Image not available
Illustrative purposes only
10113949-00E-20DLF
BACKPLANE CONNECTOR, RECEPTACLE, 32POS
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: AMPHENOL COMMUNICATIONS SOLUTIONS
- Product type: Backplane Connectors
- Row Pitch: 1.85mm
- No. of Rows: 8Rows
- Product Range: FCI XCede Series
- Contact Plating: Gold Plated Contacts
- No. of Contacts: 32Contacts
- Contact Material: Copper Alloy
- Contact Termination Type: Press Fit
| Delivery and price | |
|---|---|
| Units per pack | 288 |
| Price | 6.5 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**BACKPLANE CONNECTORS** ## **XCEDE[® ] BACKPLANE CONNECTOR SYSTEM** ## **OVERVIEW** XCede[® ] connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede[® ] connectors also address requirements for high linear signal density at the backplane and daughter card interface. Complementary guide and power modules are also included in the product range. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or monoblock. The XCede[® ] backplane header system provides ruggedness and long-term reliability required by today’s systems. The wide ground contacts feature a stiffness-enhancing rib and are advanced ahead of the signals for robustness and signal pin protection. ## **FEATURES & BENEFITS** - High-speed backplane system - Resonance dampening shield aids in reduction of crosstalk resonances ## **TARGET MARKETS/APPLICATIONS** - Communications - [•] Switches - [•] Networking - [•] Access - Two ground vias between differential pairs allow elongated anti-pads to improve impedance control - Optional short compliant pins permit deeper back-drilling and dual diameter vias to enhance return loss performance - Intermate electrically and mechanically interchangeable equivalency as a licensed second source to Amphenol TCS - Daughter card monoblocks combine signal, guide and power modules to simplify board application - [•] Transport - [•] Wireless - Data - [•] Servers - [•] Storage Systems - Industry - [•] Medical - [•] Test & Measurement **XCEDE[®] BACKPLANE CONNECTOR SYSTEM** ## **TECHNICAL INFORMATION** ## **MATERIALS** - Contacts: Copper alloy - Platings: - [•] Performance based plating at separable interface - (Telecordia GR-1217 CORE Central Office) - Housings: High temperature thermoplastic, UL94-V0 - Wafer organizer: Stainless steel ## **ELECTRICAL PERFORMANCE** - Contact resistance: 10mΩ max. change from initial reading after environmental exposure - Current rating (with < 30 ºC temperature rise above ambient): - Signal contact: 1 A/contact - Wide ground contact: 2 A/contact - Power contact: 6 A/blade - Insertion loss performance: see SI Report Reference - Crosstalk performance: see SI Report Reference ## **MECHANICAL PERFORMANCE** - Signal mating force: 0.74 N max. per contact - Signal unmating force: 0.15 N min. per contact - Power mating force: 0.98 N max. per blade - Power unmating force: 0.44 N min. per blade - Press-fit insertion force: 36 N max. per tail ## **SPECIFICATIONS** - XCEDE[®] product specification: GS-12-588 - XCEDE[®] application specification: GS-20-121 - XCEDE[®] power product specification: GS-12-0989 - XCEDE[®] power product specification: GS-20-0342 - XCEDE[®] HD product specification: GS-12-9 - XCEDE[®] HD application specification: GS-20-34 - Telcordia GR-1217-CORE Central Office (EIA-364-21) ## **APPROVALS AND CERTIFICATIONS** - UL and CSA approvals ## **APPLICATIONS** **Disclaimer** For more information, please contact: Communications@fci.com or visit us at **www.fci.com** Please note that the above information is subject to change without notice. **XCEDE[®] BACKPLANE CONNECTOR SYSTEM** ## **XCEDE[® ] ACCESSORIES** Xcede[®] accessories include vertical power, right-angle power, guide modules and end cap. **==> picture [403 x 86] intentionally omitted <==** **----- Start of picture text -----**<br> Guide Power<br>Power Module Vertical<br>Right Angle<br>Signal<br>Vertical<br>End Cap Signal<br>Right<br>Angle<br>**----- End of picture text -----**<br> ## **DAUGHTER CARD** ## **Additional Features** - In addition to providing individual right-angle receptacle signal modules, customized groupings of right-angle signal, guidance and power modules can be attached to a single wafer organizer to form an integrated daughter card connector. ## **BACKPLANE** ## **Additional Features** - The wide ground contacts in the vertical backplane headers feature a stiffening rib that extends near the tip of the contact and are advanced ahead of the signal contacts for robustness and signal pin protection. **==> picture [152 x 174] intentionally omitted <==** **----- Start of picture text -----**<br> Receptacle<br>STANDARD EON 2 Options Small (Micro) EON<br>.57mm DRILL .45mm DRILL<br>2 Options<br>STANDARD EON Small (Micro) EON<br>.55mm DRILL .45mm DRILL<br>**----- End of picture text -----**<br> For more information, please contact: Communications@fci.com or visit us at **www.fci.com** **Disclaimer** Please note that the above information is subject to change without notice. **XCEDE[®] BACKPLANE CONNECTOR SYSTEM** ## **XCEDE[® ] POWER SYSTEM** - 150 grams normal force nominal - 3 levels of sequencing: 4.5mm, 6.0mm, 7.5mm ## **POWER RATING** - Modular construction gives an effective current density of - 8.6amps per mm. - Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing requirement - Housing: High-temperature thermoplastic, UL94-V0 - Wafers: High-temperature thermoplastic, UL94-V0 - Contacts: High-performance copper alloy - Platings: Performance based plating, at separable interface GR-1217-CORE (Central Office) ## **XCEDE[® ] VERTICAL POWER PART NUMBER MATRIX** **==> picture [306 x 199] intentionally omitted <==** **----- Start of picture text -----**<br> 1 0 0 9 1 9 3 0 1 X X 0 0 LF<br>Column Number<br>Lead Free<br>1 1<br>| |<br>2 2<br>3 3<br>Compliant Version Number Wipe Distance (mm) Number<br>Performance based 1 4.5 1<br>plating for Telcordia 6.0 2<br>Central Office (CO)<br>7.5 3<br>**----- End of picture text -----**<br> |Height|Number of Columns|Differential pairs per column|Part Number| |---|---|---|---| |Standard|1,2 or 3|4|10091830| |Less 1 mm|1,2 or 3|4|10091831| |Less 3 mm|1,2 or 3|4|10115237| |Standard|1,2 or 3|6|10115240| |Less 1 mm|1|6|10115241| For more information, please contact: Communications@fci.com or visit us at **www.fci.com** ## **Disclaimer** Please note that the above information is subject to change without notice. **XCEDE[®] BACKPLANE CONNECTOR SYSTEM** ## **PART NUMBERS** Lead-free part numbers are listed in the table; tin-lead versions are available upon request. Header part numbers shown provide 2mm signal contact wipe length; versions providing 3mm wipe length are also available. Customization of Monoblocks are also available. Contact your local FCI sales representative for further information. ## **XCEDE[® ] & XCEDE[® ] HD PART NUMBER MATRIX** |Module<br>Description<br>~~|~~|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Letter Designation<br>Represented in Dash Number<br>|Base<br>Module<br>| |---|---|---|---|---|---|---|---|---|---|---| |Left Polarizing<br>Guidance<br>Module<br>(See Sheet 3)<br>~~|~~[olelaialslelefojale:<br>~~|~~|J<br>[olelaialslelefojale:|A<br>[olelaialslelefojale:|B<br>[olelaialslelefojale:|C<br>[olelaialslelefojale:|D<br>[olelaialslelefojale:|E<br>[olelaialslelefojale:|F<br>[olelaialslelefojale:|G<br>[olelaialslelefojale:|H<br>[olelaialslelefojale:|[olelaialslelefojale:<br>| ||No<br>Key<br>B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|B<br>A<br>H<br>D<br>E<br>F<br>[olelaialslelefojale:<br>|| |Left Polarizing<br>Guidance<br>Module<br>(See Sheet 4)<br>~~|~~<br>~~|~~olelala|sfelejolalé|Y<br><br>olelala|sfelejolalé|P<br><br>olelala|sfelejolalé|Q<br><br>olelala|sfelejolalé|R<br><br>olelala|sfelejolalé|S<br><br>olelala|sfelejolalé|T<br><br>olelala|sfelejolalé|U<br><br>olelala|sfelejolalé|V<br><br>olelala|sfelejolalé|W<br><br>olelala|sfelejolalé|olelala|sfelejolalé| ||No<br>Key<br>B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|B<br>A<br>H<br>D<br>E<br>F<br><br>olelala|sfelejolalé|| |Open Module<br>(Two Wall)<br>(See Sheet 2)<br>~~|~~<br>~~oo~~<br>~~pf~~|0 (ZERO)<br><br>~~oo~~<br>~~pf~~|||||||||~~oo~~<br>| |Left Wall<br>Module<br>(See Sheet 5)<br>~~oo~~<br>~~pf~~|L<br>~~oo~~<br>~~pfGS~~|||||||||~~oo~~<br>~~GS~~| |Right Wall<br>Module<br>(See Sheet 6)<br>~~pf~~<br>~~ee~~<br>~~J~~|M<br>~~pfGS~~<br>~~ee~~<br>|||||||||~~GS~~<br>~~ee~~<br>| |Four Wall<br>Module<br>(See Sheet 7)<br>~~J|S~~|1<br>~~|S~~|||||||||~~|S~~| For more information, please contact: Communications@fci.com or visit us at **www.fci.com** **Disclaimer** Please note that the above information is subject to change without notice. **XCEDE[®] BACKPLANE CONNECTOR SYSTEM** **==> picture [316 x 590] intentionally omitted <==** **----- Start of picture text -----**<br> ||||||||| |---|---|---|---|---|---|---|---| |XCEDE|[® ]|HD Vertical Header| |aee|Col Designator|Number of Columns|es|Differential pairs per column|Part Number| |X0J|4|3|10119126| |a|ee|ee| |X0C|6|3|10119128| |a ee| |X0E|8|3|10120124| |ee|ee|ee|ee| |a|X0J|4|4|10120126| |X0C|6|4|10120128| |a| |X0E|8|4|10115091| |a|ee|ee|ee| |a|X0J|4|ee|6|ee|10120130| |X0C|6|6|10119130| |a|eeee|ee|ee| |X0E|8|6|10120132| |a|ee|ee| |XCEDE|[® ]|Right Angle Receptacle| |aee|Col Designator|Number of Columns|es|Differential pairs per column|Part Number| |-|4|4|10091844| |a|ee|ee| |-|6|4|10091799| |a ee| |-|8|4|10091812| |es|ee|ee|ee| |-|4|6|10105004| |a|ee|ee| |-|6|6|10105007| |a|ee|ee|ee| |-|8|6|10105010| |a|ee| |XCEDE|[® ]|HD Vertical Header| |aee|Col Designator|Number of Columns|es|Differential pairs per column|Part Number| |X0J|4|2|10114868| |a|es|ee|ee| |X0C|6|2|10113947| |a|ee|ee| |X0E|8|2|10113949| |ee|ee|ee| |X0J|4|3|10119187| |a|ee|ee| |X0C|6|3|10119189| |a|ee|ee| |X0E|8|3|10119191| |a|ee| |X0J|4|4|10091836| |a|ee|ee| |X0C|6|4|10091767| |a| |X0E|8|4|10091777| |a| |a|X0J|4|ee|6|ee|10114508|ee| |X0C|6|6|10104997| |a|ee|ee| |X0E|8|6|10104999| |a eeee|ee|ee| **----- End of picture text -----**<br> For more information, please contact: Communications@fci.com or visit us at **www.fci.com** **Disclaimer** Please note that the above information is subject to change without notice.
Updated at February 9, 2023
Amphenol Communications Solutions, formerly known as Amphenol ICC, is a globally recognized leader in the design and manufacture of high-quality interconnect solutions. With a proven reputation for engineering excellence, the company provides essential components that keep systems connected across a wide range of demanding markets, bridging the gap between traditional commercial hardware and next-generation technical innovations. Our extensive portfolio of Amphenol Communications Solutions focuses heavily on their industry-leading backplane connectors. Engineered to support high-speed data transfer and robust board-to-board networking, these backplane interconnects are critical for advanced telecommunications, data storage, and high-performance computing systems where signal integrity and long-term reliability are paramount. Complementing their advanced backplane technology, the company also produces a precision-engineered selection of terminal blocks and accessories. This includes versatile pluggable terminal blocks, dedicated headers and sockets, and secure wire-to-board solutions, giving design engineers highly dependable options for power routing and signal distribution in complex commercial and industrial applications.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 540,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →