036-41A1-0BV
Connector, HD Express Series, 32 Contacts, Header, Press Fit, 4 Rows
- Manufacturer: AMPHENOL COMMUNICATIONS SOLUTIONS
- Product type:
- SVHC: No SVHC (25-Jun-2025)
- Gender: Header
- Row Pitch: 2mm
- No. of Rows: 4Rows
- Pitch Spacing: -
- Product Range: HD Express Series
- Contact Plating: Gold Flash over Palladium Nickel Plated Contacts
- No. of Contacts: 32Contacts
- Contact Material: Copper Alloy
- Contact Termination Type: Press Fit
| Delivery and price | |
|---|---|
| Units per pack | 342 |
| Price | 6.66 € |
| Current stock | 10+ |
| Lead time | 30 days |
High Speed Amphenol Backplane Products ## HD Express® ## PCle® GEN 6 BACIKPLANE INTERCONNECT SYSTEM The HD Express® is a high ~~-d~~ ensity, hig ~~h-~~ performance interconnect system designed to meet and exceed PCle® Gen 6 electrical and mechanical requirements for high ~~-~~ end 85 Q architectures. ## = PCle® Gen 6 - = Price and performance scalability - == ModularHighest density construction with integrated guidance **==> picture [63 x 142] intentionally omitted <==** **----- Start of picture text -----**<br> Vig:<br>m4 oy<br>eee je<br>as i<br>=<br>i<br>ease<br>Ww‘wash =<<br>**----- End of picture text -----**<br> = 85 O impedance TARGET MARKETS ## FEATURES ## BENEFITS - = 85 85 © impedance . Ground structure on Ground structure on structure on on all 4 sides 4 sides sides of the mating beams of mating beams of beams of of each differential pair - = Highest density density = Scalable Scalable design = 13.8 13.8 mil drill compliant compliant pin = 85 85 © impedance = Specifically designed to support PCle® Gen6 links . Ground structure on Ground structure on structure on on all 4 sides 4 sides sides of the mating beams of mating beams of beams of of =| Provides high signal isolation performance each differential pair = Highest density density = Highest density backplane product in the market = Scalable Scalable design = Single Wafer design utilizing traditional design elements = 13.8 13.8 mil drill compliant compliant pin = Proven press ~~-f~~ it technology » Beam on blade . Provides a complete solution for customer’s unique requirements = Press ~~-f~~ it = For additional margin and overall system cost savings = Die ~~-~~ cast guide module = Robust guidance features integrated into the connector design www.amphenol ~~-c~~ s.com HD Express® ## MATERIAL « Contact Finish Area: Gold = Contact Base Metal: Highgh perfperformance Copperaod Allo = Housings: Glass Reinforced Polyester (LCP) ## APPROVALS AND CERTIFICATIONS = UL 94 V ~~-~~ 0 (pending approval) ## PACKAGING = PVC Trays (ESD) ## ELECTRICAL PERFORMANCE ENVIRONMENTAL - = Rated Signal Contact Current Rating: 0.7A - » Rated Voltage <30 V AC (RMS) - = Dielectric Withstanding Voltage: 500 V AC (RMS) - « Contact Resistance Change: 10 mQ max. ## MECHANICAL PERFORMANCE - = Wiping Length: 1.0 mm - « Gathering Ability: 1.0 mm X and 1.7 mmY « Operating Temperature Range: ~~-~~ 40 °C to 85 °C ## SPECIFICATIONS = TB-2381 General Product Specification for HD Express® Product Family TARGET MARKETS/APPLICATIONS mm Servers Storage Cll Supercomputers - = Durability: 200 Mating Cycles ## Description | Part Numbers Find part number details using the search box on ~~www.amphenol-cs.com~~ **==> picture [212 x 89] intentionally omitted <==** **----- Start of picture text -----**<br> Explore the Product Details Online<br>Scan to learn more ><br>WwWWw ° amM p h e n 6) [- C S ° C 0) m<br>**----- End of picture text -----**<br> **==> picture [60 x 52] intentionally omitted <==** **----- Start of picture text -----**<br> OP atases Ao<br>eM Ee<br>aeek na<br>**----- End of picture text -----**<br> **==> picture [5 x 52] intentionally omitted <==** **----- Start of picture text -----**<br> =<br>5<br>:<br>**----- End of picture text -----**<br> DisclaimerPleasePlease note that the above information DisclaimerPleasePlease note that the above information is subject to change without notice.
Updated at June 7, 2026
Amphenol Communications Solutions, formerly known as Amphenol ICC, is a globally recognized leader in the design and manufacture of high-quality interconnect solutions. With a proven reputation for engineering excellence, the company provides essential components that keep systems connected across a wide range of demanding markets, bridging the gap between traditional commercial hardware and next-generation technical innovations. Our extensive portfolio of Amphenol Communications Solutions focuses heavily on their industry-leading backplane connectors. Engineered to support high-speed data transfer and robust board-to-board networking, these backplane interconnects are critical for advanced telecommunications, data storage, and high-performance computing systems where signal integrity and long-term reliability are paramount. Complementing their advanced backplane technology, the company also produces a precision-engineered selection of terminal blocks and accessories. This includes versatile pluggable terminal blocks, dedicated headers and sockets, and secure wire-to-board solutions, giving design engineers highly dependable options for power routing and signal distribution in complex commercial and industrial applications.
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