The information in this document is subject to change without notice. 

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## **CLEANING** 

## **SHIPPING, HANDLING, AND STORAGE** 

In general, cleaning the populated modules is strongly discouraged.  Residuals under the module cannot be easily removed with any cleaning process. 

- Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between neighboring pads.  Water could also damage any stickers or labels. 

- Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the RF shield, which is not accessible for post-washing inspection.  The solvent could also damage any stickers or labels. 

- Ultrasonic cleaning could damage the module permanently. 

## **OPTICAL INSPECTION** 

After soldering the Module to the host board, consider optical inspection to check the following: 

- Proper alignment and centering of the module over the pads. 

- Proper solder joints on all pads. 

- Excessive solder or contacts to neighboring pads, or vias. 

## **REWORK** 

The module can be unsoldered from the host board if the Moisture Sensitivity Level (MSL) requirements are met as described in this datasheet. 

**Never attempt a rework on the module itself, e.g. replacing individual components.  Such actions will terminate warranty coverage.** 

## **Shipping** 

Bulk orders of the TiWi-uB2 modules are delivered in trays of 416 (13 x 32) or reels of 2,000. 

## **Handling** 

The TiWi-uB2 modules contain a highly sensitive electronic circuitry.  Handling without proper ESD protection may damage the module permanently. 

## **Moisture Sensitivity Level (MSL)** 

Per J-STD-020, devices rated as MSL 4 and not stored in a sealed bag with desiccant pack should be baked prior to use. 

After opening packaging, devices that will be subjected to reflow must be mounted within 72 hours of factory conditions (<30°C and 60% RH) or stored at <10% RH. 

Bake devices for 48 hours at 125°C. 

## **Storage** 

Please use this product within 6 months after receipt.  Any product used after 6 months of receipt needs to have solderability confirmed before use. 

The product shall be stored without opening the packing under the ambient temperature from 5 to 35deg.C and humidity from 20 to 70%RH. (Packing materials, in particular, may be deformed at the temperatures above this range.) 

Do not store in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX. 

Do not store in direct sunlight. 

The product should not be subject to excessive mechanical shock. 

The information in this document is subject to change without notice. 

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## **Repeating Reflow Soldering** 

## **Only a single reflow soldering process is encouraged for host boards.** 

The information in this document is subject to change without notice. 

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## **AGENCY CERTIFICATIONS** 

FCC ID: TFB-BT1, 15.247 

IC ID: 5969A-BT1, RSS 210 

CE: Compliant to standards EN 60950-1, EN 300 328, and EN 301 489 

## **AGENCY STATEMENTS** 

## **Federal Communication Commission Interference Statement** 

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one of the following measures: 

- Reorient or relocate the receiving antenna. 

- Increase the separation between the equipment and receiver. 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 

- Consult the dealer or an experienced radio/TV technician for help. 

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 

This portable transmitter with its antenna complies with FCC/IC RF exposure limits for general population / uncontrolled exposure. 

**FCC CAUTION: Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment.** 

The information in this document is subject to change without notice. 

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## **Industry Canada Statements** 

This device complies with Industry Canada License-exempt RSS standard(s).  Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 

To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that permitted for successful communication. 

This device has been designed to operate with the antenna(s) listed below, and having a maximum gain of 2.0 dBi (LSR Dipole) and 1.3dBi (Johanson Chip).  Antennas not included in this list or having a gain greater than 2.0 dBi and 1.3dBi are strictly prohibited for use with this device.  The required antenna impedance is 50 ohms. 

List of all Antennas Acceptable for use with the Transmitter 

- 1) LS Research 001-0001 center-fed dipole antenna and LS Research 080-0001 U.FL to Reverse Polarity SMA connector cable. 

- 2) Johanson 2450AT43B100 chip antenna. 

Cet appareil est conforme aux normes d'Industrie Canada exempts de licence RSS (s).  L'opération est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d'interférences et (2) cet appareil doit accepter toute interférence, y compris les interférences qui peuvent causer un mauvais fonctionnement de l'appareil. 

Pour réduire le risque d'interférence aux autres utilisateurs, le type d'antenne et son gain doiventêtre choisis de manière que la puissance isotrope rayonnée équivalente (PIRE) ne dépasse pascelle permise pour une communication réussie. 

Cet appareil a été conçu pour fonctionner avec l'antenne (s) ci-dessous, et ayant un gain maximum de 2,0 dBi (LSR dipôle) et1.3dBi (Chip Johanson).  Antennes pas inclus danscette liste ou d'avoir un gain supérieur à 2,0 dBi et-1.3dBi sont strictement interdites pour l'utilisation avec cet appareil.  L'impédance d'antenne requise est de 50 ohms. 

Liste de toutes les antennes acceptables pour une utilisation avec l'émetteur 

- 1) LS Research 001-0001 alimenté par le centre antenne dipôle et LS Research 080-0001 U.FL d'inversion de polarité du câble connecteur SMA. 

- 2) Antenne Johanson puce 2450AT43B100. 

The information in this document is subject to change without notice. 

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## **OEM RESPONSIBILITIES TO COMPLY WITH FCC AND INDUSTRY CANADA REGULATIONS** 

The TiWi-uB2 Module has been certified for integration into products only by OEM integrators under the following conditions: 

The antennas for this transmitter must not be co-located with any other transmitters except in accordance with FCC and Industry Canada multi-transmitter procedures.  Co-location means having a separation distance of less than 20 cm between transmitting antennas. 

As long as the two conditions above are met, further transmitter testing will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed (for example, digital device emissions, PC peripheral requirements, etc.). 

**IMPORTANT NOTE: In the event that these conditions cannot be met (for certain configurations or co-location with another transmitter), then the FCC and Industry Canada authorizations are no longer considered valid and the FCC ID and IC Certification Number cannot be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC and Industry Canada authorization.** 

Le module de TiWi-uB2 a été certifié pour l'intégration dans des produits uniquement par des intégrateurs OEM dans les conditions suivantes: 

Les antennes pour ce transmetteur ne doit pas être co-localisés avec les autres émetteurs sauf en conformité avec la FCC et Industrie Canada multi-émetteur procédures.  Co-localisation des moyens ayant une distance de séparation inférieure à 20 cm entre les antennes d'émission. 

Tant que les deux conditions précitées sont réunies, les tests de transmetteurs supplémentaires ne seront pas tenus. Toutefois, l'intégrateur OEM est toujours responsable de tester leur produit final pour toutes les exigences de conformité supplémentaires requis avec ce module installé (par exemple, les émissions appareil numérique, les exigences de périphériques PC, etc.) 

**NOTE IMPORTANTE: Dans le cas où ces conditions ne peuvent être satisfaites (pour certaines configurations ou de co-implantation avec un autre émetteur), puis la FCC et Industrie autorisations Canada ne sont plus considérés comme valides et l'ID de la FCC et IC numéro de certification ne peut pas être utilisé sur la produit final. Dans ces circonstances, l'intégrateur OEM sera chargé de réévaluer le produit final (y compris l'émetteur) et l'obtention d'un distincte de la FCC et Industrie Canada l'autorisation.** 

The information in this document is subject to change without notice. 

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## **OEM LABELING REQUIREMENTS FOR END-PRODUCT** 

The TiWi-uB2 module is labeled with its own FCC ID and IC Certification Number.  The FCC ID and IC certification numbers are not visible when the module is installed inside another device, as such the end device into which the module is installed must display a label referring to the enclosed module. The final end product must be labeled in a visible area with the following: 

## “ **Contains Transmitter Module FCC ID: TFB-BT1”** 

## “ **Contains Transmitter Module IC: 5969A-BT1”** 

or 

## “ **Contains FCC ID: TFB-BT1”** 

## “ **Contains IC: 5969A-BT1”** 

The OEM of the TiWi-uB2 Module must only use the approved antenna(s) listed above, which have been certified with this module. 

Le module de TiWi-uB2 est étiqueté avec son propre ID de la FCC et IC numéro de certification. L'ID de la FCC et IC numéros de certification ne sont pas visibles lorsque le module est installé à l'intérieur d'un autre appareil, comme par exemple le terminal dans lequel le module est installé doit afficher une etiquette faisant référence au module ci-joint. Le produit final doit être étiqueté dans un endroit visible par le suivant: 

## **“Contient Module émetteur FCC ID: TFB-BT1" “Contient Module émetteur IC: 5969A-BT1"** 

ou 

## **“Contient FCC ID: TFB-BT1" “Contient IC: 5969A-BT1"** 

Les OEM du module TiWi-uB2 ne doit utiliser l'antenne approuvée (s) ci-dessus, qui ont été certifiés avec ce module. 

The information in this document is subject to change without notice. 

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## **OEM END PRODUCT USER MANUAL STATEMENTS** 

The OEM integrator should not provide information to the end user regarding how to install or remove this RF module or change RF related parameters in the user manual of the end product. 

Other user manual statements may apply. 

L'intégrateur OEM ne devraient pas fournir des informations à l'utilisateur final sur la façon d'installer ou de supprimer ce module RF ou modifier les paramètres liés RF dans le manuel utilisateur du produit final. 

Autres déclarations manuel de l'utilisateur peuvent s'appliquer. 

The information in this document is subject to change without notice. 

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## **EUROPE** 

## **CE Notice** 

This device has been tested and certified for use in the European Union.  See the Declaration of Conformity (DOC) for specifics. 

If this device is used in a product, the OEM has responsibility to verify compliance of the final product to the EU standards.  A Declaration of Conformity must be issued and kept on file as described in the Radio and Telecommunications Terminal Equipment (R&TTE) Directive. 

The ‘CE’ mark must be placed on the OEM product per the labeling requirements of the Directive. 

## **Declaration of Conformity (DOC)** 

The DOC can be downloaded from the LSR Wiki. 

## **BLUETOOTH CERTIFICATION** 

The TiWi-uB2 module has been certified as a Controller Subsystem and has a QDID of B020349.    An End Product Listing (EPL) can be created when this device is combined with a Host Subsystem QDID. The cost for creating an EPL by combination of the Controller Subsystem and Host Subsystem QDIDs is free of charge.  See the Bluetooth website for additional details on the EPL process. 

The information in this document is subject to change without notice. 

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## **MECHANICAL DATA** 

**Figure 8 Module Mechanical Dimensions** 

The information in this document is subject to change without notice. 

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**Figure 9 Soldering Footprint for Host Board and Module Placement** 

The information in this document is subject to change without notice. 

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## **Tape & Reel Dimensions** 

**Figure 10 Tape and Reel Specification** 

The information in this document is subject to change without notice. 

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## **Tray Dimensions** 

**Figure 11 Tray Specification** 

The information in this document is subject to change without notice. 

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## **DEVICE MARKINGS** 

## **Rev 1 Devices** 

LSR Model: uBleu2 FCC: TFB-BT1 IC: 5969A-BT1 1234567 YYWW         R1 

1234567 = Lot Code 

1 = production region (ex: Taiwan = T) 

23 = production year in hex (ex: 2012 = 0A) 

4 = production month in hex (ex: Jul = 7) 567 = last 3 numbers of tracking card in hex YYWW = Date Code (YY=Year, WW=Week) R1 = Rev 1 

## **Rev 2 Devices** 

LSR Model: TiWi-uB2 FCC: TFB-BT1 IC: 5969A-BT1 1234567 YYWW         R2 

1234567 = Lot Code 

1 = production region (ex: Taiwan = T) 

23 = production year in hex (ex: 2012 = 0A) 

4 = production month in hex (ex: Jul = 7) 567 = last 3 numbers of tracking card in hex YYWW = Date Code (YY=Year, WW=Week) R2 = Rev 2 

The information in this document is subject to change without notice. 

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## **CONTACTING LS RESEARCH** 

**Headquarters** LS Research, LLC W66 N220 Commerce Court Cedarburg, WI 53012-2636 USA Tel: 1(262) 375-4400 Fax: 1(262) 375-4248 **Website** www.lsr.com **Wiki** www.lsr.com/products-wiki **Technical Support** www.lsr.com/products-forum **Sales Contact** sales@lsr.com 

The information in this document is provided in connection with LS Research (hereafter referred to as “LSR”) products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of LSR products. EXCEPT AS SET FORTH IN LSR’S TERMS AND CONDITIONS OF SALE LOCATED ON LSR’S WEB SITE, LSR ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL LSR BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF LSR HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. LSR makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. LSR does not make any commitment to update the information contained herein. Unless specifically provided otherwise, LSR products are not suitable for, and shall not be used in, automotive applications. LSR’s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. 

The information in this document is subject to change without notice. 

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