2N7000BU

September 2016 

## **2N7000BU / 2N7000TA Advanced Small-Signal MOSFET** 

## **Features** 

- Fast Switching Times 

- Improved Inductive Ruggedness 

- Lower Input Capacitance 

- Extended Safe Operating Area 

- Improved High-Temperature Reliability 

## **Description** 

These N-channel enhancement mode field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. These products minimize onstate resistance while providing rugged, reliable, and fast switching performance. They can be used in most applications requiring up to 400 mA DC and can deliver pulsed currents up to 2 A. These products are particularly suited for low-voltage, low-current applications, such as small servo motor control, power MOSFET gate drivers, and other switching applications. 

**==> picture [78 x 10] intentionally omitted <==**

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1 TO-92<br>**----- End of picture text -----**<br>


1. Source  2. Gate   3. Drain 

## **Ordering Information** 

|**Part Number**|**Marking**|**Package**|**Packing Method**|
|---|---|---|---|
|2N7000BU|2N7000|TO-92 3L|Bulk|
|2N7000TA|2N7000|TO-92 3L|Ammo|



## **Absolute Maximum Ratings** 

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at TC = 25°C unless otherwise noted. 

|**Symbol**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|
|VDSS|Drain-to-Source Voltage|60|V|
|ID|Continuous Drain Current (TC= 25°C)|200|mA|
||Continuous Drain Current (TC= 100°C)|110||
|IDM|Drain Current Pulsed(1)|1000|mA|
|VGS|Gate-to-Source Voltage|±30|V|
|TJ, TSTG|Operating Junction and Storage Temperature Range|-55 to 150|°C|
|TL|Maximum Lead Temperature for Soldering Purposes,<br>1/8-inch from Case for 5 Seconds|300|°C|



## **Note:** 

1. Repetitive rating: pulse width limited by maximum junction temperature. 

© 2002 Fairchild Semiconductor Corporation 2N7000BU / 2N7000TA Rev. 1.5 

www.fairchildsemi.com 

1 

## **Thermal Characteristics**[(2)] 

Values are at TC = 25°C unless otherwise noted **.** 

|Values are at TC = 25°C unless otherwise noted<br>~~—~~|Values are at TC = 25°C unless otherwise notedC = 25°C unless otherwise noted= 25°C unless otherwise noted**.**|||
|---|---|---|---|
|**Symbol**<br>~~—~~|**Parameter**|**Value**|**Unit**|
|PD<br>~~—~~|Total Power Dissipation(TC= 25°C)|400|mW|
||Linear DeratingFactor|3.2|mW/°C|
|RJA<br>~~—~~|Thermal Resistance, Junction to Ambient|312.5|°C/W|



2. Device mounted on FR-4 PCB, board size = 101.5 mm x 114.5 mm. 

## **Electrical Characteristics** 

Values are at TC = 25°C unless otherwise noted. 

|Values are at TC = 25°C unless otherwise noted.|Values are at TC = 25°C unless otherwise noted.C = 25°C unless otherwise noted.= 25°C unless otherwise noted.||||||
|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|**Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|BVDSS|Drain-Source Breakdown Voltage|VGS= 0 V, ID= 250A|60|||V|
|VGS(th)|Gate Threshold Voltage|VDS= VGS, ID= 250A|0.3||3.9|V|
|||VDS= VGS, ID= 1 mA|0.4||3.0||
|IGSS|Gate-Source Leakage,Forward|VGS= 15 V|||100|nA|
||Gate-Source Leakage,Reverse|VGS= -15 V|||-100||
|IDSS|Drain-to-Source Leakage Current|VDS= 60 V|||1|A|
|||<br>VDS= 45 V, TC= 125°C|||1000||
|RDS(ON)|Static Drain-Source<br>On-State Resistance(3)|VGS= 10 V, ID= 0.5 A|||5.0||
|gfs|Forward Transconductance(3)|VDS= 15 V, ID= 0.5 A|0.1|0.3||S|
|Ciss|Input Capacitance|VGS= 0 V, VDS= 25 V, f = 1 MHz||30||pF|
|Coss|Output Capacitance|||12||pF|
|Crss|Reverse Transfer Capacitance|||3.0||pF|
|td(on)|Turn-On Delay|VDD= 30 V, ID= 0.5 A,<br>RG= 15(3),(4)|||10|ns|
|tr|Rise Time||||10|ns|
|td(off)|Turn-Off Delay||||10|ns|
|tf|Fall Time||||10|ns|



## **Notes:** 

3. Pulse test: pulse width = 250 s, duty cycle 2%. 

4. Essentially independent of operating temperature. 

© 2002 Fairchild Semiconductor Corporation 2N7000BU / 2N7000TA Rev. 1.5 

www.fairchildsemi.com 

2 

## **Physical Dimensions** 

**==> picture [197 x 44] intentionally omitted <==**

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5.20       TO-92<br>Pe]<br>**----- End of picture text -----**<br>


**Figure 1. 3-LEAD, TO-92, JEDEC TO-92 COMPLIANT STRAIGHT LEAD CONFIGURATION** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/ZA/ZA03D.pdf ._ 

_For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packing_dwg/PKG-ZA03D_BK.pdf ._ 

© 2002 Fairchild Semiconductor Corporation 2N7000BU / 2N7000TA Rev. 1.5 

www.fairchildsemi.com 

3 

## **Physical Dimensions** (Continued) 

**==> picture [162 x 15] intentionally omitted <==**

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                      TO-92<br>**----- End of picture text -----**<br>


**Figure 2. 3-LEAD, TO-92, MOLDED 0.200 IN LINE SPACING LD FORM (J61Z OPTION) (ACTIVE)** 

_Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products._ 

_Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/ZA/ZA03F.pdf ._ 

_For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area: http://www.fairchildsemi.com/packing_dwg/PKG-ZA03F.pdf._ 

© 2002 Fairchild Semiconductor Corporation 2N7000BU / 2N7000TA Rev. 1.5 

www.fairchildsemi.com 

4 

## **TRADEMARKS** 

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. 

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* Trademarks of System General Corporation, used under license by Fairchild Semiconductor. 

## **DISCLAIMER** 

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. TO OBTAIN THE LATEST, MOST UP-TO-DATE DATASHEET AND PRODUCT INFORMATION, VISIT OUR WEBSITE AT HTTP://WWW.FAIRCHILDSEMI.COM. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. 

## **AUTHORIZED USE** 

Unless otherwise specified in this data sheet, this product is a standard commercial product and is not intended for use in applications that require extraordinary levels of quality and reliability. This product may not be used in the following applications, unless specifically approved in writing by a Fairchild officer: (1) automotive or other transportation, (2) military/aerospace, (3) any safety critical application – including life critical medical equipment – where the failure of the Fairchild product reasonably would be expected to result in personal injury, death or property damage. Customer’s use of this product is subject to agreement of this Authorized Use policy. In the event of an unauthorized use of Fairchild’s product, Fairchild accepts no liability in the event of product failure. In other respects, this product shall be subject to Fairchild’s Worldwide Terms and Conditions of Sale, unless a separate agreement has been signed by both Parties. 

## **ANTI-COUNTERFEITING POLICY** 

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Terms of Use 

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. 

## **PRODUCT STATUS DEFINITIONS** 

**Definition of Terms** 

|**Datasheet Identification**|**Product Status**|**Definition**|
|---|---|---|
|Advance Information|Formative / In Design|Datasheet contains the design specifications for product development. Specifications may change<br>in anymanner without notice.|
|Preliminary|First Production|Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild<br>Semiconductor reserves the right to make changes at anytime without notice to improve design.|
|No Identification Needed|Full Production|Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make<br>changes at anytime without notice to improve the design.|
|Obsolete|Not In Production|Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.<br>The datasheet is for reference information only.|



Rev. I77 

© Fairchild Semiconductor Corporation 

www.fairchildsemi.com