# Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18 mm, 23 mm

![Product image](https://novapart.co/image/farnell:1773312/)

**URL**: https://novapart.co/products/374124B00032G/heat-sink-square-pcb-for-ball-grid-arrays-234-c-w
**SKU**: 374124B00032G
**Manufacturer**: BOYD
**Category**: Cooling & Thermal Management || Heat Sinks || Natural Convection Heat Sinks
**Price**: €4.7400
**Stock**: 1000+
**Lead Time**: 64 days (indicative)

## Description

Thermal Resistance:23.4°C/W; Packages Cooled:BGA; External Width - Metric:23mm; External Height - Metric:18mm; External Length - Metric:23mm; External Diameter - Metric:-; Heat Sink M

## Specifications

| Parameter | Value |
|---|---|
| Svhc | No SVHC (15-Jan-2019) |
| Product Range | - |
| Packages Cooled | BGA |
| Heat Sink Material | Aluminium |
| Thermal Resistance | 23.4°C/W |
| External Width - Metric | 23mm |
| External Height - Metric | 18mm |
| External Length - Metric | 23mm |
| External Width - Imperial | 0.91" |
| External Diameter - Metric | - |
| External Height - Imperial | 0.71" |
| External Length - Imperial | 0.91" |
| External Diameter - Imperial | - |

## Datasheet

📄 [Download PDF](https://novapart.co/datasheet/farnell:1773312/)

5/16/12 

374124B00032G - heatsinks for BGA Devices 

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## **374124B00032G** 

Pin Fin heat sink with tape attachment RoHS: compliant Download PCN 

Need assistance? Call us: 1-855-32-AAVID Email: estore@aavid.com 

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## **Features** 

- Tape mounting saves board space by eliminating mounting holes Convenient peel and stick assembly is quick and clean 

- » Product Return Policy » Terms & Conditions » Privacy Policy 

Pin Fin array allows omni-directional airflow to maximize heat dissipation 

**This part comes with T405R Chomerics Tape** for Metal surfaces Thermal Resistance: 0.50 Adhesive: Acrylic Color: White Carrier: Aluminum Meets Aavid RoHS 9000 

**Width:** 23.00 

**Length:** 23.00 **Height:** 18.00 **Base Thickness:** 1.50 **Fin Thickness:** Length 1.59, Width 1.40 **# of Fins:** Length 6, Width 6 

**Fin Tip to Tip:** 0.00 

https://www.aavid.com/products/bga/374124b00032g 

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5/16/12 

374124B00032G - heatsinks for BGA Devices 

**Finish:** Black Anodize 

## Thermal Performance 

## **Natural Convection:** 23.40 

(based on a heatsink temperature rise of 75°C above ambient) **Forced convection:** 7.39 

based on fully ducted airflow entering at 1.0 m/s (197 LFM). **Thermal Curve:** 

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Aavid will lead the electronics thermal management industry worldwide. We will be the first company customers call to enable their thermal designs anywhere in the world. We will respond with extraordinary speed and will provide them with timely and cost-effective solutions because we understand their needs, their industry, and their culture. 2012 Aavid Thermalloy, LLC 

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## Links

- [View this product on Novapart](https://novapart.co/products/374124B00032G/heat-sink-square-pcb-for-ball-grid-arrays-234-c-w)
- [Request a quote for this part](https://novapart.co/quote/)
- [Supplier page](https://es.farnell.com/aavid-thermalloy/374124b00032g/heat-sink-bga-23-x-23-x-18-with/dp/1773312)
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