1PS70SB10,115

**1PS70SB10** 

**Schottky barrier single diode 17 December 2012** 

**Product data sheet** 

## **1. General description** 

Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a very small SOT323 Surface-Mounted Device (SMD) plastic package. 

## **2. Features and benefits** 

- Low forward voltage 

- Low capacitance 

- AEC-Q101 qualified 

## **3. Applications** 

- Ultra high-speed switching 

- Line termination 

- Voltage clamping 

- Reverse polarity protection 

## **4. Quick reference data** 

## **Table 1. Quick reference data** 

|**Symbol**|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|IF|forward current|||-|-|200|mA|
|VR|reverse voltage|||-|-|30|V|
|VF|forward voltage|IF= 10 mA; Tamb= 25 °C||-|-|400|mV|



## **5. Pinning information** 

**Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol** ~~a~~ 1 A anode 3 K ~~ee eeee~~ 2 n.c. not connected A n.c. 3 K cathode _aaa-005805_ 1 2 **SC-70 (SOT323)** ~~TT~~ 

Scan or click this QR code to view the latest information for this product 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

## **6. Ordering information** 

## **Table 3. Ordering information** 

|**Type number**|**Package**|||
|---|---|---|---|
||**Name**|**Description**|**Version**|
|1PS70SB10|SC-70|plastic surface-mounted package; 3 leads|SOT323|



## **7. Marking** 

|**7.**<br>**Marking**||
|---|---|
|**Table 4.**<br>**Marking codes**||
|**Type number**|**Marking code**<br>**[1]**|
|1PS70SB10|7%0|



[1] % = placeholder for manufacturing site code 

## **8. Limiting values** 

## **Table 5. Limiting values** 

_In accordance with the Absolute Maximum Rating System (IEC 60134)._ 

|**Symbol**|**Parameter**|**Conditions**||**Min**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VR|reverse voltage|||-|30|V|
|IF|forward current|||-|200|mA|
|IFRM|repetitive peak forward current|tp≤ 1 s; δ ≤ 0.5||-|300|mA|
|IFSM|non-repetitive peak forward<br>current|tp< 10 ms; Tj(init)= 25 °C||-|600|mA|
|Ptot|total power dissipation|Tamb< 25 °C||-|200|mW|
|Tj|junction temperature|||-|150|°C|
|Tamb|ambient temperature|||-55|150|°C|
|Tstg|storage temperature|||-65|150|°C|



## **9. Thermal characteristics** 

## **Table 6. Thermal characteristics** 

|**Symbol**|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|Rth(j-a)|thermal resistance<br>from junction to<br>ambient|in free air|[1]|-|-|625|K/W|



[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 

© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. 

**Product data sheet** 

**17 December 2012** 

**2 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

## **10. Characteristics** 

## **Table 7. Characteristics** 

|**Symbol**|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|---|
|VF|forward voltage|IF= 0.1 mA; Tamb= 25 °C||-|-|240|mV|
|||IF= 1 mA; Tamb= 25 °C||-|-|320|mV|
|||IF= 10 mA; Tamb= 25 °C||-|-|400|mV|
|||IF= 30 mA; Tamb= 25 °C||-|-|500|mV|
|||IF= 100 mA; Tamb= 25 °C||-|-|800|mV|
|IR|reverse current|VR= 25 V; pulsed; tp= 300 µs;<br>δ = 0.02 ; Tamb= 25 °C||-|-|2|µA|
|Cd|diode capacitance|VR= 1 V; f = 1 MHz; Tamb= 25 °C||-|-|10|pF|



**==> picture [497 x 270] intentionally omitted <==**

**----- Start of picture text -----**<br>
006aac829 aaa-004515<br>10 [3] 10 [3]<br>IF (3) IR (1)<br>(mA) (1) (µA)<br>(2)<br>10 [2] 10 [2]<br>(2)<br>10 10<br>(1) (2) (3)<br>1 1 (3)<br>10 [-1] 10 [-1]<br>0.0 0.4 0.8 1.2 0 10 20 30<br>VF (V) VR (V)<br>(1) Tamb = 125 °C (1) Tamb = 125 °C<br>(2) Tamb = 85 °C (2) Tamb = 85 °C<br>(3) Tamb = 25 °C (3) Tamb = 25 °C<br>Fig. 1. Forward current as a function of forward Fig. 2. Reverse current as a function of reverse<br>voltage; typical values voltage; typical values<br>**----- End of picture text -----**<br>


© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. 

**Product data sheet** 

**17 December 2012** 

**3 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

**==> picture [233 x 189] intentionally omitted <==**

**----- Start of picture text -----**<br>
006aac891<br>10<br>Cd<br>(pF)<br>8<br>6<br>4<br>2<br>0<br>0 10 20 30<br>VR (V)<br>**----- End of picture text -----**<br>


Tamb = 25 °C; f = 1 MHz **Fig. 3. Diode capacitance as a function of reverse voltage; typical values** 

## **11. Test information** 

## **11.1 Quality information** 

This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 

## **12. Package outline** 

**==> picture [364 x 181] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.2 1.1<br>1.8 0.8<br>3 0.45<br>0.15<br>2.2 1.35<br>2.0 1.15<br>1 2<br>0.4 0.25<br>0.3 0.10<br>1.3<br>Dimensions in mm 04-11-04<br>Fig. 4. Package outline SC-70 (SOT323)<br>**----- End of picture text -----**<br>


© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. 

**Product data sheet** 

**17 December 2012** 

**4 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

## **13. Soldering** 

**==> picture [497 x 398] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.65<br>1.85<br>1.325<br>solder lands<br>2 solder resist<br>2.35 [0.6] 3 1.3 solder paste<br>(3×)<br>0.5 occupied area<br>1<br>(3×)<br>Dimensions in mm<br>0.55<br>(3×) sot323_fr<br>Fig. 5. Reflow soldering footprint for SC-70 (SOT323)<br>4.6<br>2.575<br>1.425<br>(3×)<br>solder lands<br>solder resist<br>occupied area<br>3.65 2.1 1.8 Dimensions in mm<br>09 preferred transport<br>direction during soldering<br>(2×)<br>sot323_fw<br>Fig. 6. Wave soldering footprint for SC-70 (SOT323)<br>**----- End of picture text -----**<br>


## **14. Revision history** 

|**14. Revision history**|**14. Revision history**||||
|---|---|---|---|---|
|**Table 8.**<br>**Revision history**|||||
|**Data sheet ID**|**Release date**|**Data sheet status**|**Change notice**|**Supersedes**|
|1PS70SB10 v.2|20121217|Product data sheet|-|1PS70SB10_14_15_16<br>v.1|



© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. 

**Product data sheet** 

**17 December 2012** 

**5 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

|**Data sheet ID**|**Release date**|**Data sheet status**|**Change notice**|**Supersedes**|
|---|---|---|---|---|
|Modifications:|•<br>The format of this document has been redesigned to comply with the new identity guidelines<br>of NXP Semiconductors.<br>•<br>Legal texts have been adapted to the new company name where appropriate.<br>•<br>Sections 1 to 3 updated<br>•<br>Section 4 "Quick reference data" added<br>•<br>Section 6 "Ordering information" added<br>•<br>Section 7 "Marking" updated<br>•<br>Table 5 "Limiting values": ambient temperature Tamband junction temperature Tjminimum<br>value updated<br>•<br>Figues 1, 2 and 3 updated<br>•<br>Section 11 "Test information" added<br>•<br>Figure 4: superseded by minimized package outline drawing<br>•<br>Section 13 "Soldering" added<br>•<br>Section 14 "Legal information" updated||||
|1PS70SB10_14_15_16<br>v.1|19990426|Product data sheet|-|-|



© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. **17 December 2012** 

**Product data sheet** 

**6 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

## **15. Legal information** 

## **15.1 Data sheet status** 

|**Document**<br>**status [1]**<br>**[2]**|**Product**<br>**status [3]**|**Definition**|
|---|---|---|
|Objective<br>[short] data<br>sheet|Development|This document contains data from<br>the objective specification for product<br>development.|
|Preliminary<br>[short] data<br>sheet|Qualification|This document contains data from the<br>preliminary specification.|
|Product<br>[short] data<br>sheet|Production|This document contains the product<br>specification.|



[1] Please consult the most recently issued document before initiating or completing a design. 

[2] The term 'short data sheet' is explained in section "Definitions". 

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 

## **15.2 Definitions** 

**Preview** — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 

**Draft** — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. 

**Short data sheet** — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 

**Product specification** — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 

## **15.3 Disclaimers** 

**Limited warranty and liability** — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. 

In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 

Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the _Terms and conditions of commercial sale_ of NXP Semiconductors. 

**Right to make changes** — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 

**Suitability for use** — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. 

**Quick reference data** — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 

**Applications** — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 

Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 

NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. 

**Limiting values** — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. 

**Terms and conditions of commercial sale** — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. 

**No offer to sell or license** — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the 

© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. 

**Product data sheet** 

**17 December 2012** 

**7 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 

**Export control** — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 

**Non-automotive qualified products** — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. 

In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 

**Translations** — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 

## **15.4 Trademarks** 

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 

**Adelante** , **Bitport** , **Bitsound** , **CoolFlux** , **CoReUse** , **DESFire** , **EZ-HV** , **FabKey** , **GreenChip** , **HiPerSmart** , **HITAG** , **I²C-bus** logo, **ICODE** , **I-CODE** , **ITEC** , **Labelution** , **MIFARE** , **MIFARE Plus** , **MIFARE Ultralight** , **MoReUse** , **QLPAK** , **Silicon Tuner** , **SiliconMAX** , **SmartXA** , **STARplug** , **TOPFET** , **TrenchMOS** , **TriMedia** and **UCODE** — are trademarks of NXP B.V. 

**HD Radio** and **HD Radio** logo — are trademarks of iBiquity Digital Corporation. 

© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. **17 December 2012** 

**Product data sheet** 

**8 / 9** 

**NXP Semiconductors** 

**1PS70SB10** 

**Schottky barrier single diode** 

## **16. Contents** 

|**16. **|**Contents**|
|---|---|
|**1**|**General description ............................................... 1**|
|**2**|**Features and benefits ............................................1**|
|**3**|**Applications ........................................................... 1**|
|**4**|**Quick reference data ............................................. 1**|
|**5**|**Pinning information ...............................................1**|
|**6**|**Ordering information .............................................2**|
|**7**|**Marking ...................................................................2**|
|**8**|**Limiting values .......................................................2**|
|**9**|**Thermal characteristics .........................................2**|
|**10**|**Characteristics .......................................................3**|
|**11**|**Test information .....................................................4**|
|11.1|Quality information .........................................|
|**12**|**Package outline ..................................................... 4**|
|**13**|**Soldering ................................................................ 5**|
|**14**|**Revision history .....................................................5**|
|**15**|**Legal information ...................................................7**|
|15.1|Data sheet status ................................................. 7|
|15.2|Definitions .............................................................7|
|15.3|Disclaimers ...........................................................7|
|15.4|Trademarks .......................................................... 8|



## **© NXP B.V. 2012. All rights reserved** 

For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 17 December 2012** 

© NXP B.V. 2012. All rights reserved 

1PS70SB10 

All information provided in this document is subject to legal disclaimers. **17 December 2012** 

**Product data sheet** 

**9 / 9**