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Illustrative purposes only
175-6-220P
SEMICONDUCTOR HARDWARE, INSULATORS
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: WAKEFIELD THERMAL
- Product type: Thermal Insulators
- Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:-; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:-; Thermal Impedance:-; Dielec 46F7847
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.439 € |
| Current stock | 1000+ |
| Lead time | 7 days |
Datasheet
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## **Accessory Products**
## **THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS**
Pe **120 SERIES**
The **120 Series** Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal
Resistivity graph below). **TYPICAL VALUES FOR THERMAL RESISTANCE, 120 SERIES - THERMAL JOINT COMPOUND CASE TO SINK (Øcs) WHEN THERMAL JOINT COMPOUNDS ARE USED Characteristic Description Typical** Volume Resistivity 5 X 10[14] ohm-cm **Mounting Torque Thermal in inch • pounds Resistance** Dielectric Strength 225 volts/mil **Case Style Characteristics (N•M) (°C/W)** Specific Gravity 2.1 min. T0-3 8 (0.9) 0.09 Thermal Conductivity @ 36°C 0.735 W/(m)(K) TO-66 9 (0.9) 0.14 5.1(Btu) (in.)/(hr)(ft[2] )(°F) TO-220 8 (0.9) 0.50 Thermal Resistivity (P) 56 (°C)(in.)/watt 0.19 (4.8) stud x 0.44 (11.2) hex 15 (1.7) 0.16 Bleed, % after 24 hrs @ 200°C 0.5 0.25 (6.4) stud x 0.69 (17.5) hex 30 (3.39) 0.10 Evaporation, % after 24 hrs @ 200°C 0.5 0.38 (9.7) stud x 1.06 (26.9) hex 75 (8.47) 0.07 Color opaque white 0.50 (12.7) stud x 1.06 (26.9) hex 125 (14.12) 0.07 Shelf life 5 years 0.75 (19.1) stud x 1.25 (31.8) hex 600 (67.79) 0.052 Operating Temperature Range (°C) -40/+200 ~~oeoy~~ TT TT TT TT 8 ~~<~~ 0ft **120 SERIES - ORDER GUIDE** 2 ~~20~~ 06 [Po **Series - Container Size** ~~b~~ e |fPl | | | | | ft | yl **P/N** 120-SA 4 gram plastic pak wo20.05seoe if yiTT| || || || || hd}| hd]| ff| 120-2120-5120-8 5 oz (0.14 kg) tube2 oz (0.06 kg) jar8 oz (0.23 kg) jar wseee |]EEE| | | | ft |] 120-80 5 lb (2.27 kg) can 120-320 20 lb (9.08 kg) can oo4f ee ed | | | | | | | ft | 0 1 2 3 4 5 TIME YEARS **122 Series Thermal Joint Compound** is a stable, silicone based, thixotropic paste developed to provide premium performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where power densities are concentrated in devices such as flip chip, reduced die size, and ‘overclock’ microprocessors. When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity compared to traditional ‘grease’. It is compatible with automated or manual dispensing methods and is fully RoHS compliant.
## **HIGH PERFORMANCE THERMAL COMPOUND**
## Pe **122 SERIES**
|**122 SERIES THERMAL JOINT COMPOUND**|**122 SERIES THERMAL JOINT COMPOUND**||**122 SERIES - ORDER GUIDE**|**122 SERIES - ORDER GUIDE**|**122 SERIES - ORDER GUIDE**|
|---|---|---|---|---|---|
|**Typical Characteristics**|**Description**||**Series -**<br>**P/N**||**Container Size**|
|Appearance|Smooth Gray paste||122-10CC||10cc syringe|
|Thermal Conductivity|2.5 W / m °K,||122-2||2 oz(0.06 kg) jar|
||17.3(Btu) (in.)/(hr) (ft2) (0F)||122-30CC||30cc syringe|
|Thermal Resistance|0.02 °C in 2 / W|||||
|Bleed|0.015 wt%,24 hrs at 200°C|||||
|Evaporation|0.150 wt%,24 hrs at 200°C|||||
|Volume Resistivity|1.4 x 10 10 ohm-cm|||||
|Dielectric Strength|225 volts/mil|||||
|Specific Gravity|2.23(gm/cc)at 25°C|||||
|OperatingRange|-40°C to 205°C|||||
|Shelf Life|5 years|||||
**64**
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**Accessory Products**
## **THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS**
Pe **126 SERIES** The **126 Series** is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal oxide fillers designed to enhance thermal performance characteristics of plastic and metal package devices exceeding that of silicone-based compounds. Solved are problems associated with contamination of wave solder baths and migration of silicone-based products. Shelf life: 5 years.
|**126 SERIES THERMAL JOINT COMPOUND**|**126 SERIES THERMAL JOINT COMPOUND**|
|---|---|
|**Characteristics**|**Description**|
|Appearance|Smooth,white homogeneouspaste|
|Solids Content,wt %|65% min|
|Thermal Conductivityat 36°C|.69 W / m0K,4.8(Btu)(in.)/(hr) (ft2) (°F)|
|Interface Thermal Resistance|0.043°C/W TO-3 at 0.0008 thick film|
|Bleed,24 hrs at 200°C,wt%|0.09% max|
|Evaporation,24 hrs at 200°C,wt%|0.6 max|
|Volume Resistivity|2.3 x 1012 ohms-cm|
|Dielectric Strength|200 volts/mil|
|Specific Gravity@ 60°F|2.93(gm/cc)|
|Penetration|280 to 320|
|Operating Range|-40°C to 200°C|
|~~Pe~~|~~Pe~~|**DeltaBond™ 152**adhesive is ideal for general cementing; thermally bonding semiconductors and components to<br>chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and|**DeltaBond™ 152**adhesive is ideal for general cementing; thermally bonding semiconductors and components to<br>chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks or thermal links; and|
|---|---|---|---|
|||for all permanent bonding of assemblies which require high thermally conductive interfaces. It produces a rigid,||
|||high strength bond to most materials when cured.**DeltaBond™ 152**is available in bi-packs, kits, and quarts.||
|||Order one bottle of hardener A-4 or B-4 per one quart of**DeltaBond™ 152**separately. Shelf life: 152KA 1 year,<br>all others 2 years.<br>3<br>3<br>3||
|||**DELTABOND™152**<br>**Mixing Proportions and Working Properties**<br>**Characteristics**<br>**A4**<br>**B4**<br>Parts of hardener per 100 parts<br>of resin byweight<br>7.5<br>3.5<br>*WorkingTime - at 77°F<br>45 min<br>30 min<br>†Initial cure time<br>77°F<br>8 hrs<br>6 hrs<br>150°F<br>45 min<br>30 min<br>250°F<br>20 min<br>15 minn<br>‡Post-cure time at a tempin °F<br>4 hrs @200°F<br>4 hrs @ 200°F<br>‡Alternate room temp. aging<br>4 days<br>4 days<br>time at 77°F<br>Workingconsistency (77°F)<br>viscous liquid<br>paste<br>Working viscosity (77°F) cps<br>25,000<br>—<br>**DELTABOND™152**<br>**Characteristics**<br>**Hardener Type**<br>**Typical Properties Fully Cured**<br>**A4**<br>**B4**<br>Thermal conductivity -<br>W/(m) (°K)<br>0.836<br>0.908<br>(Btu) (in.)/(hr) (ft2) (°F)<br>5.8<br>6.3<br>Thermal resistivity-(°C) (in.)watt<br>47<br>42<br>Bond shear strength<br>77°F<br>2,900<br>2,300<br>1 in. overlap - psi<br>125°F<br>2,200<br>2,000<br>etched aluminum to<br>etched aluminum<br>212°F<br>400<br>800<br>Heat distortionpoint - °F<br>130<br>225<br>Minimum dielectric strength,<br>v/mil,0.125 in. sample<br>400<br>400<br>Max operation<br>Continuous<br>65<br>150<br>temp - °C<br>Intermittent<br>100<br>190<br>~~—-=e~~||
|||**DELTABOND™152**||
|||**Ordering Guide - Resin and Hardener**||
|||**Resin**<br>**Hardener**<br>~~**Model**~~||
|||**Part No.**<br>**Container**<br>**Part Number**<br>~~**Number**~~||
|152-1A<br>Bi-Pack (1 oz)<br>Included in PIN 152-1 A (“A-4”) Type<br>DeltaBond™ 152<br>152-1B<br>Bi-Pack (1 oz)<br>Included in P/N 152-1 B (“B-4”) Type<br>152-KA<br>Kit (7 oz Resin, 0.5 oz Hardener)<br>lncluded in P/N 152-KA<br>152-Q<br>1 quart (4 lbs)<br>A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)<br>All hardener<br>part numbers<br>A-4, B-4||||
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**----- Start of picture text -----**<br>
Pe DeltaBond™ 152<br>**----- End of picture text -----**<br>
## **NOTES:**
- Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A—200 gms, B—200 gms. Larger batch sizes will greatly reduce working time.
- ** For optimum electrical properties, dry parts for 15 minutes at 150°F (65°C) or 30 minutes at 75°F (24°C) to slowly evaporate the thinner and then final cure for 4 hours at 275°F (135°C).
- After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties.
- After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same full properties.
- The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk, conditions of use being beyond our control.
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## **Accessory Products**
## **THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS**
**==> picture [69 x 9] intentionally omitted <==**
**----- Start of picture text -----**<br>
DeltaBond™ 153<br>**----- End of picture text -----**<br>
**DeltaCast™ 153** is a pourable casting resin having thermal expansion characteristics similar to aluminum and copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating components and assemblies, this series' major advantages and uses include potted systems (virtually indestructible), protecting components and systems from moisture and contaminants, securing proprietary circuitry, mechanical support of devices, removal of heat from hot components and the assembly equalizing temperatures, and high voltage isolation. **DeltaCast™ 153** is available in quarts and gallons. Order one bottle of hardener A4 or B4 per one quart of **DeltaCast™153** separately. Shelf life: 2 years. 3
**==> picture [426 x 222] intentionally omitted <==**
**----- Start of picture text -----**<br>
DELTACAST™153 DELTACAST™153<br>Characteristics Hardener Type Mixing Proportions and Working Properties<br>Typical Properties Fully Cured A4 B4 Characteristics A4 B4<br>Thermal conductivity - Parts of hardener per 100 parts 7.5 3.5<br>W/(m) (°K) 0.836 0.908 of resin by weight<br>(Btu) (in.)/(hr) (ft [2] ) (°F) 5.8 6.3 *Working Time - at 77°F 45 min 30 min<br>Thermal resistivity - (°C) (in.)watt 47 42 † Initial cure time 77°F 8 hrs 6 hrs<br>Bond shear strength1 in. overlap - psi 125°F77°F 2,500— 1,900— 150°F 45 min 30 min<br>etched aluminum to 250°F 20 min 15 minn<br>etched aluminum 212°F — —<br>‡Post-cure time at a temp in °F 4 hrs @200°F 4 hrs @ 200°F<br>Heat distortion point - °F 130 225 ‡Alternate room temp. aging 4 days 4 days<br>Minimum dielectric strength, time at 77°F<br>v/mil, 0.125 in. sample 400 400<br>Max operation Continuous 65 150 Working consistency (77°F) heavy liquid viscous liquid<br>temp - °C Intermittent 100 190 Working viscosity (77°F) cps 10,000 30,000<br>FE<br>DELTACAST™153<br>Ordering Guide - Resin and Hardener<br>Model<br>Resin Hardener<br>Number All hardener<br>Part No. Container Part Number<br>part<br>numbers<br>DeltaCast™ 153 153-Q 1 quart (4 lbs) A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)<br>A-4, B-4<br>**----- End of picture text -----**<br>
**DeltaBond™ 154**
**DeltaBond™ 154** is a medium viscosity, aluminum-filled resin with the best thermal conductivity of this series. It is, however, neither a good electrical insulator nor conductor. Its principal application is that of a good thermal mechanical adhesive for applications such as bonding fins to base plates or structural mounting blocks or brackets to heat sinks. Order one bottle of hardener A4 or B4 per one quart of **DeltaBond™ 154** separately. Shelf life: 2 3 years.
**==> picture [428 x 224] intentionally omitted <==**
**----- Start of picture text -----**<br>
DELTABOND™154 DELTABOND™154<br>Characteristics Hardener Type Mixing Proportions and Working Properties<br>Typical Properties Fully Cured A4 B4 Characteristics A4 B4<br>Thermal conductivity - Parts of hardener per 100 parts<br>W/(m) (°K) 1.053 1.154 of resin by weight 11.0 4.5<br>(Btu) (in.)/(hr) (ft [2] ) (°F) 7.3 8.0 *Working Time - at 77°F 45 min 30 min<br>Thermal resistivity - (°C) (in.)watt 37 34 † Initial cure time 77°F 8 hrs 6 hrs<br>Bond shear strength 77°F 3,000 2,400 150°F 45 min 30 min<br>1 in. overlap - psi 125°F 2,300 2,100<br>etched aluminum to 250°F 20 min 15 min<br>etched aluminum 212°F 500 800<br>‡Post-cure time at a temp in °F 4 hrs @200°F 4 hrs @ 200°F<br>Heat distortion point - °F 130 225 ‡Alternate room temp. aging 4 days 4 days<br>Minimum dielectric strength, time at 77°F<br>v/mil, 0.125 in. sample NA* NA*<br>Max operation Continuous 65 150 Working consistency (77°F) viscous liquid paste<br>temp - °C Intermittent 100 190 Working viscosity (77°F) cps 25,000 —<br>DELTABOND™154<br>Ordering Guide - Resin and Hardener<br>Model Resin Hardener<br>Number All hardener<br>Part No. Container Part Number<br>part<br>numbers<br>DeltaBond™ 154 154-Q 1 quart (2.5 lbs) A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)<br>A-4, B-4<br>**----- End of picture text -----**<br>
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**Accessory Products** ~~=~~
## wakefield-vette stato **THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS**
## PE **DeltaBond™ 155**
**DeItaBond™ 155** is an epoxy adhesive formulated for use within the semiconductor industry. An easy to mix spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is principally used to form thermally conductive joints in fabricated heat sinks and between heat sinks and power devices. When used to bond semiconductors to heat sinks, it also serves as an electrical insulator. Its strong bond to a wide variety of substrates resists severe temperature cycling. **DeItaBond™ 155** is only available in kit size. Simply squeeze out equal lengths and mix to uniform color. Shelf life: 1 year.
3
|**DELTABOND™155**|**DELTABOND™155**|||**DELTABOND™155**|**DELTABOND™155**||||
|---|---|---|---|---|---|---|---|---|
|**Characteristics**||**Hardener Type**||**Mixing Proportions and Working Properties**|||||
|**Typical Properties Fully Cured**||**DeltaBond™155**||Parts of hardenerper 100parts of resin||||byvolume 100|
|Thermal conductivity -||||*WorkingTime - at 77°F||||90 min|
|W/(m) (°K)||0.836||†Initial cure time<br>77°F||||8 hrs|
|(Btu) (in.)/(hr) (ft2) (°F)<br>Thermal resistivity-(°C) (in.)watt<br>Bond shear strength<br>77°F||5.8<br>47<br>2,600||150°F<br>250°F<br>‡Post-cure time at a tempin °F||||45 min<br>20 min<br>4 hrs @ 200°F|
|1 in. overlap - psi<br>125°F<br>etched aluminum to<br>etched aluminum<br>212°F||—<br>—||‡Alternate room temp. agingtime at 77°F<br>Workingconsistency (77°F)||||4 days<br>paste|
|Heat distortionpoint - °F||130||Working viscosity (77°F) cps||||paste|
|Minimum dielectric strength,<br>v/mil,0.125 in. sample<br>Max operation<br>Continuous<br>temp - °C<br>Intermittent||400<br>65<br>100||**DELTABOND™155**<br>**Ordering Guide - Resin and Hardener**<br>**Resin**<br>**Part No.**<br>**Container**<br>~~**Model**~~<br>~~**Number**~~||||**Hardener **<br>**Part Number**|
|||||DeltaBond™ 155<br>155<br>Kit (3 oz resin, 3 oz hardener)|||Included in P/N 155||
## ~~P|~~ **DeltaBond™ 156**
**DeltaBond™ 156** Thermally Conductive Adhesive is a modified acrylic adhesive designed for permanent mounting on components where heat must be effectively transmitted. Recommended for electromechanical assemblies to bond components and dissipate heat, it replaces mechanical fasteners and compressible pads, silicone grease, and epoxies; eliminates air entrapment, and other variables related to epoxy mixing. This soft paste requires no mixing and flows easily to allow thin bond lines. Primer activated, cure begins upon assembly. DeltaBond™ Activator fixtures at room temperature in less than 5 minutes. Full strength is developed in 4 to 12 hours and fillets become dry to the touch in 24 hours. It is not recommended to use this durable adhesive without the use of DeltaBond™ Activator. **DeltaBond™ 156** is available in kit size; order 156-K (25 ml Syringe and Activator Kit). Shelf life: 1 year.
|**DELTABOND™156**|**DELTABOND™156**|||**DELTABOND™156**||||
|---|---|---|---|---|---|---|---|
|||||||||
|**Characteristics**<br>**Typical Properties Fully Cured**|~~**Description**~~|||**Typical Electrical Properties**<br>**Test**<br>**Results**||**ASTM**||
|**Test**|**Results**|**ASTM**||Dielectric Strength<br>220 volts/mil||D149||
|Temperature Range|-65 to 300°F|||DielectricConstant, 77°F (25°C)||D150||
||(-54 to 149°C)<br>300°F to (177°C)|||100 Hz<br>14.92||||
||Intermittent|||1000 Hz<br>14.26||||
|Tensile Strength, at break|2360 psi|D638||1MM Hz<br>12.34||||
|Modulus<br>Elongation, at break<br>Outgassing|233,000 psi<br>7.75%<br>2.5% TLM|D638<br>D638<br>E595||Dissipaton Factor, 77°F (25°C)<br>100 Hz<br>0.05||D150||
||0.05% CVCM|||1000 Hz<br>0.03||||
|Coefficient of Thermal Expansion|7.1 x 10 -4(cm/cm°C)|||1MM Hz<br>0.06||||
|Tensile Shear<br>Thermal Conductivity, K|2500psi<br>3.47 Btu x in./hr ft2 °F|D1002||Volume Resistivity<br>5.2x1011 (ohms-cm)||D257||
|(absolute at 86°F (30°C)|(0.50 W/m °C)|||Surface Resistivity<br>8.6 x 1013 (ohms)||D257||
|**Note:**The absolute thermal conductivity test was developed specifi cally<br>for measuring thermal properties of thin film adhesive bonds.||||**Note:**DeltaBond™ Thermally Conductive Adhesive-High Strength<br>contains a metallic filler which, in certain applications, may have an<br>effect on electrical properties. Therefore, test each particular appli-||||
|||||cation to ensure that electrical properties are as required.||||
**DELTABOND™156 Model** ~~**Number**~~ **Ordering Guide - Resin and Hardener Resin Hardener Part No. Container Part Number** DeltaBond™ 156 156-K Resin Kit Hardener Syringe - 0.85 fl oz - 25 ml - 2 oz Included in kit hardener with brush applicator - net/0.44 oz fl contents bottle -12ml 4.2 oz total wt/kt
- Since the hardener/resin reaction is exothermic, it is important that batch size be matched to hardener speed. Working times given are for approximate batch sizes: A—200 gms, B—200 gms. Larger batch sizes will greatly reduce working time.
- After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties.
- After initial cure, material may be brought to full physical and electrical properties during post-cure or may be room temperature aged for charted length of time to achieve same full properties.
- The information contained herein is based on data believed to be reliable but we do not assume responsibility for accuracy. All such information is used at the customer's own risk, conditions of use being beyond our control.
**67** ~~EE~~
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## **Accessory Products**
## **THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS**
||||||||**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**<br>**173/174 SERIES**|**DeltaPads™ Thermally Conductive Insulators**|**DeltaPads™ Thermally Conductive Insulators**|**DeltaPads™ Thermally Conductive Insulators**|**DeltaPads™ Thermally Conductive Insulators**|**DeltaPads™ Thermally Conductive Insulators**|**DeltaPads™ Thermally Conductive Insulators**|**DeltaPads™ Thermally Conductive Insulators**|||||||||TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|TO-3, TO-66, TO-220,DO-4, DO-5 SHEET|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||||||||||||||||||||||||||||||||||||||
||||||||**Greaseless Thermally Conductive Kapton**<br>**175 SERIES**||||||||**Greaseless Thermally Conductive Kapton**||||||**Greaseless Thermally Conductive Kapton® Reinforced Insulators**||||||||||||||||||
|The 173, 174, and 175<br>Series are highly<br>efficient thermally con-<br>ductive insulators de-<br>signed for semi -<br>conductor interface<br>to heat sinks. Their<br>properties eliminate<br>messy concerns asso-<br>ciated with thermal<br>greases.<br>—|||||||**DeltaPads™**<br>**DeltaPads™**<br>**DeltaPads™**<br>**Kapton®**<br>**173-7 Series**<br>**173-9 Series**<br>**174-9 Series**<br>**175-6 Series**<br>Material Thickness<br>0.007 in.<br>0.009 in.<br>0.009 in.<br>0.006 in.<br>Color<br>Gray<br>Gray<br>Tan<br>Gray<br>Tear Strength,lb/in. Typical100<br>100<br>100<br>100<br>ASTM 0624<br>Volume Resistivity,megohm-cm,Minimum Normal<br>1.0 x 109<br>1.0 x 109<br>1.0 x 1013<br>1 x 1013<br>Breakdown Voltage,Minimum<br>4,000<br>5,000<br>5,000<br>6,000<br>Dielectric Constant at 60 Hz and 100 V Maximum<br>2.70<br>2.40<br>2.50<br>5.5 @ 1,000 Hz<br>Continuous Use Temperature,°C<br>-60/+200<br>-60/+200<br>-60/+200<br>-60/+200<br>Thermal Conductivity,cal/cm sec. °C,Minimum<br>3 x 10-3<br>3 x 10-3<br>1 x 10-2<br>1.2 x 10-3<br>Thermal Resistance(TO-3),1 in.2°C/W<br>0.33<br>0.50<br>0.25<br>0.40<br>Recommended Mounting Pressure, lb/in.2<br>350/550<br>350/550<br>350/550<br>350/550<br>**Characteristics**<br> ~~===~~<br>~~es~~|||||||||||||||||||||||||||||||**Test Method**<br>Micrometer<br>Visual<br>ASTM D257<br>ASTM 0149<br>ASTM D 150<br>–<br>–<br>–<br>Formula*|
|||||||||||||||||||||*P (pressure in psi) =||||0.2 x D (Thread Dia) x A (contact surface area square inches)||T(torque[in.-lb]x N(number of fasteners)<br>0.2 x D (Thread Dia) x A (contact surface area square inches)|||||||||||||
||||||||||**173-7**|||||||||||||**173-9**|||||||**174-9**|||||||||**175-6**|
||||||||||**Series**|||||||||||||**Series**||||||**Series**||||||||||**Series**|
||||||||||**No**|||||||**Adhesive**||||||**No**|||||||**No**||||||||||
||||||||||**Adhesive**|||||||**Backing**||||||**Adhesive**|||||**Adhesive**|||||||||||**Greaseless**|
||||||||||–|||||||–||||||173-9-210P|||||||–|||||||||175-6-210P|
||||||||||173-7-220P|||||||–||||||–|||||||–|||||||||175-6-220P|
||||||||||173-7-230P|||||||–||||||173-9-230P|||||||–|||||||||175-6-230P|
||||||||||173-7-240P||||||173-7-240A|||||||173-9-240P|||||||–|||||||||175-6-240P|
||||||||||–|||||||–||||||–|||||||–|||||||||175-6-250P|
||||||||||–|||||||–||||||–|||||||–|||||||||175-6-280P|
||||||||||–|||||||–||||||–||||174-9-310P||||||||||||175-6-310P|
||||||||||–|||||||–||||||–|||||||–|||||||||175-6-320P|
||||||||||–|||||||–||||||–|||||||–|||||||||175-6-330P|
||||||||||–|||||||–||||||–|||||||–|||||||||175-6-410P|
||||||||||–|||||||–||||||–|||||||–|||||||||175-6-610P|
||||||||||173-7-1212P|||||||–||||||173-9-1212P||||174-9-1212P||||||||||||–|
||||||||||||||||||||||||||||||||||||||||
|||||||||||||||||**MECHANICAL DIMENSIONS**|||||||||||||||||||||||
|||oe|||||A||.||3|||||"||||||;|||||||||||||||||
||||0.072<br>(1.8)|_|||An<br>!<br>1.187<br>(30.1)|||||0.100<br>(2.5)|||||<br>0.960<br>(24.4)||||||**TO-220**<br>-<br>b+A| 0.250R Type250ONLY<br>;<br>62)||||||||||**D04/05**<br>L<br>i|||||||
||||||||**TO-3**||||||||**TO-66**||||||||||||||||||||||||
||||||||||||||||A|||||0,250||9.00<br>;<br>c||||{hapOIA||OIA|OIA||||p<br>fe||||||
||||||**TO-5**<br>**SHEET**<br>tee<br>8|||||||||||||||**DUAL TO-220**<br>Te<br>—._||||||**TO-66 (RECTANGLE)**<br>ig<br>tee<br>ba|||||||||||||
||**Dimensions: in. (mm)**|**Dimensions: in. (mm)**|||||||||||||||||||||||||||||||||||||
**68**
Updated at March 6, 2026
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →