217-36CTRE6

Heat Sink, Square, PCB, Surface Mount, 55 °C/W, SOL-20, SOT-223, TO-220, TO-263, 15.2 mm, 9.14 mm

⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.

Manufacturer: WAKEFIELD THERMAL
Product type: Natural Convection Heat Sinks
Thermal Resistance:55°C/W; Packages Cooled:SOL-20, SOT-223, TO-220, TO-263; External Width - Metric:15.2mm; External Height - Metric:9.14mm; External Length - Metric:18.8mm; External Diameter - Metric:
SVHC: No SVHC (21-Jan-2025)
Product Range: -
Packages Cooled: SOL-20, SOT-223, TO-220, TO-263
Heat Sink Material: Copper
Thermal Resistance: 55°C/W
External Width - Metric: 15.2mm
External Height - Metric: 9.14mm
External Length - Metric: 18.8mm
External Width - Imperial: 0.6"
External Diameter - Metric: -
External Height - Imperial: 0.36"
External Length - Imperial: 0.74"
External Diameter - Imperial: -

Delivery and price
Units per pack	100
Price	0.793 €
Current stock	10+
Lead time	30 days

Datasheet

**==> picture [613 x 863] intentionally omitted <==**

**----- Start of picture text -----**<br>
em<br>wakefield-vettee<br>Standard Height Above Footprint Thermal Performance at Typical Load<br>PIN PCin. Board(mm) Dimensionsin. (mm) PackageFormat PackageQuantity ConvectionNatural Convection)Forced<br>217-36CTEB 360 (9.1) 600 (15.2) x 740 (18.8) Bulk 1 55°C @ 1W 16.0°C/W @ 200 LEM<br>217-36CTTEG 360 (9.1) 600 (15.2) x.740 (18.8) Tube 20 55°C @ 1W 16.0°C/W @ 200 LEM<br>217-36CTREB 360 (9.1) 600 (15.2) x 740 (18.8) Tape & Reel 250 55°C @ iW 16.0°C/W @ 200 LEM<br>MECHANICAL DIMENSIONS 217 HEAT SINK WITH THERMAL PERFORMANCE<br>60 DDPAK DEVICE 6 LAYER BOARD, 0’ PAK<br>125°C LEAD, 40°C AMBIENT KEY.<br>Ty 150 ; Device only, NG<br>| |a @(1 D eviceevice++ HS,HS, NC200 ttm<br>= 100) 4 <> Device + HS, 300 lim<br>= o<br>36 7= ZA#<br>= y<br>215 = A . | z<br>! s Af aT og<br>é ?|<br>|<br>{if al id eT ee ac|<br>217-36CT6 Ry Be ee ee | |<br>__ 0 I 2 3 4<br>= — a 4 me ‘. 5<br>E 62<br>[ Ti Device Power Dissipation. W<br>—— ee 9.079<br>A — SECTION A-A i<br>| LIL *<br>SS L28 768 o Leoo<br>REEL DETAILS mi<br>#13.00 245 409<br>NOTES e4 - 64<br>1. Materialto be “ESD” TAPE DETAILS<br>pons z Approximately 6 Meters per Reel ay O10 MIN<br>( & | 3. 260 Pieces perReel. = BOARD LAYOUT RECOMMENDATIONS ‘“~ f Oe ee<br>eee: 217-36CTRG USE MAX COPPER TO /<br>ALLOW MAX CONDUCTION<br>TO HEAT SINK O4<br>66 42a= Sh= 1 Bal<br>TUBE DETAILS 02 | [Se / REF. JEDEC TO-220A8<br>64 ES 4 f SOLDER MASK OPENING<br>R 025 a ee — f zZ<br>|<br>35<br>B4 025 COPPER FOOTPRINT [>KR 8n | : eerR<br>FOR HEATSINK OFS :<br>| 2 a<br>75<br>REF: JEDEC TO-263 (0D PAK]<br>! [re] 36 «640 | | AEF: JCOEG NO-169 (DD PAK)<br>TUBE: 16.25Min. ESDInches Material with Long,  Nail Ele ie’ f\ an |<br>Stops / MIN CCPPER<br>20 Pieces per Tube FOR HEATSINK<br>217-36CTT6<br>217-36CT6<br>**----- End of picture text -----**<br>

Updated at April 29, 2026

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