1N5408RLG

**DATA SHEET www.onsemi.com** 

## Axial-Lead Glass Passivated Standard Recovery Rectifiers 

## 1N5400 thru 1N5408 

**STANDARD RECOVERY RECTIFIERS 50−1000 VOLTS** 

**3.0 AMPERES** 

Lead mounted standard recovery rectifiers are designed for use in power supplies and other applications having need of a device with the following features: 

## **Features** 

- High Current to Small Size 

- High Surge Current Capability 

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AXIAL LEAD<br>CASE 267−05<br>STYLE 1<br>**----- End of picture text -----**<br>


- Low Forward Voltage Drop 

- Void−Free Economical Plastic Package 

- Available in Volume Quantities 

## **MARKING DIAGRAM** 

- Plastic Meets UL 94 V−0 for Flammability 

- These are Pb−Free Devices 

## **Mechanical Characteristics:** 

- Case: Epoxy, Molded 

- Weight: 1.1 Gram (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Polarity: Cathode Indicated by Polarity Band 

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A<br>1N<br>540x<br>YYWW �<br>�<br>A = Assembly Location<br>1N540x = Device Number<br>x = 0, 1, 2, 4, 6, 7 or 8<br>YY = Year<br>WW = Work Week<br>� = Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 5 of this data sheet. 

> *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2008 **August, 2021 − Rev. 12** 

**1N5400/D** 

**1N5400 thru 1N5408** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||||||||
|---|---|---|---|---|---|---|---|---|---|
|**Rating**|**Symbol**|**1N5400**|**1N5401**|**1N5402**|**1N5404**|**1N5406**|**1N5407**|**1N5408**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|50|100|200|400|600|800|1000|V|
|Non−repetitive Peak Reverse Voltage|VRSM|100|200|300|525|800|1000|1200|V|
|Average Rectified Forward Current<br>(Single Phase Resistive Load,<br>1/2 in. Leads, TL= 105°C)|IO|3.0|||||||A|
|Non−repetitive Peak Surge Current<br>(8 ms Single Half−Sine−Wave)|IFSM|200 (one cycle)|||||||A|
|Operating and Storage Junction<br>Temperature Range|TJ<br>Tstg|−65 to +150<br>−65 to +175|||||||°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**||**Typ**||**Unit**|
|Thermal Resistance, Junction−to−Ambient (PC Board Mount, 1/2 in. Leads)|R�JA||53||°C/W|
|**ELECTRICAL CHARACTERISTICS**||||||
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Forward Voltage (IF= 3.0 A, TA= 25°C)|vF|−|−|1.0|V|
|Reverse Current (Rated DC Voltage)<br>TA= 25°C<br>TA= 100°C|IR|−<br>−|−<br>−|10<br>50|�A|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

Ratings at 25 ° C ambient temperature unless otherwise specified. 60 Hz resistive or inductive loads. 

For capacitive load, derate current by 20%. 

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**2** 

**1N5400 thru 1N5408** 

## **NOTE 1 — AMBIENT MOUNTING DATA** 

Data shown for thermal resistance junction−to−ambient (R�JA) for the mountings shown is to be used as typical guideline values for preliminary engineering or in case the tie point temperature cannot be measured. 

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TYPICAL VALUES FOR R � JA IN STILL AIR<br>Mounting Lead Length, L (IN) R � JA<br>Method 1/8 1/4 1/2 3/4<br>1 50 51 53 55 ° C/W<br>2 58 59 61 63 ° C/W<br>3 28 ° C/W<br>MOUNTING METHOD 1 MOUNTING METHOD 3<br>P.C. Board Where Available P.C. Board with<br>Copper Surface area is small 1−1/2” x 1−1/2”<br>Copper Surface<br>L L<br>ÉÉÉÉÉÉÉÉÉ ÉÉ L = 1/2”<br>ÉÉ<br>MOUNTING METHOD 2<br>ÉÉ<br>Vector Push−In Terminals T−28 ÉÉ<br>ÉÉ Board Ground Plane<br>L L<br>ÉÉÉÉÉÉÉÉÉ<br>www.onsemi.com<br>3<br>**----- End of picture text -----**<br>


**1N5400 thru 1N5408** 

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200 400<br>Surge Applied @<br>TJ = 25 ° C 300 TJ = 25 ° C<br>f = 60 Hz<br>100<br>200<br>70<br>TYPICAL 1 CYCLE<br>50<br>100<br>90<br>80<br>30<br>70<br>20 60<br>50<br>401.0 2.0 3.0 5.0 7.0 10 20 30 50 70 100<br>10<br>NUMBER OF CYCLES<br>7.0 Figure 2. Maximum Nonrepetitive Surge Current<br>5.0<br>3.0 5<br>Both Leads to<br>DC Heat Sink<br>2.0<br>4 with Lengths<br>as Shown<br>1.0 3 Square 1/4” L = 1/32”<br>Wave<br>0.7<br>2 1/2”<br>0.5<br>1<br>0.3<br>0.2 0<br>0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 40 50 60 70 80 90 100 110 120 130 140 150 160<br>vF, INSTANTANEOUS VOLTAGE (V) TL, LEAD TEMPERATURE ( ° C)<br>Figure 1. Forward Voltage Figure 3. Maximum Current Derating, Lead,<br>Various Lengths<br>6 16<br>5 RR �� JAJA = 28 = 50 °° C/WC/W 14 IPK/IAV = 20 10 5 SquareWave<br>12<br>4<br>10 dc<br>DC<br>3 8<br>DC<br>6<br>2<br>4<br>1 Square<br>Wave 2<br>TJ = 25 ° C<br>0 0<br>40 50 60 70 80 90 100 110 120 130 140 150 160 0 1 2 3 4 5 6 7 8 9 10<br>TA, AMBIENT TEMPERATURE ( ° C) IF(AV), AVERAGE FORWARD CURRENT (A)<br>, PEAK HALF WAVE CURRENT (A)<br>IFSM<br>, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>iF<br>, AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>, AVERAGE POWER DISSIPATION (W)<br>F(AV)<br>P<br>**----- End of picture text -----**<br>


**Figure 4. Maximum Current Derating, Ambient, PC Board Mounting** 

**Figure 5. Forward Power Dissipation** 

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**4** 

**1N5400 thru 1N5408** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|1N5400G|Axial Lead*|500 Units/Box|
|1N5400RLG|Axial Lead*|1200/Tape & Reel|
|1N5401G|Axial Lead*|500 Units/Box|
|1N5401RLG|Axial Lead*|1200/Tape & Reel|
|1N5402G|Axial Lead*|500 Units/Box|
|1N5402RLG|Axial Lead*|1200/Tape & Reel|
|1N5404G|Axial Lead*|500 Units/Box|
|1N5404RLG|Axial Lead*|1200/Tape & Reel|
|1N5406G|Axial Lead*|500 Units/Box|
|1N5406RLG|Axial Lead*|1200/Tape & Reel|
|1N5407G|Axial Lead*|500 Units/Box|
|1N5407RLG|Axial Lead*|1200/Tape & Reel|
|1N5408G|Axial Lead*|500 Units/Box|
|1N5408RLG|Axial Lead*|1200/Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

*This package is inherently Pb−Free. 

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**5** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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AXIAL LEAD<br>CASE 267−05<br>ISSUE G DATE 06/06/2000<br>SCALE 1:1 NOTES:<br>1. DIMENSIONS AND TOLERANCING PER ANSI<br>K A 2. Y14.5M, 1982.CONTROLLING DIMENSION: INCH.<br>D + 3. 267-04 OBSOLETE, NEW STANDARD 267-05.<br>1 2<br>= INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.287 0.374 7.30 9.50<br>B [S ibe B 0.189 0.209 4.80 5.30<br>K D 0.047 0.051 1.20 1.30<br>rE] BE K 1.000 --- 25.40 E ---<br>STYLE 1: STYLE 2:<br>PIN 1. CATHODE (POLARITY BAND) NO POLARITY<br>2. ANODE<br>**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42170B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: AXIAL LEAD PAGE 1 OF 1** ~~ee~~ ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

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## **PUBLICATION ORDERING INFORMATION** 

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