10028916-4554P00LF
CONN, BACKPLANE, RCPT, 4POS, 2ROW, 6MM
- Manufacturer: AMPHENOL COMMUNICATIONS SOLUTIONS
- Product type:
- Product Range:AirMax Series; No. of Contacts:4Contacts; Pitch Spacing:6mm; Gender:Receptacle; Contact Termination Type:Press Fit; No. of Rows:2Rows; Row Pitch:- 82R6864
- No. of Rows: 2Rows
- No. of Contacts: 4Contacts
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 10.38 € |
| Current stock | 1000+ |
| Lead time | 30 days |
**BACKPLANE CONNECTORS** ## **ZIPLINE VS[®] BACKPLANE/MIDPLANE CONNECTORS** ## **OVERVIEW** The ZipLine[®] connector system addresses customer demand for maximum signal density – a paramount requirement for future equipment platforms – at data rates up to 12.5Gb/s. The initial ZipLine[®] signal modules with 1.8mm column pitch support backplane and orthogonal midplane applications. A module with 72 differential pairs provides the maximum density available by delivering 84.6 differential pairs per inch of card edge. Allowing a minimum 1-inch card slot pitch, the compact module dimensions help system designers address mechanical and thermal concerns. ZipLine[®] connectors can also be configured on 1.5mm column pitch to provide more than 100 signal pairs per inch of card edge for even more backplane signal density. ## **FEATURES & BENEFITS** - Modules with 6 differential pairs/column provide maximum linear signal density along card edge: 84.6 differential pairs per inch - An optional power wafer with up to 36A capacity can be integrated within a 6-pair module - Stainless steel organizer allows use of flat-rock tooling for connector installation - Halogen-free signal modules aid efforts to minimize the use of environmentally sensitive materials - Available power and guide modules complement signal connector offering ## **TARGET MARKETS / APPLICATIONS** - Communications - Routers - Switches - Networking - Access - Transport - Data - Servers - Storage Systems - Industrial - Medical - Test & Measurement **ZIPLINE VS[®] BACKPLANE/MIDPLANE CONNECTORS** ## **ZIPLINE[®] SIGNAL MODULES WITH VERTICAL HEADER** ## **TYPICAL APPLICATIONS & SIGNAL DENSITY** |Minimum<br>Card Slot<br>Spacing<br>(mm)<br>Column<br>pitch<br>(mm)<br>Differential Pairs<br>Contacts<br>Product<br>Family<br>per<br>column<br>Linear Density<br>per<br>column<br>Linear Density<br>per<br>inch<br>per<br>cm<br>per<br>inch<br>per<br>cm<br>27<br>1.8<br>6<br>84.6<br>33.3<br>18<br>254.0<br>100<br>ZipLine<br>27<br>2.0<br>5<br>63.5<br>25.0<br>15<br>190.5<br>75<br>AirMax VS<br>27<br>3.0<br>5<br>42.3<br>16.7<br>15<br>127.0<br>50<br>AirMax VS<br>23<br>2.0<br>4<br>50.8<br>20.0<br>12<br>152.4<br>60<br>AirMax VS<br>Card slot<br>12.5 mm (Card to Backplane)| |---| |23<br>3.0<br>4<br>33.9<br>13.3<br>12<br>101.6<br>40<br>AirMax VS<br>19<br>2.0<br>3<br>38.1<br>15.0<br>9<br>114.3<br>45<br>AirMax VS<br>**ZIPLINE® SIGNAL MODULES WITH VERTICAL HEADER**<br>~~tw~~| ## **ZIPLINE[®] SIGNAL MODULES WITH VERTICAL HEADER** Differential Pairs Module Signal Module Part Numbers Width Minimum Along Differential Card Slot Number Column Card Backplane/Midplane Daughter Card Impedance Spacing Per Total Of Pitch Header Edge (ohms) (mm) Total Column Contacts Columns (mm) Type (mm) Vertical Receptacle Right-Angle Header 100 27 96 6 288 16 1.8 2-wall 28.8 10084186-101LF 10084155-101LF 100 27 72 6 216 12 1.8 2-wall 21.6 10076197-101LF 10076209-101LF ~~==~~ 100 27 72 6 216 12 1.8 4-wall 21.6 10080638-101LF 10076209-101LF 100 27 66 6 198 11 1.8 2-wall 21.6 10084166-101LF 10084164-101LF 100 27 60 6 180 10 1.8 2-wall 21.6 10084166-103LF 10084164-102LF 100 23 36 6 108 6 3.6 2-wall 21.6 10078557-101LF 10078550-101LF Note: The Total Contacts and Number of Columns shown represent signal contacts. The ZipLine module with 66 differential pairs also includes an additional column containing a power wafer. The ZipLine module with 60 differential pairs also includes two power wafers. **Disclaimer** For more information, please contact: Communications@fci.com or visit us at **www.fci.com** Please note that the above information is subject to change without notice.
Updated at June 7, 2026
Amphenol Communications Solutions, formerly known as Amphenol ICC, is a globally recognized leader in the design and manufacture of high-quality interconnect solutions. With a proven reputation for engineering excellence, the company provides essential components that keep systems connected across a wide range of demanding markets, bridging the gap between traditional commercial hardware and next-generation technical innovations. Our extensive portfolio of Amphenol Communications Solutions focuses heavily on their industry-leading backplane connectors. Engineered to support high-speed data transfer and robust board-to-board networking, these backplane interconnects are critical for advanced telecommunications, data storage, and high-performance computing systems where signal integrity and long-term reliability are paramount. Complementing their advanced backplane technology, the company also produces a precision-engineered selection of terminal blocks and accessories. This includes versatile pluggable terminal blocks, dedicated headers and sockets, and secure wire-to-board solutions, giving design engineers highly dependable options for power routing and signal distribution in complex commercial and industrial applications.
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