# TVS Diode, Transil, Unidirectional, 5 V, 8 V, DO-201, 2 Pins
**URL**: https://novapart.co/products/1N5908/tvs-diode-transil-unidirectional-5-v-8-do-201-2
**SKU**: 1N5908
**Manufacturer**: STMICROELECTRONICS
**Category**: Circuit Protection || TVS - Transient Voltage Suppressors || TVS Diodes
**Price**: €0.3510
**Stock**: 10+
**Lead Time**: 127 days (indicative)
## Description
Product Range:Transil Series; TVS Polarity:Unidirectional; Reverse Stand-Off Voltage Vrwm:5V; Clamping Voltage Vc Max:8V; Diode Case Style:DO-201; No. of Pins:2Pins; Breakdown Voltage M
## Specifications
| Parameter | Value |
|---|---|
| Svhc | No SVHC (25-Jun-2025) |
| No. Of Pins | 2Pins |
| Tvs Polarity | Unidirectional |
| Product Range | Transil |
| Qualification | - |
| Diode Mounting | Through Hole |
| Diode Case Style | DO-201 |
| Clamping Voltage Max | 8V |
| Reverse Standoff Voltage | 5V |
| Maximum Breakdown Voltage | - |
| Minimum Breakdown Voltage | 6V |
| Operating Temperature Max | 175°C |
| Peak Pulse Power Dissipation | 1.5kW |
## Datasheet
📄 [Download PDF](https://novapart.co/datasheet/farnell:2629699/)
Transil™
**==> picture [61 x 39] intentionally omitted <==**
## **1N5908 SM5908**
## **Features**
- Peak pulse power:
- 1500 W (10/1000 μ s)
- Stand off voltage: 5 V
- Unidirectional
- Operating Tj max: 175 °C
- High power capability at Tj max: – 1500 W (10/1000 µs)
- JEDEC registered package outline
**==> picture [190 x 104] intentionally omitted <==**
**----- Start of picture text -----**
A
A
K
K
SMC DO-201
(JEDEC DO-214AB)
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## **Complies with the following standards**
- IEC 61000-4-2 level 4:
- 15 kV (air discharge)
- 8 kV (contact discharge)
- IEC 61000-4-5
- MIL STD 883G, method 3015-7 Class 3B – 25 kV HBM (human body model)
- Resin meets UL 94, V0
- MIL-STD-750, method 2026 solderability
- EIA STD RS-481 and IEC 60286-3 packing
- IPC 7531 footprint
## **Description**
This Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 1500 W (10/1000 μ s).
The Planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time.
They are packaged in SMC (SMC footprint in accordance with IPC 7531 standard) and DO-201.
**TM** : Transil is a trademark of STMicroelectroniocs
September 2011
1/9
Doc ID 2914 Rev 3
_www.st.com_
**Characteristics**
**1N5908, SM5908**
## **1 Characteristics**
## **Table 1. Absolute maximum ratings (Tamb = 25 °C)**
|**Table 1.**|**Absolute maximum ratings (Tamb = 25 °C)**|**Absolute maximum ratings (Tamb = 25 °C)**|||
|---|---|---|---|---|
|**Symbol**|**Parameter**||**Value**|**Unit**|
|PPP|Peak pulse power dissipation(1)|Tjinitial = Tamb|1500|W|
|Tstg|Storage temperature range||-65 to +175|° C|
|Tj|Operating junction temperature range||-55 to +175|° C|
|TL|Maximum lead temperature for soldering during 10 s.||260|° C|
|1.
For a surge greater than the maximum values, the diode will fail in short-circuit.|||||
## **Table 2. Thermal resistances**
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Symbol Parameter Value Unit
SMC 15
R Junction to leads
th(j-l)
DO-201 20
° C/W
Junction to ambient on printed circuit on recommended pad layout SMC 90
R
th(j-a)
Junction to ambient DO-201 75
Figure 1. Electrical characteristics - definitions
I
Symbol VRM Parameter Stand-off voltage IF
VBR Breakdown voltage
VCL Clamping voltage
IRM Leakage current @ VRM VCLVBR VRM VF V
IPP Peak pulse current IRM
aT Voltage temperature coefficient IR
VF Forward voltage drop
RD Dynamic resistance IPP
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## **Figure 2. Pulse definition for electrical characteristics**
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Repetitive pulse current
tr = rise time (µs)
tp = pulse duration time (µs)
tr tp
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2/9
Doc ID 2914 Rev 3
**1N5908, SM5908**
**Characteristics**
**Table 3. Electrical characteristics - parameter values (Tamb = 25 °C)**
|**Order code**|**IRM @VRM**|**IRM @VRM**|**VBR @IR **
**(1)**|**VBR @IR **
**(1)**|**VCL @IPP, **
**10/1000 µs**|**VCL @IPP, **
**10/1000 µs**|**VCL @IPP, **
**10/1000 µs**|**VCL @IPP, **
**10/1000 µs**|**VCL @IPP, **
**10/1000 µs**|**VCL @IPP, **
**10/1000 µs**|α**T(2)**|**C**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||**max**||**min**||**max**||**max**||**max**||**max**|**typ**|
||**µA**|**V**|**V**|**mA**|**V**|**A(3)**|**V**|**A(3)**|**V**|**A(3)**|**10-4/ °C**|**pF**|
|1N5908|300|5|6|1|7.6|30|8|60|8.5|120|5.7|9500|
|SM5908|||||||||||||
1. Pulse tes: t < 50 ms p
2. To calculate VBR or VCL versus junction temperature, use the following formulas: VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25)) VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ – 25))
3. Surge capability given for both directions
**Figure 3. Peak pulse power dissipation versus initial junction temperature**
**Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 °C)**
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2000 Ppp (W) 100.0 PPP(kW)
Tj initial = 25 °C
1500
10.0
1000
1.0
500
Tj(°C) tP(ms)
0 0.1
0 25 50 75 100 125 150 175 200 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
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3/9
Doc ID 2914 Rev 3
**Characteristics**
**1N5908, SM5908**
## **Figure 5. Clamping voltage versus peak pulse current (exponential waveform, typical values)**
**==> picture [416 x 271] intentionally omitted <==**
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IPP(A)
1000.0
Tj initial=25 °C 8/20 µs
10/1000 µs
100.0
10.0
1.0
VCL(V)
0.1
1 10 100
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**==> picture [462 x 181] intentionally omitted <==**
**----- Start of picture text -----**
Figure 6. Junction capacitance versus Figure 7. Peak forward voltage drop
reverse applied voltage versus peak forward current
(typical values) (typical values)
C(nF) IFM(A)
10 1.0E+02
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
1.0E+01
Tj =125 °C
Tj =25 °C
1.0E+00
VR(V) VFM(V)
1 1.0E-01
1 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0
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4/9
Doc ID 2914 Rev 3
**1N5908, SM5908**
**Characteristics**
**Figure 8. Relative variation of thermal Figure 9. Relative variation of thermal impedance, junction to ambient, impedance, junction to ambient, versus pulse duration (SMC) versus pulse duration (DO-201)**
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1.00 Zth(j-a) / Rth(j-a) 1.00 Zth(j-a) / Rth(j-a)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
0.10 0.10
0.01 tP(s) 0.01 tP(s)
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Figure 10. Thermal resistance junction to Figure 11. Leakage current versus junction
ambient versus copper surface temperature (typical values)
under each lead (SMC)
Rth(j-a)(°C/W) IR (µA)
100 1.E+02
PCB FR4, copper thickness = 35 µm
90
80
70
60
50 1.E+01
40
30
20
10 Tj(°C)
SCU(cm²)
0 1.E+00
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25 50 75 100 125 150 175
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5/9
Doc ID 2914 Rev 3
**1N5908, SM5908**
**Package information**
## **2 Package information**
- Case: JEDEC DO-214AB molded plastic over planar junction
- Terminals: solder plated, solderable per MIL-STD-750, Method 2026
- Polarity: for unidirectional types the band indicates cathode
- Flammability: epoxy is rated UL94V-0
- RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark.
**==> picture [139 x 9] intentionally omitted <==**
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Table 4. SMC dimensions
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|**C**||||||||**b**|**b**|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||**Millimeters**||**Inches**||
||||||||||||**Min.**|**Max.**|**Min.**|**Max.**|
||||**E1**||**L**
**D**
**A1**
**A2**||||||||||
|||||||||||A1|1.90|2.45|0.075|0.096|
|||||||||||A2|0.05|0.20|0.002|0.008|
|||||||||||b|2.90|3.2|0.114|0.126|
||||**E**||||||||||||
|||||||||||c|0.15|0.41|0.006|0.016|
|||||||||||E|7.75|8.15|0.305|0.321|
||||||||||||||||
|||||||||||E1|6.60|7.15|0.260|0.281|
||||||**L**||||||||||
||||**E2**|||||**b**||E2|4.40|4.70|0.173|0.185|
|||||||||||D|5.55|6.25|0.218|0.246|
|||||||||||L|0.75|1.60|0.030|0.063|
**Figure 12. SMC footprint dimensions mm Figure 13. SMC marking layout[(1)] (inches)**
**==> picture [406 x 158] intentionally omitted <==**
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1.54 5.11 1.54
(0.061) (0.201) (0.061) Cathode bar
:ECOPACK status
3.14
(0.124) x x x XXX:Z:Y: ManufacturingYearMarking location
WW: week
z y w w
8.19
(0.322)
1. Marking layout can vary according to assembly location.
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6/9
Doc ID 2914 Rev 3
**1N5908, SM5908**
**Package information**
|**Table 5.**
**DO-201 Dimensions**|**Table 5.**
**DO-201 Dimensions**|**Table 5.**
**DO-201 Dimensions**|**Table 5.**
**DO-201 Dimensions**|**Table 5.**
**DO-201 Dimensions**|**Table 5.**
**DO-201 Dimensions**||||||
|---|---|---|---|---|---|---|---|---|---|---|
||||||**B**|**Ref.**|**Dimensions**||||
||||||||**Millimeters**||**Inches**||
|||**B**||**A**|**B**||||||
||||||||||||
||||||||**Min.**|**Max.**|**Min.**|**Max.**|
||||||||||||
|||**Ø**
**ØD**|||||||||
||||**C**|||A|8.5|9.5|0.335|0.374|
|||||||B|25.4||1||
||||||||||||
|||||||Ø C|4.8|5.3|0.189|0.209|
||||||||||||
|||||||Ø D|0.96|1.06|0.038|0.042|
**Table 6. DO-201 marking layout**
||||**Cathode**|**Cathode**|**Cathode**|**Cathode**|**bar**|**bar**|||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||
||||||||||||||
||||||||||||||
||||**x**|**x**|**x**|**x**|**x**||||||
||||**x**|**x**|**x**|**x**||||**e,**|**G : Ecopack status**||
||||**x**|**x**||||||**x:**|**Marking**||
||||**m**|**m**|**m**|**y**|**w**|**w**||**mmm : Manufacturing location**
**y:Year**|||
|||||||||||**ww: week**|||
7/9
Doc ID 2914 Rev 3
**Ordering information**
**1N5908, SM5908**
## **3 Ordering information**
## **Table 7. Ordering information**
|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|SM5908|MDC|SMC|0.25 g|2500|Tape and reel|
|1N5908|1N5908|DO-201|0.9 g|600|Ammopack|
## **4 Revision history**
**Table 8.** 02-Jul **Document revision history**
|**Date**|**Revision**|**Changes**|
|---|---|---|
|Aug-1999|2A|Previous release|
|20-Sep-2011|3|Added cathode bands. Added standards compliance
statements. Updated_Description_. Updated_Table 1_and_Table 2_.
Updated Figures_3_through_11_. Updated_Section 2: Package_
_information_.|
8/9
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**1N5908, SM5908**
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9/9
Doc ID 2914 Rev 3
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