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Technical articles, selection guides and industry insights about electronic components, sourcing and PCB design.

Thermal Management Design Guide: Heatsinks, Junction Temperature and Thermal Paste

Every watt of power dissipated in a semiconductor must leave the die, cross the package, pass through a thermal interface material and exit through a heatsink to ambient air. Get any link in that chain wrong and the junction temperature exceeds the maximum rating. The component does not fail immediately. It degrades over weeks or months until the …

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